JPS6324845U - - Google Patents
Info
- Publication number
- JPS6324845U JPS6324845U JP11877186U JP11877186U JPS6324845U JP S6324845 U JPS6324845 U JP S6324845U JP 11877186 U JP11877186 U JP 11877186U JP 11877186 U JP11877186 U JP 11877186U JP S6324845 U JPS6324845 U JP S6324845U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- workpiece
- bending punch
- die
- press molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005452 bending Methods 0.000 claims description 11
- 238000000465 moulding Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Wire Processing (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986118771U JPH0349401Y2 (me) | 1986-07-31 | 1986-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986118771U JPH0349401Y2 (me) | 1986-07-31 | 1986-07-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6324845U true JPS6324845U (me) | 1988-02-18 |
| JPH0349401Y2 JPH0349401Y2 (me) | 1991-10-22 |
Family
ID=31005541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986118771U Expired JPH0349401Y2 (me) | 1986-07-31 | 1986-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0349401Y2 (me) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5952858A (ja) * | 1982-09-18 | 1984-03-27 | Mitsubishi Electric Corp | 半導体装置のリ−ド成形装置 |
-
1986
- 1986-07-31 JP JP1986118771U patent/JPH0349401Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5952858A (ja) * | 1982-09-18 | 1984-03-27 | Mitsubishi Electric Corp | 半導体装置のリ−ド成形装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0349401Y2 (me) | 1991-10-22 |
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