JPS63261782A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPS63261782A JPS63261782A JP9655187A JP9655187A JPS63261782A JP S63261782 A JPS63261782 A JP S63261782A JP 9655187 A JP9655187 A JP 9655187A JP 9655187 A JP9655187 A JP 9655187A JP S63261782 A JPS63261782 A JP S63261782A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- wiring board
- printed wiring
- copper powder
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 24
- 229920005989 resin Polymers 0.000 claims description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 5
- 239000003973 paint Substances 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明はエレクトロニクス機器に用いる印刷配線板の構
造に関し、特に鋼ペーストを導体として安定に焼きつけ
ることの可能な技術に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to the structure of a printed wiring board used in electronic equipment, and particularly to a technique that allows stable baking of steel paste as a conductor.
従来の技術
従来の印刷配線板として、第２図の断面図に示されるよ
うに、紙基材フェノール樹脂、ガラス布基材エポキシ樹
脂からなる基板１の面に銅箔３を被着し、選択的にエツ
チングして配線層となしたもの、あるいは銀粉−樹脂ペ
イントの印刷硬化によるアディティヴ印刷技術で形成し
たものなどがあったあが、材料コストが電線より高くな
る欠点があった。BACKGROUND OF THE INVENTION As shown in the cross-sectional view of FIG. 2, a conventional printed wiring board is manufactured by depositing a copper foil 3 on the surface of a substrate 1 made of a paper base of phenol resin and a glass cloth base of epoxy resin. There were wires that were etched to form a wiring layer, or those that were formed using additive printing technology by printing and curing silver powder-resin paint, but these had the disadvantage that the material cost was higher than that of electric wires.
発明が解決しようとする問題点
銅粉−樹脂ペイントの印刷硬化によるアディティヴ印刷
形成体は、材料的にコストダウンが期待されるが、導体
抵抗値のばらつきの大きい欠点があった。Problems to be Solved by the Invention Although additive printing formed by printing and curing copper powder-resin paint is expected to reduce costs in terms of materials, it has the drawback of large variations in conductor resistance.
銅粉−樹脂ペイントの焼きっけによる導体抵抗値のばら
つきの範囲を縮小しないと、エレクトロニクス機器の配
線用として使えない。Unless the range of variation in conductor resistance due to burnt copper powder-resin paint is reduced, it cannot be used for wiring electronic equipment.
問題点を解決するための手段
本発明は基板面の銅粉−樹脂系導体用ペインド印刷子定
部分に対してアンダーライニング樹脂層を設け、また前
記ペイントの印刷後にオーバーライニング樹脂層を形成
して、前記銅粉−樹脂系導体層が、基板および空気のい
ずれにも接触をさせないように構成されたものである。Means for Solving the Problems The present invention provides an underlining resin layer for the copper powder-resin conductor painted printing part on the substrate surface, and also forms an overlining resin layer after printing the paint. , the copper powder-resin conductor layer is configured so as not to come into contact with either the substrate or the air.
作用
本発明によると、硬化度Ｂスティンの上下各樹脂層に挟
まれた銅粉−樹脂系ペイントは、減圧。According to the present invention, the copper powder-resin paint sandwiched between the upper and lower resin layers with a hardness of B stain is depressurized.
不活性ガス雰囲気の導入をしなくても、前記樹脂の不活
性さが最高３００℃の温度まで発揮されるので、銅粉−
樹脂系抵抗体の焼きつけに悪い影響をおよぼさない。Even without introducing an inert gas atmosphere, the inertness of the resin is exhibited up to a maximum temperature of 300°C, so copper powder-
It does not have a negative effect on the burning of resin-based resistors.
実施例
第１図は本発明実施例の印刷配線板の断面図であり、以
下この図を参照して実施例を詳しく述べる。Embodiment FIG. 1 is a sectional view of a printed wiring board according to an embodiment of the present invention, and the embodiment will be described in detail below with reference to this figure.
紙基材フェノール樹脂系の積層板１に芳香族アミンアダ
クト硬化剤を配合したエポキシ樹脂のアンダーライニン
グ樹脂層２を塗布または印刷し、８０℃３０分加熱しＢ
スティンの硬化状態に至らしめる。次に銅粉−樹脂系導
体層３を２００メツシユのスクリーンを用いて印刷する
。この導体層３を７５℃４０分の加熱でＢスティンの硬
化状態に至らしめる。さらに、前記エポキシ樹脂のオー
バーライニング樹脂層塗布または印刷し、７０℃６０分
加熱し、Ｂスティンの硬化状態に至らしめる。最後に、
全体の構造物を１５５℃１２０分の空気中加熱により、
積層の各樹脂を硬化度Ｃスティンに硬化する。次表に本
実施例構体を従来例構体と比較してその特性を抵抗率で
示す。抵抗値の低さ、まとまりのよさで明らかに本実施
例のものがすぐれている。An underlining resin layer 2 of an epoxy resin containing an aromatic amine adduct curing agent was coated or printed on a paper-based phenolic resin-based laminate 1, and heated at 80°C for 30 minutes.
Bring the stain to a hardened state. Next, a copper powder-resin conductor layer 3 is printed using a 200 mesh screen. This conductor layer 3 is heated at 75° C. for 40 minutes to bring it to a hardened state of B stain. Further, an overlining resin layer of the epoxy resin is applied or printed, and heated at 70° C. for 60 minutes to reach a hardened state of B stain. lastly,
By heating the entire structure in air to 155°C for 120 minutes,
Each resin in the laminate is cured to a cure degree of C stain. The following table compares the structure of this example with the conventional structure and shows its characteristics in terms of resistivity. This example is clearly superior in terms of low resistance and good cohesiveness.
表
発明の効果
本発明によれば、銅粉−樹脂系導体層が、上下の各樹脂
層に挟まれて硬化されるから、周囲雰囲気ならびに基板
から発生のガスに影響されず、安定な導体層が実現され
る。Effects of the Invention According to the present invention, since the copper powder-resin conductor layer is hardened while being sandwiched between the upper and lower resin layers, the conductor layer is stable and unaffected by the surrounding atmosphere and gases generated from the substrate. is realized.
第１図は本発明実施例印刷配線板の断面図、第２図は従
来例の断面図である。
１・・・・・・積層板、２・・・・・・アンダーライニ
ング樹脂層、３・・・・・・銅粉−樹脂系導体層、４・
・・・・・オーバーライニング樹脂層。FIG. 1 is a sectional view of a printed wiring board according to an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional example. DESCRIPTION OF SYMBOLS 1... Laminate board, 2... Underlining resin layer, 3... Copper powder-resin conductor layer, 4...
...Overlining resin layer.
Claims (1)
樹脂層の三層を積層して硬化させた構造の印刷配線板。A first resin layer, a copper powder-resin conductor layer and a second resin layer are formed on the substrate surface.
A printed wiring board with a structure in which three resin layers are laminated and cured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9655187A JPS63261782A (en) | 1987-04-20 | 1987-04-20 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9655187A JPS63261782A (en) | 1987-04-20 | 1987-04-20 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63261782A true JPS63261782A (en) | 1988-10-28 |
Family
ID=14168215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9655187A Pending JPS63261782A (en) | 1987-04-20 | 1987-04-20 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63261782A (en) |
-
1987
- 1987-04-20 JP JP9655187A patent/JPS63261782A/en active Pending
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