JPS63264311A - Phenol aralkyl resin composition for injection molding - Google Patents
Phenol aralkyl resin composition for injection moldingInfo
- Publication number
- JPS63264311A JPS63264311A JP9742387A JP9742387A JPS63264311A JP S63264311 A JPS63264311 A JP S63264311A JP 9742387 A JP9742387 A JP 9742387A JP 9742387 A JP9742387 A JP 9742387A JP S63264311 A JPS63264311 A JP S63264311A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- injection
- molding
- phenol aralkyl
- injection molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001746 injection moulding Methods 0.000 title claims abstract description 18
- 239000011342 resin composition Substances 0.000 title claims abstract description 14
- 238000002347 injection Methods 0.000 claims abstract description 14
- 239000007924 injection Substances 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 239000011347 resin Substances 0.000 claims abstract description 14
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 12
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 claims abstract description 12
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000000945 filler Substances 0.000 claims abstract description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 6
- 239000004312 hexamethylene tetramine Substances 0.000 claims abstract description 4
- 235000010299 hexamethylene tetramine Nutrition 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 8
- 238000013329 compounding Methods 0.000 claims description 3
- 239000012778 molding material Substances 0.000 abstract description 20
- 238000000465 moulding Methods 0.000 abstract description 11
- 239000003795 chemical substances by application Substances 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 7
- 239000000203 mixture Substances 0.000 abstract description 6
- 150000001875 compounds Chemical class 0.000 abstract 1
- 229960004011 methenamine Drugs 0.000 abstract 1
- 238000007493 shaping process Methods 0.000 abstract 1
- 239000005011 phenolic resin Substances 0.000 description 10
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 9
- 229920001568 phenolic resin Polymers 0.000 description 9
- 230000000694 effects Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 235000013312 flour Nutrition 0.000 description 2
- -1 p-xylylene dialkyl ethers Chemical class 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- 235000010893 Bischofia javanica Nutrition 0.000 description 1
- 240000005220 Bischofia javanica Species 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 208000015943 Coeliac disease Diseases 0.000 description 1
- 240000002853 Nelumbo nucifera Species 0.000 description 1
- 235000006508 Nelumbo nucifera Nutrition 0.000 description 1
- 235000006510 Nelumbo pentapetala Nutrition 0.000 description 1
- 239000004113 Sepiolite Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 229920002978 Vinylon Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000004677 hydrates Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910017053 inorganic salt Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- URLKBWYHVLBVBO-UHFFFAOYSA-N p-dimethylbenzene Natural products CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 1
- NRNFFDZCBYOZJY-UHFFFAOYSA-N p-quinodimethane Chemical group C=C1C=CC(=C)C=C1 NRNFFDZCBYOZJY-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052624 sepiolite Inorganic materials 0.000 description 1
- 235000019355 sepiolite Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000013024 troubleshooting Methods 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は低圧成形性に冨む射出成形用フェノールアラル
キル樹脂組成物に関する。更に詳しくは、流動性および
熱安定性に優れ、熱時硬化性の良好なフェノールアラル
キル樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a phenolic aralkyl resin composition for injection molding that has excellent low-pressure moldability. More specifically, the present invention relates to a phenol aralkyl resin composition that has excellent fluidity and thermal stability, and has good heat curability.
−Sに熱硬化性樹脂の射出成形においては、十分な熱時
流動性とシリングー内で硬化することのない熱安定性を
有し、かつ金型内での賦形後は速やかに硬化するような
相反すると考えられる特性をもつ材料が望まれており、
これまで多くの提案がなされてきた。- In the injection molding of thermosetting resins, S has sufficient fluidity when heated and thermal stability that does not harden in the mold, and it hardens quickly after being shaped in the mold. Materials with properties that are considered to be contradictory are desired;
Many proposals have been made so far.
