JPS632579A - Heat cutting method and its device - Google Patents

Abstract

PURPOSE:To improve the working efficiency in a heat cutting by retreating the plural supporting pins provided in advance on a work table from the working position and letting no contour line of the graphic which is cut off in the prescribed dimension interfere with the said supporting pin. CONSTITUTION:The laser beam emitted from a laser oscillating device 3 is projected on the work piece W of the above of a work table 7 from a work head 5 to perform a cutting. A supporting pin 21 is retreated based on the preset graphic data for performing the cut-off the work piece W and the position data of the plural supporting pins 21 supporting the work piece W. This operation is performed by the composition of the graphic data inputting means as the processing part, piling part, cross point arithmetic part and supporting pin driving part, retreating the supporting pin 21 located at the retreating position on each time prior to the cutting. In this way, the cutting off work can smoothly be performed without the laser beam located at the work position being shielded by the supporting pin 21.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thermal cutting method and an apparatus thereof, and more particularly, it relates to a thermal cutting method and an apparatus therefor, and more specifically, a method for using a plurality of support pins provided in advance on a work table that supports a workpiece. The present invention relates to a thermal cutting method and an apparatus therefor, which performs processing by retreating from a processing position during processing.

[Prior Art] Conventionally, in a laser processing device, which is an example of a thermal cutting processing device, a workpiece placed on a plurality of support pins provided in advance on a work table is irradiated with a laser beam emitted from a processing head. Thermal cutting is performed to predetermined dimensions.

[Problems to be Solved by the Invention] However, in the conventional thermal cutting method described above, for example, when cutting a plurality of processed products to predetermined dimensions from - workpieces, cutting to predetermined dimensions is difficult. The outline of the figure may coincide with the position of the support pin supporting the workpiece.

In this way, when thermal cutting is performed with the outline of the figure cut out to a predetermined size aligned with the support pin, the laser beam and assist gas irradiated from the processing head are blocked and reflected by the support pin. Smooth discharge is obstructed.

As a result, there is a problem that the processed chips adhere in a molten state to the area around the hole where the hole is being cut out in the workpiece, deforming the cutout area, reducing processing accuracy, and causing the processed product to be rejected. .

The purpose of the present invention was proposed in order to improve the problem in view of the above-mentioned circumstances, and it is possible to prevent the outline of a figure cut out to a predetermined size from interfering with the support pin, without reducing machining accuracy.
The present invention provides a thermal cutting method and apparatus for improving processing efficiency.

[Means for Solving the Problems] In order to achieve the above-mentioned object, the first aspect of the present invention is to cut out a workpiece using preset cutting figure data and a workpiece for cutting out a workpiece using a thermal cutting device. Based on the position data of a plurality of support pins pre-installed on the supported work table, the support pins at the interference position of both data are removed or evacuated from the work table, and then the workpiece is processed in the light. This is a thermal cutting method that includes the following steps.

The second invention also provides a graphic data input means for inputting preset cutting graphic data for cutting out a workpiece, and a plurality of supports provided in advance on a work table that supports the workpiece. a support pin position data input means for inputting pin position data; cutting-out figure data inputted by the figure data input means; and position data of a plurality of support pins inputted by the support pin position data input means; a superimposing section that superimposes the shapes, an intersection calculating section that calculates and burying the intersection of the interference position where the superimposed figure interferes with the position of the support pin, and an intersection command signal of the intersection obtained by the intersection calculating section. This is a hot surface machining device comprising a support pin retracting means operated via a support pin drive section.

Furthermore, the third invention provides V) a figure data input means for inputting preset cutting figure data for performing the cutting process of the workpiece; A support pin position data input means for inputting support pin position data, and cutting-out figure data inputted by the figure data input means and FJ and number of support pins inputted by the support pin position data input means. a superimposing section that superimposes the position data of the superimposing section; an intersection calculating section that calculates the intersection of the interference position where the figure superimposed in the superimposing section interferes with the position of the support pin; This thermal cutting processing apparatus is equipped with a display device that matches the position of the graphic and the support pin based on the signal and displays the position of the support pin that is the intersection point.

