JPS63256426A - Mold device for integrally molding surface film - Google Patents

Mold device for integrally molding surface film

Info

Publication number
JPS63256426A
JPS63256426A JP9082887A JP9082887A JPS63256426A JP S63256426 A JPS63256426 A JP S63256426A JP 9082887 A JP9082887 A JP 9082887A JP 9082887 A JP9082887 A JP 9082887A JP S63256426 A JPS63256426 A JP S63256426A
Authority
JP
Japan
Prior art keywords
cavity
molding
mold
thin film
film layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9082887A
Other languages
Japanese (ja)
Inventor
Masamichi Takeshita
竹下 正道
Hisao Inage
久夫 稲毛
Masao Takagi
正雄 高木
Toshiji Sakuma
利治 佐久間
Masayuki Muranaka
昌幸 村中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9082887A priority Critical patent/JPS63256426A/en
Publication of JPS63256426A publication Critical patent/JPS63256426A/en
Pending legal-status Critical Current

Links

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

PURPOSE:To contrive to improve the yield of a product while reducing the man-hour and necessary time for operation by a method in which a surface film layer is molded by the plasma polymerization reaction generated in a cavity, and then said cavity is filled with molding resin. CONSTITUTION:After the inside of a mold has been vacuum-sucked through a vacuum-sucking device 2, voltage is applied to discharging electrodes 4 in a plasma polymerization device 3, and the monomer in a monomer source 6 and the gas in a inert gas vessel 16 are guided through stop valves 5a, 5, whereby plasma is made there, and then it is sent into a cavity 10. Since the inside of the cavity 10 is grounded, a surface film layer 17 is molded on the inner surface of the cavity 10. Next, the inside of the surface film layer 17 in the cavity 10 is filled with molding resin 18 from the nozzle 14 of a molding machine, and the operation is finished. Consequently, the cleaning and drying process and the handling therefor of the molded object which have been hitherto necessary for molding the surface film layer 17, becomes unnecessary. The reduction of operational processes and the shortening of necessary time in producing the molded object may be achieved, and its yield is improved.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、表面薄膜一体成形金型装置に関するものであ
る。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a mold device for integrally molding a surface thin film.

〔従来の技術〕[Conventional technology]

従来、プラスチックレンズ等の光学部品の反射防止、表
面硬化等を目的とする表面薄膜層の形成に関連し、特公
昭61−99101号公報が提案されている。この提案
によると、薄膜形成用の専用チャンバー装置を用いて行
なっておシ、そして、この装置を用いて薄膜を形成する
場合は、予備工程として洗浄工程、乾燥工程を必要とし
ている。この予備工程のために、多大の時間と、特に洗
浄の場合には装置の保全、管理及び洗浄液の管理に時間
、作業工数を必要とする。また、薄膜形成をレンズ玉等
の製造プロセスと切シ離して行なう上記の従来方法は、
準備のための種々のノ・ンドリング作用を必要とし、こ
れにより製造時間が増大するばかりでなく、ハンドリン
グ作業による不良が増加し易い。このため1歩留シを低
下しレンズ等の製造コスト低減に大きな障害となってい
る。
Conventionally, Japanese Patent Publication No. 61-99101 has been proposed in connection with the formation of a surface thin film layer for the purpose of antireflection, surface hardening, etc. of optical parts such as plastic lenses. According to this proposal, a dedicated chamber device for thin film formation is used, and when a thin film is formed using this device, a cleaning step and a drying step are required as preliminary steps. This preliminary step requires a large amount of time, and especially in the case of cleaning, time and man-hours are required for maintenance and management of the equipment and management of the cleaning solution. In addition, the above conventional method in which thin film formation is performed separately from the manufacturing process of lens beads, etc.
Various preparation operations are required, which not only increases manufacturing time but also tends to increase defects due to handling operations. For this reason, the yield rate is reduced and this becomes a major obstacle to reducing manufacturing costs of lenses and the like.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上記したように従来の金型においては、レンズ等の成形
と表面薄膜層の成形とを別工程で行なうので、表面薄膜
層の形成のために予備工程を必要とし、このため、多く
の作業工数と時間とを要すると云う問題を有しており、
同一工程の同一プロセスで表面薄膜層を形成することに
ついての配慮がなされていなかった。
As mentioned above, in conventional molds, molding of lenses etc. and molding of the surface thin film layer are performed in separate processes, so a preliminary process is required to form the surface thin film layer, which requires a large number of man-hours. The problem is that it takes a lot of time and
No consideration was given to forming the surface thin film layer in the same process.