フェノールアラルキル樹脂に直接係わる提案はないがフ
ェノール樹脂成形材料においても、熱時流動性、熱安定
性を改善するため、可塑側を使用したり、硬化剤や硬化
促進剤を制御するなどの手段が提案されたが、成形材料
中の蓮発分が多くなり、成形品の諸物性および外観を損
ない、金型内での充分な硬化速度が得られないという欠
点があった。また、これらの欠点に鑑みなされた提案と
して、例えば、特開昭54−18861号に無機塩類水
和物を使用し、その分解による水の発生の温度依存性を
利用した方法が、また、特開昭53−137294号に
は、通常のフェノール樹脂成形材料に流動性付与剤、フ
ェノール系樹脂、硬化剤の2種以上を後添加する方法が
開示されているが、いずれも効果不充分で実用化には至
っていない。Although there are no proposals directly related to phenolic aralkyl resins, measures such as using plasticizers or controlling curing agents and curing accelerators are available to improve hot fluidity and thermal stability of phenolic resin molding materials. However, the problem was that the lotus fraction in the molding material increased, impairing the physical properties and appearance of the molded product, and that a sufficient curing speed in the mold could not be obtained. In addition, as a proposal made in view of these shortcomings, for example, Japanese Patent Application Laid-open No. 18861/1983 proposes a method that uses inorganic salt hydrates and utilizes the temperature dependence of water generation due to their decomposition. 1983-137294 discloses a method of post-adding two or more of a fluidity imparting agent, a phenolic resin, and a curing agent to a normal phenolic resin molding material, but all of these methods are insufficiently effective and are not practical. It has not yet become a reality.
一般に、フェノール系樹脂の射出成形はシリンダ一温度
95〜100℃、金型温度160℃前後で行われる。シ
リンダー内ではスクリューによる混練のため、材料は部
分的に前記設定温度より高目の温度となる。したがって
材料には、100℃前後、すなわち90〜100℃くら
いでは硬化反応が抑制され、かつ、160℃前後では硬
化反応を阻害しないような特性が要求される。このよう
な点において従来の提案はいずれも効果が不充分であっ
た。Generally, injection molding of phenolic resin is performed at a cylinder temperature of 95 to 100°C and a mold temperature of around 160°C. In the cylinder, the material is kneaded by a screw, so the temperature of the material is partially higher than the set temperature. Therefore, the material is required to have characteristics such that the curing reaction is suppressed at around 100°C, that is, about 90 to 100°C, and that the curing reaction is not inhibited at around 160°C. All of the conventional proposals have been insufficiently effective in this respect.
フェノールアラルキル樹脂、ヘキサメチレンテトラミン
、充填材および配合剤からなる通常の成形材料の原料に
フルフラールおよびスチレンのいずれか1種以上を添加
してなる樹脂組成物により、熱時流動性および熱安定性
を改善し、かつ、金型内での賦形後の硬化性を損なわな
い成形材料を得ることができる。すなわち、本発明にか
かわる樹脂組成物は、従来この種の組成物の評価には通
用されることのなかった前部および後部のシリンダ一温
度95℃、および従来の低圧成形性材料の提案でも適用
されることの鬼かった射出圧力410Kg/dに設定さ
れた、径4.5mmの標準ノズルを持つ型締圧45to
nの熱硬化性樹脂用射出成形機と160℃に設定された
キャビティ容量42cdの金型を用いて、金型充填時間
を測定したとき、シリンダー内温゛留時間が4分を越え
ても金型充填時間が15秒以下、すなわち、射出成形可
能であるという特徴を有する。また、この組成物は参考
例に示すように160℃前後の高温域での硬化性は従来
の材料と同等あるいはそれ以上である。A resin composition made by adding one or more of furfural and styrene to the raw materials of a normal molding material consisting of a phenol aralkyl resin, hexamethylenetetramine, a filler, and a compounding agent can improve fluidity and thermal stability at high temperatures. It is possible to obtain a molding material that is improved and does not impair curability after being shaped in a mold. In other words, the resin composition according to the present invention can be applied at a temperature of 95° C. at the front and rear cylinders, which has not been used in the evaluation of this type of composition, and at the proposed conventional low-pressure moldable material. Mold clamping pressure of 45 to with a standard nozzle of diameter 4.5 mm, set to an injection pressure of 410 kg/d, which is unprecedented
When measuring the mold filling time using an injection molding machine for thermosetting resins and a mold with a cavity capacity of 42 cd set at 160°C, it was found that even if the cylinder temperature residence time exceeded 4 minutes, the mold was not filled. It has a feature that the mold filling time is 15 seconds or less, that is, injection molding is possible. Further, as shown in the reference example, this composition has a hardenability in a high temperature range of around 160° C. that is equal to or higher than that of conventional materials.