[Function] By adopting the present invention, a plurality of support pins provided in advance on the work table that supports the workpiece are retracted from the machining position during machining, so that it is possible to cut out the figure to a predetermined size. The contour line no longer interferes with the support pin. Therefore, since the cutout cross section is not deformed, processing accuracy is not reduced and processing efficiency is improved.

[Example] Hereinafter, an example of the present invention will be described in detail based on the drawings.

In the following description, although a laser processing device will be exemplified, the present invention is not limited to the laser processing device, and can be implemented in a thermal cutting device for the song.

Referring to FIG. 1, a laser processing device 1, which is an example of a thermal cutting device, irradiates a workpiece W on a work table 7 with a laser beam generated in a laser oscillation device 3 from a processing head 5. Table 7 is X, YN
By moving it in the h direction, it is cut into a desired shape.

The X- and Y-axis position control of the work table 7 is achieved by moving the Y-axis gear ridge 11 along the Y-axis guide rail 9, and moving the work table 7 against the X-axis guide 13 installed on the Y-axis gear ridge 11. By moving in the X-axis direction, two-dimensional movement in X and Y is realized. Therefore, the control is performed so that the workpiece W on the work table 7 can be processed into a desired two-dimensional shape.

The operation of the laser oscillation device 3' and the work table 7 is controlled by the NC device 15.

The specific structure of the work table 7 in the laser processing apparatus 1 shown in FIG. 1 will be described with reference to FIGS. 2 and 3.

In FIGS. 2 and 3, the work table 7 has an appropriate number of crosspieces placed inside the box-shaped main body 17, and a plurality of support pins 21 for supporting the workpiece W are placed on each crosspiece. It is a standing structure. Further, at the bottom of the table body 17, there are provided drawers 23 for taking out products that can be pulled out on both the left and right sides.

With the above configuration, the workpiece W to be processed is placed on a plurality of support pins 21 erected on an appropriate number of crosspieces 19 extending inside the main body 17 of the workpiece table 7 . The workpiece W placed on the plurality of support pins 21 is irradiated with a laser beam from the processing head 5, and the workpiece ~■ is moved in the X and Y axes directions to achieve predetermined dimensions. The Karoe product is cut out and processed, and is temporarily stored in the product drawer 23.

The laser processing apparatus 1 shown in FIG. 1 includes a workpiece W.
Until the support pins 21 are moved away based on preset figure data to perform the cutting process and position data of a plurality of support pins 21 previously provided on the work table 7 that supports the workpiece W. The processing unit 25 is the fourth
It is installed as shown in the figure.

In FIG. 4, the processing section 25 is provided with support pin position data input means 27 for inputting position data of one support pin. From the support pin position data input means 27,
As shown in FIG. 4(a), the coordinates of the support pin 21 erected on the work table 7 are, for example, 1 in the X-axis direction.
Is the address ~5 in the Y-axis direction? &, the position data of the support pins 21 are input so that the addresses A-E are provided.

Further, the processing section 25 is provided with a graphic data input means 29 for inputting graphic data for cutting out to be performed on the workpieces to (2). For example, three figures are drawn on the workpiece W by the figure input means 29, as shown in FIG. 4(b), and the processed product is cut out based on these figures. Note that the cutout graphic data and the position data of the support pin 21 may be input from one and the same input means.

The position data of the support pin 21 inputted by the support pin position data input means 27 and the figure data of the processed product inputted by the two figure data input means are taken in. It is connected to the data input means 27 and two graphic data input means.

In the superimposing section 31, the position data of the support pin 21 and the graphic data of the processed product are superimposed. An intersection calculating section 33 is connected to the superimposing section 31. This superimposed support pin 2
Based on the position data of 1 and the shape data of the processed product,
The intersection calculation unit 33 calculates the interference position, that is, the intersection, where the position of the support pin 21 and the contour line, which is the graphic data of the processed product, interfere with each other.

The intersection command signal of the intersection processed by the @ line processing unit 33 is transmitted to the support pin drive unit 35 .
The support pin drive unit 35 is connected to the intersection calculation unit 33 so that the
is connected.