本発明は上記の状況に鑑みなされたものであり、作業工
数及び時間を低減できると共に歩留りを向上できる表面
薄膜一体成形金型装置を提供することを目的としたもの
である。
The present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to provide a surface thin film integrated molding device that can reduce the number of work steps and time and improve the yield.

〔問題点を解決するための手段〕[Means for solving problems]

上記目的は、固定金型及び可動金型からなる一対の成形
金型内部にプラスチックレンズ等の光学部品を成形する
ためのキャビティが形成されたものにおいて、接地状態
に保持されている上記成形金型と、上記キャビティ内に
連通し該キャビティ内を真空に保持するように形成され
た真空吸引装置と、内部に放電電極を有しモノマー源及
び不活性ガス容器にそれぞれ制御装置もしくは外部信号
により制御される封止弁を介し連通され、または該モノ
マー源が内蔵され上記キャビティに連通されているプラ
ズマ重合装置と、該プラズマ重合装置を介し上記キャビ
ティ内面に表面薄膜層が形成された後該キャビティ内に
成形樹脂を充填するように形成された成形機ノズルとを
設けた表面薄膜一体成形金型装置により達成される。
The above object is a pair of molds consisting of a fixed mold and a movable mold, in which a cavity for molding an optical component such as a plastic lens is formed, and the molding mold is held in a grounded state. a vacuum suction device that communicates with the cavity and maintains the cavity in a vacuum; and a vacuum suction device that has a discharge electrode inside and is connected to the monomer source and the inert gas container, respectively controlled by a control device or an external signal. a plasma polymerization device that communicates with the cavity through a sealing valve, or has a built-in monomer source and communicates with the cavity; This is accomplished by a surface thin film integrated molding device equipped with a molding machine nozzle formed to fill the molding resin.

〔作用〕[Effect]

後述の実施例の説明中にも記載されているように、成形
金型1内を真空吸引装置2を介し真空吸引した後、プラ
ズマ重合装置3内の放電電極4に電圧を印加し、モノマ
ー源6内の七ツマ−及び不活性ガス容器16内のガスを
封止弁5a、5を経て導きプラズマ化した後、キャビテ
ィ10内に送出する。キャビティ10内は接地されてい
るのでキャビティ10内面に表面薄膜層17が形成され
る。
As described in the description of the examples below, after vacuum suction is applied to the inside of the molding die 1 via the vacuum suction device 2, a voltage is applied to the discharge electrode 4 in the plasma polymerization device 3, and the monomer source is 6 and the gas in the inert gas container 16 are guided through the sealing valves 5a and 5 to be turned into plasma, and then sent into the cavity 10. Since the inside of the cavity 10 is grounded, a surface thin film layer 17 is formed on the inner surface of the cavity 10.

表面薄膜層17が形成された後、続いて成形機ノズル1
4からキャビティ100表面薄膜層17の内側へ成形樹
脂18が充填されて完了する。即ち。
After the surface thin film layer 17 is formed, the molding machine nozzle 1
4 to the inside of the surface thin film layer 17 of the cavity 100 is filled with molding resin 18 to complete the process. That is.

+Wビティ10内にプラズマ重合反応を生起させて表面
薄膜層17を形成し、その後成形樹脂を充填し光学部品
を形成できる。従って、レンズ等の光学部品に表面薄膜
層17を同一型内で同一成形プロセスにおいて形成でき
る。
A plasma polymerization reaction is caused in the +W bit 10 to form a surface thin film layer 17, and then a molding resin is filled to form an optical component. Therefore, the surface thin film layer 17 can be formed on an optical component such as a lens in the same mold and in the same molding process.