本発明に用いるフェノールアラルキル樹脂は、フェノー
ル類とα、α9−ジクロローp−キシレンなどのP−キ
シリレンシバライド、α、α゛−ジメトキシーp−キシ
レンなどのp−キシリレンジアルキルエーテルなどから
誘導される樹脂である。The phenol aralkyl resin used in the present invention is derived from phenols and p-xylylene civalides such as α, α9-dichloro p-xylene, p-xylylene dialkyl ethers such as α, α゛-dimethoxy p-xylene, etc. It is a resin that
なお、本発明においてフェノールアラルキル樹脂の一部
をフェノール類およびアルデヒド類から誘導されるフェ
ノール樹脂で置き換えて実施することもできる。In addition, in the present invention, a part of the phenol aralkyl resin can be replaced with a phenol resin derived from phenols and aldehydes.
本発明に用いる充填剤としては、木粉、タルク、シリカ
、クレー、ウオラストナイト、セピオライト、炭酸カル
シウム、酸化マグネシウム、チタン酸カリウム、ガラス
繊維、ビニロン繊維、アラミド繊維、炭素繊維、黒鉛、
カーボンブランクなどの通常のフェノール系樹脂成形材
料に用いられているものを用いることができる。Fillers used in the present invention include wood flour, talc, silica, clay, wollastonite, sepiolite, calcium carbonate, magnesium oxide, potassium titanate, glass fiber, vinylon fiber, aramid fiber, carbon fiber, graphite,
Those used in ordinary phenolic resin molding materials such as carbon blanks can be used.
本発明に用いる配合剤としては、顔料、滑剤、導電性付
与剤、酸化防止剤、硬化促進剤、エポキシ樹脂などの合
成樹脂、シランカップリング剤など通常のフェノール系
樹脂成形材料に用いられるものを用いることができる。The compounding agents used in the present invention include pigments, lubricants, conductivity imparting agents, antioxidants, curing accelerators, synthetic resins such as epoxy resins, and silane coupling agents, which are commonly used in phenolic resin molding materials. Can be used.
本発明においてへキサメチレンテトラミンの使用割合は
、フェノールアラルキル樹脂100重量部に対して、6
〜15重量部であり、好ましくは8〜12重量部である
。In the present invention, the usage ratio of hexamethylenetetramine is 6 parts by weight based on 100 parts by weight of the phenol aralkyl resin.
~15 parts by weight, preferably 8 to 12 parts by weight.
本発明においてフルフラールおよびスチレンの使用割合
は、フェノールアラルキル樹脂100重量部に対して1
−15重量部であり、好ましくは2〜1011部である
。1重量部未満では流動性の改善の効果が乏しく、15
重量部を越えると成形品の物性および外観を損ない好ま
しくない。In the present invention, the proportion of furfural and styrene used is 1 part by weight per 100 parts by weight of the phenol aralkyl resin.
-15 parts by weight, preferably 2 to 1011 parts. If it is less than 1 part by weight, the effect of improving fluidity is poor;
If the amount exceeds 1 part by weight, the physical properties and appearance of the molded article will be impaired, which is undesirable.
本発明の樹脂組成物は、ロール、ニーダ−などで混練し
パワーミルなどで粉砕する通常の方法により成形材料と
することができる。The resin composition of the present invention can be made into a molding material by the usual method of kneading with a roll, kneader, etc., and pulverizing with a power mill, etc.
(実施例〕
実施例1〜4
フェノールアラルキル樹脂(三井東圧化学■製ミレック
スXL−225)およびノボラック樹脂(三井東圧化学
側製ノボランク100OHs)を用いて、表−1に示す
組成の射出成形用熱硬化性樹脂組成物を得た。これらの
樹脂組成物を14インチロールを用いて前ロールを90
〜100℃、後ロールを充填材が主に無機質からなる場
合は、約60℃、充填材が木粉を主体とする場合は約1
30℃とし、約2分間混練した。得られた混練シートを
冷却後6m11スクリーンを装着したパワーミルにより
粉砕し成形材料とした。(Example) Examples 1 to 4 Injection molding with the composition shown in Table 1 using phenol aralkyl resin (Milex XL-225 manufactured by Mitsui Toatsu Chemical Co., Ltd.) and novolac resin (Novolank 100OHs manufactured by Mitsui Toatsu Chemical Co., Ltd.) Thermosetting resin compositions were obtained. These resin compositions were rolled using a 14-inch roll with a front roll of 90
~100℃, if the filler is mainly inorganic, about 60℃, if the filler is mainly wood flour, about 1
The mixture was kneaded at 30° C. for about 2 minutes. The obtained kneaded sheet was cooled and then ground into a molding material using a power mill equipped with a 6m11 screen.
