JPS63244845A - Processing device - Google Patents

Abstract

PURPOSE:To remove fluctuation in temperature of liquid chemicals and to upgrade processing stability, by connecting two or more nozzles with pipes in which the liquid chemicals always circulate and concurrently holding the liquid medicines at prescribed temperature to exactly control injection time of the liquid chemicals from the nozzles in accordance with temperature in a processing chamber. CONSTITUTION:When the amount of injection is corrected in accordance with fluctuation in temperature in a processing chamber 1, the fluctuation in temperature in the processing chamber 1 is detected by receiving an output signal of a temperature sensor 23 in the processing chamber 1. Since a process controlling device 52 has process reaction temperature dependence which is dissimilar in accordance with liquid chemicals for use, injection times of the liquid chemicals are increased/decreased so that the injection amount of the liquid chemicals required for optimum processing reactions can be obtained for the respective liquid chemicals. The increase/decrease in the injection amount of the liquid chemicals is performed by increasing/decreasing the quantity of pulses of injection signals and changing the injection time per unit injection. The liquid medicines can be injected always at optimum temperature in accordance with the temperature in the processing chamber 1, and two or more species of liquid chemicals can be mixed with high precision. Hence, stable processing is enabled on a surface of a substrate 2 for surface treatment.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Field of Application) The present invention relates to a processing apparatus, and in particular, the surface of a substrate to be surface-treated,
The present invention relates to a processing device for applying a chemical solution such as a developer to a surface.

(Prior Art) FIG. 4 shows a conventional processing apparatus, in which a spin chuck 3 for suctioning and holding a substrate 2 to be surface-treated is disposed in the center of a processing chamber 1. A rotary motor 4 is connected to the rotary shaft, and this rotary motor 4
The spin chuck 3 is rotationally driven by the drive of the spin chuck 3.

Further, a slider 6 is disposed outside the processing chamber 1 and is capable of reciprocating along two guide shafts 5.5 arranged above and below. An arm 7 extending through the side surface of the processing chamber 1 is fixed, and a nozzle 8 for spraying a chemical solution such as a developer is disposed at the tip of the arm 7 so as to face diagonally downward. .

A cam follower 9 is formed protruding from one side of the slider 6, and this cam follower 9 engages with a circular groove 11 eccentrically formed in the rotatable cam 0. The rotational drive causes the slider 6 and arm 7 to reciprocate as shown by arrows in the figure.

Further, a pressurized tank 12 for storing a chemical solution such as a developer is provided. A chemical liquid introduction pipe 16 is connected therethrough to be sent to the nozzle 8.

A temperature regulator 17 is connected to the constant temperature water tank 13 to keep the temperature constant based on the temperature of the chemical solution detected by a detector (not shown).

In the above device, when the cam 10 is rotated by a rotary drive device (not shown), the circular groove 11 rotates eccentrically, and the slider 6 and the arm 7 reciprocate along the guide shaft 5°5 via the cam follower 9. do. Therefore, the nozzle 8 of the arm 7 reciprocates above the surface-treated substrate 2, and in this state, the on-off valve 1
5 is opened and the chemical solution is applied from the tip of the nozzle 8 to the substrate 2 to be surface treated.
This ensures that the fuel is sprayed evenly and at a constant temperature.

(Problem to be Solved by the Invention) However, in the above device, when the injection of the chemical solution is stopped, the chemical solution in the piping route from the constant temperature water tank 13 to the injection nozzle 8 stagnates, so it changes due to the influence of the surrounding temperature. The problem is that the stability of the process is not good.

Further, there are problems in that the optimum processing conditions change due to temperature fluctuations in the processing chamber 1, and furthermore, since there is only one nozzle 8, two or more chemical solutions cannot be mixed.

The present invention has been made in view of the above points, and an object of the present invention is to provide a processing device that can improve processing stability and mix two or more chemical solutions. It is.

(Means for Solving the Problems) In order to achieve the above object, a processing apparatus according to the present invention includes a spin chuck that rotatably holds a substrate to be surface treated, which is provided in a processing chamber, and an upper part of the inside of the processing chamber. a plurality of chemical liquid injection nozzles disposed so as to be directed toward the substrate to be surface-treated; a plunger slidably provided inside each of the injection nozzles and opening and closing the injection port by energizing an electromagnetic coil; A chemical liquid introduction pipe and a discharge pipe that are connected to each injection nozzle and communicate with each other when the injection port is in a closed state; and a chemical liquid supply device that is connected to the introduction pipe and the discharge pipe and circulates and supplies the chemical liquid at a predetermined temperature; A clock pulse signal is built in, and this pulse signal is output to each of the above injection nozzles, and by changing the ratio of the number of pulses to each injection nozzle, the injection time of the chemical liquid is controlled, and from each injection nozzle per unit time. The present invention is characterized in that it has a processing control device that controls the injection amount of the chemical solution and also controls the temperature of the chemical solution in the chemical solution supply device according to the temperature inside the processing chamber.

(Function) According to the present invention, a plurality of injection nozzles are provided, and a supply device for supplying a chemical solution to each nozzle is provided independently, and a pulse signal from a processing control device causes the chemical solution to be ejected from the nozzles. Since the time can be controlled accurately, two or more chemical solutions can be injected at any mixing ratio, and when the nozzle injection port is blocked, the chemical solution can be sprayed from the inlet pipe, the discharge pipe, and the supply pipe. Since the chemical solution is constantly circulated through the device, the temperature of the chemical solution does not fluctuate, and processing stability can be significantly improved.