〔実施例〕〔Example〕

以下本発明の表面薄膜一体成形金型装置を実施例を用い
第1図ないし第6図により説明する。第1図は説明図、
第2図、第3図はそれぞれ第1図の装置の操作説明図で
ある。図において、1は接地されている成形金型、2は
真空吸引装置、3はプラズマ重合装置、4は放電電極、
5,5a、7は封止弁%6はモノマー源、8は固定金型
、9は可動金型、10は固定金型8と可動金型9とによ
り形成される真空保持可能なキャビティである。11は
キャビティ10に連通する連通管、12は真空計、15
は真空吸引ノズル、14は射出成形機ノズル、15は封
止弁5,5a、7を制御する制御装置、16は不活性ガ
スが充填された不活性ガス容器、17はキャビティ10
表面に形成された表面薄膜層、1Bはキャビティ10に
充填された成形樹脂、19は電源である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The surface thin film integrally molding mold apparatus of the present invention will be explained below using examples and FIGS. 1 to 6. Figure 1 is an explanatory diagram;
2 and 3 are explanatory views of the operation of the apparatus shown in FIG. 1, respectively. In the figure, 1 is a grounded molding die, 2 is a vacuum suction device, 3 is a plasma polymerization device, 4 is a discharge electrode,
5, 5a, 7 are sealing valves % 6 is a monomer source, 8 is a fixed mold, 9 is a movable mold, 10 is a vacuum-maintainable cavity formed by the fixed mold 8 and the movable mold 9 . 11 is a communication pipe communicating with the cavity 10, 12 is a vacuum gauge, 15
14 is a vacuum suction nozzle, 14 is an injection molding machine nozzle, 15 is a control device that controls the sealing valves 5, 5a, and 7, 16 is an inert gas container filled with inert gas, and 17 is a cavity 10.
The surface thin film layer formed on the surface, 1B is the molded resin filled in the cavity 10, and 19 is a power source.

そして、この金型装置による成形は、まず、固定金型8
と可動金型9とを閉じて真空吸引可能なキャビティ10
を形成した後、真空吸引装置2を作用させて真空吸引ノ
ズル13を介してキャビティ10内を真空状態に吸引保
持する。次に、プラズマ重合装置3内の放電電極4に電
圧を印加してモノマー源6内のモノマー及び不活性ガス
容器16内のガスをプラズマ化しキャビティ10内に連
通管11を通して送出する。この際、金型1は接地され
て無電位であシ、キャビティ10内表面に表面薄膜層1
7が形成される。その後、第3図に示すように真空吸引
ノズル13を後退させ、また、封止弁7を閉じて射出成
形機ノズル14を成形金型1に接続して成形樹脂18を
キャビティ10内に充填し、キャビティ10の表面に形
成していた表面薄膜層17を成形樹脂18の表面側に密
着させる。
The molding process using this mold device begins with the fixed mold 8.
and the movable mold 9 are closed to form a cavity 10 that can be vacuum-suctioned.
After forming, the vacuum suction device 2 is activated to suction and maintain the inside of the cavity 10 in a vacuum state through the vacuum suction nozzle 13. Next, a voltage is applied to the discharge electrode 4 in the plasma polymerization device 3 to turn the monomer in the monomer source 6 and the gas in the inert gas container 16 into plasma, which is then sent into the cavity 10 through the communication pipe 11. At this time, the mold 1 is grounded and has no potential, and a surface thin film layer 1 is formed on the inner surface of the cavity 10.
7 is formed. Thereafter, as shown in FIG. 3, the vacuum suction nozzle 13 is retreated, the sealing valve 7 is closed, the injection molding machine nozzle 14 is connected to the molding die 1, and the molding resin 18 is filled into the cavity 10. Then, the surface thin film layer 17 formed on the surface of the cavity 10 is brought into close contact with the surface side of the molded resin 18.

