JPS6326449B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a magnetic head in which a recording/reproducing gap and an erasing gap are integrally provided. The integrated recording/reproducing/erasing magnetic head used in a recording/reproducing method in which a plurality of tracks are arranged on concentric circles of a magnetic sheet to record and reproduce video signals, etc., is shown in Fig. 1 (a) and (a).
As shown in FIG. 2, a recording/reproducing gap 1 and an erasing gap 2 are provided integrally. When erasing a plurality of tracks 3 recorded with this type of magnetic head, as shown in FIG. The track width of 2 is usually 10
It is necessary to make the gap approximately 20μ wider and to make the centers of the tracks of both gears 1 and 2 the same. On the other hand, as shown in FIG. 3, in the conventional manufacturing method of this type of integrated recording/reproducing/erasing head, upper and lower wafers 4 and 5, each of which is mirror-finished on one side, are separately provided with track width defining grooves 6 and 7, which are orthogonal to the grooves 6 and 7. A winding groove 8 and a bonding material filling groove 9 were provided, and a wafer 10 without groove processing was welded with glass or the like with the wafer 10 interposed therebetween. However, in this manufacturing method, since the track width defining grooves 6 and 7 are formed separately for the upper and lower wafers 4 and 5, it is very difficult to align the centers of the recording/reproducing track and the erasing track, which makes it difficult to improve mass production. It had the disadvantage of being short-lived. The present invention has been made in order to solve these drawbacks, and provides a magnetic head suitable for mass production, which allows the centers of recording/reproducing tracks and erasing tracks to be easily aligned and allows simultaneous processing of track widths of different dimensions. The present invention provides a method for manufacturing. An embodiment of the present invention will be described below with reference to the drawings. First, as shown in Figure 4 A, B, and C, one side of the first wafer 1 is mirror-finished and will later become the recording/playback gap 1 side.
1. Three wafers, a second wafer 12 which is thinner than the first wafer and will later become the side of the erase gap 2, and a third wafer 13 which is interposed between the first and second wafers 11 and 12 after mirror finishing on both sides. The first of the wafers,
The second wafers 11 and 12 are brought together by bonding the other end surfaces with an adhesive so that one end surfaces 11a and 12a are flush with each other. In this state, a predetermined level difference occurs on the upper surfaces of the first and second wafers 11 and 12 . Then, use a processing blade of a predetermined shape to
As shown in the figure, track width defining grooves 6 and 7 are continuously machined so as to be parallel to one end surfaces 11a and 12a of the first and second wafers 11 and 12 . By doing this, the first wafer 11 and the second wafer 1
The centers of the two track width portions are aligned on the same line, forming grooves of different widths. At this time, so that the track widths of recording/reproducing gap 1 and erasing gap 2 will be different lengths later,
The difference in level caused by the difference in thickness between the wafers 11 and 12 and the shape of the processing blade are set in advance. Next, the adhesion between both wafers 11 and 12 is released, and the winding groove 8 is cut perpendicularly to the track width defining grooves 6 and 7.
After processing the bonding material filling groove 9, as shown in FIG .
Through the wafer 13, the surfaces 11a and 12a are brought together vertically so that they are flush with each other, glass is welded, and sliced as shown by the dotted line in FIG. 7.
The head chip 14 as shown in FIG. 8 is obtained by polishing. In the above embodiment, when one end surface of the first and second wafers were abutted, the thicknesses of both wafers were made to be different so that a step was created on the upper surface. A spacer having a thickness corresponding to a predetermined level difference may be arranged on the wafer so that a level difference occurs on the upper surfaces of both wafers. Further, as shown in FIG. 9, the machining blade can be shaped to have a plurality of machining portions corresponding to the pitches of the track width defining grooves, thereby machining a plurality of grooves at the same time. As described above, according to the present invention, when machining the track width defining grooves on both the upper and lower wafers, one end surface of both wafers is abutted and machined continuously so that a step is created on the upper surface. The center of the width portion can be easily aligned, and track width defining grooves of different widths can be processed simultaneously with the same processing blade. Furthermore, by using a machining blade having a shape that has a plurality of machining parts to match the pitch of the track width defining grooves, it is possible to simultaneously machine a plurality of track width defining grooves.
It is possible to greatly reduce the number of work processes and improve mass productivity.

[Brief explanation of the drawing]

1A and 1B are a side view and a top view, respectively, of a conventional recording/reproducing/erasing integrated magnetic head, FIG. 2 is an explanatory diagram of a recording track, and FIG. 3 is a perspective view showing a conventional magnetic head manufacturing method. , Figure 4 A, B, C, 5th
6, 7, and 8 are perspective views showing the manufacturing process of the magnetic head of the present invention, respectively, and FIG. 9 is a sectional view of the processing blade used in the present invention. Explanation of main drawing numbers, 1...Recording/playback gap, 2...
Erasing gap, 11 , 12 , 13...first, second, third wafer, 6,7...track width defining groove,
14...Processing blade.

Claims (1)

[Claims] 1. Machining winding grooves, bonding material filling grooves, and different track width defining grooves on the first and second wafers, respectively;
The first and second wafers are butted together through a third wafer and a predetermined gap spacer in the middle to perform glass welding, and then predetermined slicing is performed to form two front gaps with different track widths. In the manufacturing method, when processing the track width defining groove, one end surface of each of the first and second wafers is flush with the other end surface, and a predetermined step is formed between the processed surfaces of both wafers. A method of manufacturing a magnetic head, characterized in that after the other orthogonal end surfaces are abutted, the track width defining groove is formed parallel to the one end surface. 2. The method of manufacturing a magnetic head according to claim 1, wherein the predetermined step is created by making the first and second wafers have different thicknesses. 3. Manufacturing the magnetic head according to claim 1, wherein the predetermined step is created by making the first and second wafers have the same thickness and placing a spacer on the lower surface of one of the wafers. Method.