The support pin drive section 35 is connected to operate the support pin retraction means 37. Therefore, the support pin drive unit 35 operates to retract the support pin 21 by using the support pin retraction means 37, for example, to lower the support pin 21 using three air cylinders, or to lower the support pin 21 using the solenoid electromagnetic switching device 41. . As a result, even when cutting is performed based on the graphic data, the support pin 21 at the retracted position is retracted each time before being processed, so that the cutting can be performed smoothly.

It should be noted that the air cylinder 39 and the solenoid electromagnetic switching device 41, which are evacuation means, are attached to each support pin 21, respectively.

Each of the superimposing section 31 and the intersection calculation processing section 33 has a CR
The CR unit 45 is connected via the T fi control unit 43. On the CRT 45, the support pin position data and the graphic data of the processed product to be cut out are superimposed, and the intersection point between the support pin position data and the graphic data, which is the ') μs escape position, is
For example, the coordinates A-1, B-1, in (d) of Fig. 4,
D-1 and A-2 are displayed in a color such as red.

Before starting processing, the operator manually centers one of the support pins A-1, B-1, D-1, and A-2, which are the coordinates displayed in red, for example, on this CRT 45. As a result, the support pin 21 is retracted and processing is performed smoothly.

Note that the present invention is based on the above-mentioned actual fli! ! The present invention is not limited to the examples, and may be implemented in other ways by making appropriate changes.

[Effect] As understood from the above explanation of Implementation III,
According to the present invention, based on the position data of the support pins that support the workpiece and the cutout figure data for which edge cutting is to be performed, if the support pin is in a position where it interferes with the figure data, the work is performed. By handling the support pin by hand in advance or using the evacuation means to evacuate the support pin 3 times before performing BO machining, the laser beam at the machining position is almost never obstructed by the support pin, allowing smooth cutting. be done.

Therefore, processed products are almost never rejected, and processing efficiency is improved.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a laser processing apparatus which is an embodiment of the present invention. 2 is a plan view of the work table in the laser processing apparatus of FIG. 1. FIG. FIG. 3 is a side view of the work table. FIG. 4 is a block diagram showing an embodiment of the main part of the present invention. [Explanation of symbols representing main parts of the drawings 11... Laser processing device 5... Processing head 7... Work table 21... Support pin 27... Two support pin position data input means...・Graphic data input means 31...Superimposition section 33...Intersection calculation section 37...Support pin retraction means 45...CRT Fig. 1 Fig. 3

Claims (6)

[Claims] (1) Based on preset cutting figure data for cutting out a workpiece using a thermal cutting device and positional data of a plurality of support pins provided in advance on a work table that supports the workpiece, A thermal cutting method characterized by cutting a workpiece after removing or retracting a support pin at a data interference position from a work table. (2) The thermal cutting method according to claim 1, characterized in that the support pin located at the interference position is vertically retracted. (3) A figure data input means for inputting preset cutting figure data for cutting out a workpiece, and inputting position data of a plurality of support pins pre-installed on a work table that supports the workpiece. a superimposition unit that overlaps the cutting-out figure data input by the figure data input means and the position data of the plurality of support pins input by the support pin position data input means; , an intersection calculation unit that calculates the intersection of the interference position where the figures superimposed in the superimposition unit interfere with the position of the support pin; A thermal cutting device characterized by comprising an actuated support pin retraction means. (4) The thermal cutting device according to claim 3, further comprising a rotating body above the support pin. (5) The thermal cutting apparatus according to claim 3, wherein the support pin retraction means is a pressure cylinder or a solenoid electromagnetic switching device. (6) A figure data input means for inputting preset cutting figure data for cutting out a workpiece, and inputting position data of a plurality of support pins previously provided on a work table that supports the workpiece. a superimposition unit that overlaps the cutting-out figure data input by the figure data input means and the position data of the plurality of support pins input by the support pin position data input means; , an intersection calculation unit that calculates the intersection of the interference position where the figure superimposed in the superimposition unit interferes with the position of the support pin; and a position of the figure and the support pin based on signals from the overlap part and the intersection calculation unit. A thermal cutting device comprising: a display device that displays the position of support pins that are superimposed and intersect.