成形後、成形金型1を開いて成形品を取り出すと、第4
図に示すように成形樹脂18の表面に薄膜層17が密着
された光学部品を得ることができる。同、薄膜層17の
形成に当シその膜厚を制御するためKは、封止弁7,5
,5aを成形機制御部(図示せず)と連動し、もしくは
外部からの信号により制御装置15を介して時間制御等
により開閉するのが最適と考えられる。通常、このプラ
ズマ重合時間は10〜30秒である。また、モノマーと
しては、テトラフルオロエチレン、パーフルオロブタン
等が遇している。尚、キャビティ10内の到達真空度は
、10  Torr以上が必要である。
After molding, when the mold 1 is opened and the molded product is taken out, the fourth
As shown in the figure, an optical component can be obtained in which the thin film layer 17 is adhered to the surface of the molded resin 18. Similarly, in order to control the film thickness during the formation of the thin film layer 17, K is the sealing valve 7, 5.
, 5a are considered to be optimally opened and closed in conjunction with a molding machine control section (not shown) or under time control or the like via the control device 15 in response to an external signal. Typically, this plasma polymerization time is 10 to 30 seconds. In addition, as monomers, tetrafluoroethylene, perfluorobutane, etc. are used. Note that the ultimate vacuum degree within the cavity 10 needs to be 10 Torr or more.

上記のようにして成形するので、従来、別プロセスで行
なっていた成形と、成形品表面の表面薄膜層17の形成
とを同一プロセスで行なうことができる。即ち、成形用
の金型1内を真空保持可能な構造として真空吸引装置2
によプキャビティ10内を真空吸引し、その後プラズマ
重合装置3によりプラズマを発生させてキャビティ10
内表面に表面薄膜層17を形成する。表面薄膜層17を
このように成形した後内部に成形樹脂18を充填するの
で結果的に成形品表面に密着させた形の表面薄膜層が形
成され、同一型内の同一成形プロセス内で成形品表面に
表面薄膜層17を形成することができる。この結果、従
来必要であった表面薄膜層17形成のための成形品の洗
浄、あるいは乾燥工程や、また、これらのためのハンド
リングが不要となシ、成形品製作時の工程の削減と、時
間の短縮が可能となる。また、ハンドリング等に伴う傷
付きなどの不良がなくなシ歩留シを向上できる。
Since the molding is performed as described above, the molding, which was conventionally performed in separate processes, and the formation of the surface thin film layer 17 on the surface of the molded product can be performed in the same process. That is, the vacuum suction device 2 has a structure capable of maintaining a vacuum inside the mold 1 for molding.
The inside of the cavity 10 is vacuum-suctioned, and then plasma is generated by the plasma polymerization device 3 to form a vacuum inside the cavity 10.
A surface thin film layer 17 is formed on the inner surface. After the surface thin film layer 17 is molded in this way, the molding resin 18 is filled inside, so that the surface thin film layer is formed in close contact with the surface of the molded product, and the molded product can be molded in the same mold and in the same molding process. A surface thin film layer 17 can be formed on the surface. As a result, the cleaning or drying process of the molded product for forming the surface thin film layer 17, which was previously necessary, and the handling required for these are no longer necessary, and the process and time required for manufacturing the molded product are reduced. can be shortened. Further, defects such as scratches caused by handling etc. can be eliminated, and the yield can be improved.

このように本実施例の表面薄膜一体成形金型装置は、同
一の成形金型内の同一の成形プロセス内で、キャビティ
内に表面薄膜層を予め形成した後、成形樹脂をこの表面
薄膜層内に充填し光学部品を形成できるので、洗浄、乾
燥工程を削減しこれらのハンドリングを不要とし、また
、ハンドリングに伴う不良を減少し歩留シを向上できる
In this way, the surface thin film integral molding mold device of this embodiment is capable of forming a surface thin film layer in advance in the cavity in the same molding process in the same molding die, and then applying the molding resin into this surface thin film layer. Since the optical components can be formed by filling the glass, cleaning and drying steps can be reduced and handling thereof becomes unnecessary, and defects caused by handling can be reduced and yields can be improved.

尚、上記した表面薄膜層17の形成は、キャビティ10
内を真空に保持し得るいずれの成形法にも適用でき、射
出成形、圧縮成形、ブロー成形。
Note that the formation of the surface thin film layer 17 described above is performed in the cavity 10.
Applicable to any molding method that can maintain a vacuum inside, including injection molding, compression molding, and blow molding.

回転成形及び真空成形に適用できる。また、封止弁5 
、5a、7は制御装置15による制御以外に外部信号に
より制御する制御部を設けて制御してもよく、タイマー
を介し制御してもよい。さらに、モノマー源6はプラズ
マ重合装置内に放電電極4と併設するようにしてもよい
Applicable to rotation molding and vacuum forming. In addition, the sealing valve 5
, 5a, and 7 may be controlled by providing a control unit that controls them by external signals in addition to the control by the control device 15, or may be controlled by using a timer. Furthermore, the monomer source 6 may be installed together with the discharge electrode 4 in the plasma polymerization apparatus.