これらの成形材料について、径4゜5++uwの標準ノ
ズルを装備した東芝機械■製lR45P射出成形機を用
いて、前部および後部のシリンダ一温度を95℃、射出
圧力を410Kg/cJに設定し、金型の温度を166
℃として、金型充填時間が15秒に達するシリンダー内
滞留時間を求めた。金型はキャビティ容量42cjの曲
げ強さ、シャルピー衝撃強さおよび吸水率用のJISフ
ァミリーモールドである。結果を表=1に示す。For these molding materials, using a Toshiba Machine ■ lR45P injection molding machine equipped with a standard nozzle with a diameter of 4°5++ uw, the front and rear cylinder temperatures were set at 95°C and the injection pressure was set at 410 kg/cJ. Mold temperature 166
The residence time in the cylinder at which the mold filling time reached 15 seconds was determined as °C. The mold is a JIS family mold for bending strength, Charpy impact strength and water absorption with a cavity capacity of 42cj. The results are shown in Table 1.
比較例1〜4
実施例1〜4に準じ、フルフラールおよびスチレンを用
いない他は実施例と同様にして成形材料を得た。熱安定
性の指標である金型充填時間の測定を試みたが、射出圧
力が低すぎて、射出が困難となり評価に足るデーターを
得るに至らなかった。Comparative Examples 1 to 4 Molding materials were obtained in the same manner as in Examples 1 to 4, except that furfural and styrene were not used. An attempt was made to measure the mold filling time, which is an indicator of thermal stability, but the injection pressure was too low, making injection difficult and it was not possible to obtain data sufficient for evaluation.
比較例5
低圧射出成形材料として市販されているフェノール樹脂
成形材料(住友ベークライト■製Pト0001)を用い
て実施例と同様にして金型充填時間を測定した。結果を
表−1に併記する。Comparative Example 5 Using a commercially available phenolic resin molding material (P0001 manufactured by Sumitomo Bakelite ■) as a low-pressure injection molding material, the mold filling time was measured in the same manner as in the example. The results are also listed in Table-1.
参考例
実施例1および4について高化式フローテスターにより
160℃における硬化性を調べた。測定条件は、荷重3
00Kg、ノズル 11wl1ΦX 10+*mであっ
た。比較として比較例1の成形材料およびPM−000
1について硬化性を調べた。結果を図−1に示す。Reference Example Examples 1 and 4 were examined for their curability at 160°C using a Koka type flow tester. The measurement conditions are load 3
00Kg, nozzle 11wl1ΦX 10+*m. For comparison, the molding material of Comparative Example 1 and PM-000
The curability of No. 1 was investigated. The results are shown in Figure 1.
なお、実施例について、410Kg/cm3の低圧射出
成形により得られた成形品の物性を表−1に併記す°る
。Regarding the examples, the physical properties of molded products obtained by low-pressure injection molding at 410 kg/cm3 are also listed in Table 1.
本発明の樹脂組成物を用い得られる射出成形用材料は低
圧成形性に冨み、必要であれば、従来、当該分野では実
施不可能であった200Kg/aJあるいはそれ以下の
射出圧力でも成形可能であり、射出圧力を下げることに
より、例えば、金型投影面積の拡大、射出容量の増大、
射出エネルギーの低減、成形品残留応力の低減、金型ゲ
ート断面積の低減、フィルムゲート、ピンポイントゲー
トの採用、ランナー、スプルーの小型化などが可能とな
る。The injection molding material obtained using the resin composition of the present invention has excellent low-pressure moldability, and if necessary, can be molded at an injection pressure of 200 Kg/aJ or lower, which was previously impossible in this field. By lowering the injection pressure, for example, the projected area of the mold can be expanded, the injection capacity can be increased,
This makes it possible to reduce injection energy, reduce molded product residual stress, reduce the cross-sectional area of the mold gate, use film gates and pinpoint gates, and downsize runners and sprues.