〔発明の効果〕〔Effect of the invention〕

以上記述した如く本発明の表面薄膜一体成形金型装置に
よれは、作業工数及び時間を低減できると共に歩留りを
向上できる効果を有するものである。
As described above, the surface thin film integrally molding mold apparatus of the present invention has the effect of reducing the number of work steps and time and improving the yield.

【図面の簡単な説明】[Brief explanation of the drawing]

91図は本発明の表面薄膜一体成形金型装置の実施例の
説明図、第2図、第3図はそれぞれ第1図の金型装置の
操作説明図、第4図は第1図の金型装置により成形され
た成形品の断面図である。 1・・・成形金型、2・・・真空吸引装置、3・・・プ
ラズマ重合装置、4・・・放電電極、5.5m、7−・
・封止弁、6・・・モノマー源、8・・・固定金型、9
・・・可動金型。 10・・・キャビティ% 11・・・連通管、14・・
・成形機ノズル、16・・・不活性ガス容器、17・・
・表面薄膜層、18・・・成形樹脂。 」 3図 第4図
91 is an explanatory diagram of an embodiment of the mold device for integrally molding a surface thin film of the present invention, FIGS. 2 and 3 are respectively explanatory diagrams of the operation of the mold device of FIG. 1, and FIG. FIG. 3 is a cross-sectional view of a molded product molded by a mold device. 1... Molding mold, 2... Vacuum suction device, 3... Plasma polymerization device, 4... Discharge electrode, 5.5 m, 7-...
・Sealing valve, 6... Monomer source, 8... Fixed mold, 9
...Movable mold. 10...Cavity% 11...Communication pipe, 14...
・Molding machine nozzle, 16... Inert gas container, 17...
- Surface thin film layer, 18...molding resin. ” Figure 3 Figure 4

Claims (1)

【特許請求の範囲】 1、固定金型及び可動金型からなる一対の成形金型内部
にプラスチックレンズ等の光学部品を成形するためのキ
ャビティが形成されたものにおいて、接地状態に保持さ
れている上記成形金型と、上記キャビティ内に連通し該
キャビティ内を真空に保持するように形成された真空吸
引装置と、内部に放電電極を有しモノマー源及び不活性
ガス容器にそれぞれ制御装置もしくは外部信号により制
御される封止弁を介し連通され、または該モノマー源が
内蔵され上記キャビティに連通されているプラズマ重合
装置と、該プラズマ重合装置を介し上記キャビティ内面
に表面薄膜層が形成された後該キャビティ内に成形樹脂
を充填するように形成された成形機ノズルとを設けたこ
とを特徴とする表面薄膜一体成形金型装置。 2、上記封止弁がタイマーを介し制御されるように形成
されている特許請求の範囲第1項記載の表面薄膜一体成
形金型装置。 3、上記成形金型が上記キャビティ内を真空に保持する
構造を有すると共に、射出成形型、圧縮成形型、ブロー
成形型または回転成形型の何れかに形成されている特許
請求の範囲第1項記載の表面薄膜一体成形金型装置。 4、上記プラズマ重合装置内に上記放電電極と上記モノ
マー電源とが併設され上記キャビティへの連通を1個の
連通管により形成されている特許請求の範囲第1項記載
の表面薄膜一体成形金型装置。
[Claims] 1. A pair of molds consisting of a fixed mold and a movable mold in which a cavity for molding an optical component such as a plastic lens is formed, which is held in a grounded state. The above-mentioned molding die, a vacuum suction device formed to communicate with the inside of the cavity and maintain the inside of the cavity in a vacuum, and a control device or an external device having a discharge electrode therein and connected to a monomer source and an inert gas container, respectively. a plasma polymerization device that is in communication with the cavity through a sealing valve controlled by a signal, or has a built-in monomer source and is in communication with the cavity, and after a surface thin film layer is formed on the inner surface of the cavity through the plasma polymerization device; A mold device for integrally molding a surface thin film, comprising: a molding machine nozzle formed to fill the molding resin into the cavity. 2. The mold device for integrally molding a surface thin film according to claim 1, wherein the sealing valve is configured to be controlled via a timer. 3. Claim 1, wherein the molding mold has a structure that maintains the inside of the cavity in a vacuum, and is formed as an injection molding mold, a compression molding mold, a blow molding mold, or a rotary molding mold. The described surface thin film integrated molding device. 4. The mold for integrally molding a surface thin film according to claim 1, wherein the discharge electrode and the monomer power source are provided together in the plasma polymerization apparatus, and communication with the cavity is formed by a single communication tube. Device.
JP9082887A 1987-04-15 1987-04-15 Mold device for integrally molding surface film Pending JPS63256426A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9082887A JPS63256426A (en) 1987-04-15 1987-04-15 Mold device for integrally molding surface film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9082887A JPS63256426A (en) 1987-04-15 1987-04-15 Mold device for integrally molding surface film