また、優れた熱安定性を生かして、成形方法の工夫が可
能となり、例えば、熱可塑性樹脂の射出成形に用いられ
ている成形機および成形方法の応用、いわゆるクッショ
ン成形が可能となり、パリなし成形が可能となる。また
、シリンダ一温度を高くして成形サイクルを短縮するこ
ともできるなどの多くの効果が得られる。In addition, by taking advantage of its excellent thermal stability, it is now possible to devise molding methods.For example, it has become possible to apply molding machines and molding methods used for injection molding of thermoplastic resins, so-called cushion molding, and to form molds without flashing. becomes possible. Further, many effects such as being able to shorten the molding cycle by raising the cylinder temperature can be obtained.
本発明の樹脂組成物により得られる射出成形用材料は、
従来フェノール樹脂成形材料が用いられていた分野への
応用はもちろんのこと、パリなし成形あるいは大容量成
形などにより、熱可塑性樹脂成形品の代替あるいは従来
フェノール樹脂では不可能とされていた大型成形品分野
にも汎く応用することができる。The injection molding material obtained from the resin composition of the present invention is
Not only can it be applied to fields where phenolic resin molding materials have traditionally been used, but it can also be used to replace thermoplastic resin molded products or to create large molded products that were previously considered impossible with phenolic resin, such as by molding without molding or large-capacity molding. It can be applied to a wide range of fields.
また、本発明の樹脂組成物により得られる射出成形用材
料は、低圧成形性に富む材料であるが、もちろん通常の
射出成形条件も応用することができ、例えば、高流動性
を生かした精密成形、金型充填時間の短縮による成形サ
イクルの短縮あるいは長時間シリンダー内に滞留しても
熱安定性があるので銘柄切換時あるいはトラブル時の作
業性が改善されるなど、工業的に有用な多くの効果が得
られる。In addition, although the injection molding material obtained from the resin composition of the present invention is a material with excellent low-pressure moldability, it is of course possible to apply normal injection molding conditions, such as precision molding that takes advantage of high fluidity. It has many industrially useful benefits, such as shortening the molding cycle by shortening the mold filling time, and improving workability when changing brands or troubleshooting due to its thermal stability even if it remains in the cylinder for a long time. Effects can be obtained.
4、図面の説明 図−1は予熱時間と流出量Qとの関係図である。4. Explanation of drawings FIG. 1 is a diagram showing the relationship between preheating time and outflow amount Q.
特許出願人 三井東圧化学株式会社 図−1 予熱時間1秒)Patent applicant: Mitsui Toatsu Chemical Co., Ltd. Figure-1 Preheating time 1 second)
Claims (1)
ミン、充填材および配合材に、フルフラールおよびスチ
レンのいずれか1種以上を添加してなる樹脂組成物であ
って、前部および後部のシリンダー温度が95℃および
射出圧力が410Kg/cm^2に設定された径4.5
mmの標準ノズルを持つ型締圧45tonの熱硬化性樹
脂用射出成形機および温度が160℃に設定されたキャ
ビティ容量42cm^3の金型を用いて、金型充填時間
を測定したとき、シリンダー内滞留時間が4分を越えて
も金型充填時間が15秒以下である射出成形用熱硬化性
樹脂組成物。1. A resin composition in which one or more of furfural and styrene is added to a phenol aralkyl resin, hexamethylenetetramine, a filler, and a compounding material, and the cylinder temperature at the front and rear parts is 95°C and injection Diameter 4.5 with pressure set to 410Kg/cm^2
When measuring the mold filling time using a thermosetting resin injection molding machine with a mold clamping pressure of 45 tons and a mold with a cavity capacity of 42 cm^3 and a temperature set at 160°C, the cylinder A thermosetting resin composition for injection molding whose mold filling time is 15 seconds or less even if the residence time exceeds 4 minutes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9742387A JPS63264311A (en) | 1987-04-22 | 1987-04-22 | Phenol aralkyl resin composition for injection molding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9742387A JPS63264311A (en) | 1987-04-22 | 1987-04-22 | Phenol aralkyl resin composition for injection molding |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63264311A true JPS63264311A (en) | 1988-11-01 |
Family
ID=14192021
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9742387A Pending JPS63264311A (en) | 1987-04-22 | 1987-04-22 | Phenol aralkyl resin composition for injection molding |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63264311A (en) |
-
1987
- 1987-04-22 JP JP9742387A patent/JPS63264311A/en active Pending
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