Publications (1)

Publication Number Publication Date
JPS63256426A true JPS63256426A (en) 1988-10-24

Family

ID=14009448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9082887A Pending JPS63256426A (en) 1987-04-15 1987-04-15 Mold device for integrally molding surface film

Country Status (1)

Country Link
JP (1) JPS63256426A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006123614A1 (en) * 2005-05-19 2006-11-23 National University Corporation Nagoya University Injection molding device with plasma generator, and injection molding and surface treating method
WO2016156479A1 (en) * 2015-03-31 2016-10-06 Plasmatreat Gmbh Injection-molding tool and method for producing an injection-molded part

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006123614A1 (en) * 2005-05-19 2006-11-23 National University Corporation Nagoya University Injection molding device with plasma generator, and injection molding and surface treating method
JP2006321137A (en) * 2005-05-19 2006-11-30 Univ Nagoya Injection molding apparatus fitted with plasma generator and methods of injection molding and surface treatment
JP4660702B2 (en) * 2005-05-19 2011-03-30 国立大学法人名古屋大学 Injection molding apparatus with plasma generator, injection molding and surface treatment method
WO2016156479A1 (en) * 2015-03-31 2016-10-06 Plasmatreat Gmbh Injection-molding tool and method for producing an injection-molded part
US10093046B2 (en) 2015-03-31 2018-10-09 Plasmatreat Gmbh Injection-molding tool and method for producing an injection-molded part

Similar Documents

Publication Publication Date Title
JP4996689B2 (en) Method and apparatus for molding composite material members
US7833454B2 (en) Molding method and molding apparatus of mold product having thin film at inner surface
KR20090079849A (en) Hollow moldings having thin film on inner surface
JPS63256426A (en) Mold device for integrally molding surface film
US20070090554A1 (en) Panel molding method and apparatus
US7892465B2 (en) Method and apparatus for forming hollow moldings having thin film on inner surface
JP2003001645A (en) Method for molding intraocular lens of plastic material
JPH01320126A (en) Method for controlling injection pressure of injection molder
JP2001047483A (en) Injection molding machine
JPS59222321A (en) Vacuum evacuation of die cavity and apparatus therefor
JP2003094459A (en) Injection-molding die, and manufacturing method for molded article using the die
JPS61227012A (en) Injection molding
JP4541182B2 (en) Molding method and molding apparatus for molded product having thin film on surface
JPH04129715A (en) Vacuum forming metal die device and seal pressure control method in vacuum formation in mold cavity
JPS63172626A (en) Injection molding equipment
JP2936580B2 (en) Press forming equipment
JPS5867430A (en) Injection control method of injection molding machine
KR102133094B1 (en) Method for injecting monomer in mold for manufacturing optical material
JPH0577248A (en) Method for releasing molded product
JPH11156896A (en) Injection molding method and apparatus therefor
JP3042768B2 (en) Vacuum forming method and vacuum forming mold device
JP2007253494A (en) In-mold coating molding method, in-mold coating molding device and in-mold coating molded product
JPH09164548A (en) Resin molding device
JPH09207174A (en) Semiconductor mold apparatus
JPH0716883A (en) Controlling method of fill of resin for injection molding and controlling device of fill of resin for executing the same