(Example) Hereinafter, an example of the present invention will be described with reference to FIGS. 1 to 3, and the same parts as in FIG. 4 are given the same reference numerals.

FIG. 1 shows an embodiment of the present invention, in which a spin chuck 3 for sucking a substrate 2 to be surface-treated is disposed in the lower part of a processing chamber 1, and this spin chuck 3 is equipped with a rotary motor. 4 and a rotation detector 18 for detecting the rotation speed of this motor 4 are connected, and a rotation control device 19 is provided for controlling the rotation motor 4 by manually inputting the detection signal of this rotation detector 18. There is. Further, two chemical liquid injection nozzles 8a and 8b are attached to the upper surface of the processing chamber l so as to be oriented toward the rotation center of the surface-treated substrate 2, and each of these nozzles 8a and 8b has a chemical liquid spray nozzle 8a and 8b. Introductory pipe 20
and discharge piping 21 are connected to each other. An opening 22 is formed in the lower surface of the processing chamber 1 for evacuation and waste liquid, and a temperature sensor 23 for detecting the internal temperature of the processing chamber 1 is disposed inside the processing chamber 1.

As shown in FIG. 2, the nozzle 8 has a chemical liquid injection port 24 formed at its tip, and a plunger 25 is disposed inside the nozzle 8 so as to be slidable along the longitudinal direction. . A spring 26 is attached to the rear end of the plunger 25, and the tip of the plunger 25 is connected to the injection port 25.
is biased to occlude. Further, an electromagnetic coil 27 is provided around the outer circumference of the plunger 25 inside the nozzle 8, and by energizing the electromagnetic coil 27, the plunger 25 is moved against the biasing force of the spring 26. The injection port 24 is opened by moving it to the left in the figure.

At the rear end side of the plunger 25, a chemical solution introduction pipe 20 is provided.
A chemical solution introduction chamber 28 is arranged, and this introduction chamber 2
A filter 30 supported on both sides by mesh plates 29 is disposed between the plunger 8 and the plunger 25 portion. Furthermore, a communication passage 31 is formed inside the plunger 25 and communicates from the rear end to the side surface near the tip, and the nozzle 8
A chemical liquid discharge pipe 21 is connected to the side surface near the tip.

The chemical liquid introduction pipe 20 and the discharge pipe 21 of the nozzle 8 are connected to chemical liquid supply devices 32a and 32b, respectively. Each of these chemical liquid supply devices 32a.

32b have the same configuration, so one chemical liquid supply device 32a will be described. A constant temperature water tank 33 is disposed inside the chemical supply device 32a, and a constant temperature water 34 is stored inside the constant temperature water tank 33. A circulation pipe 35 for constant temperature water 34 is connected above this constant temperature water tank 33, and this circulation pipe 35 has a constant temperature water spout 3 that opens into the lower interior of the constant temperature water tank 33 via a circulation pump 36 in the middle.
7 is connected. A semiconductor heat exchanger 38 is installed in the middle of the circulation distribution W35, and this semiconductor heat exchanger 38 detects the temperature detected by the temperature sensor 39 of the constant temperature water 34 provided inside the constant temperature water tank 33. It is connected to a constant temperature water temperature control device 40 which inputs and sends a temperature control signal. The semiconductor heat exchanger 38 heats or cools the constant temperature water 34 so that the constant temperature water 34 reaches a predetermined temperature based on the temperature of the temperature sensor 39. Further, the semiconductor heat exchanger 38 for the constant temperature water 34 is provided with cooling water pipes 4 through which cooling water is conducted in order to remove heat radiation from the semiconductor heat exchanger 38.
1 are arranged in contact with each other.

Further, inside the constant temperature water tank 33, a heat exchange pipe 42 through which a chemical solution is conducted is disposed, and the nozzle 8 is connected to the outlet side of the heat exchange pipe 42 via a pressure pump 43 and a filtration filter 44. While the introduction pipe 20 is connected,
The discharge pipe 21 of the nozzle 8 is connected to the inlet side via a pressure regulator 45 midway. Inside the constant temperature water tank 33, a chemical liquid tank 47 is housed, in which a plurality of partition plates 46 are provided in multiple stages, and a chemical liquid supply port 48 extending to the outside is connected to the upper part of the chemical liquid tank 47. is,
The heat exchange pipe 4 is connected to the lower part through a reverse valve 49 in the middle.
A chemical solution supply pipe 50 connected to the inlet side of 2 is provided.

In addition, a data input/output device 51 is connected, and a signal from the temperature sensor 23 of the processing chamber 1 is inputted to each nozzle g.
A processing control device 52 is provided that outputs a control signal to the rotation control device 19 and the constant temperature water temperature control device 40 of each chemical liquid supply device 32a, 32b. 8a,
The injection time of the chemical solution by energizing the electromagnetic coil 27 of 8b,
The rotational speed of the rotary motor 4 of the spin chuck 3 and the temperature of the chemical solution are controlled respectively.

Next, the operation of this embodiment will be explained.

First, the semiconductor substrate 2 is mounted and fixed on the spin chuck 3, and the spin chuck 3 is rotated at a predetermined rotation speed by the rotation control device 19 by driving the motor 4. At this time,
The constant temperature water 34 in the constant temperature water tank 33 always passes through the circulation pipe 35 due to the operation of the circulation pump 36, and the constant temperature water 34 is maintained at a predetermined temperature based on a control signal from the constant temperature water temperature control device 40. The chemical solution is sent from the chemical tank 47 through the supply pipe 48 and the check valve 49 into the heat exchange piping 42, where it exchanges heat with the constant temperature water 34 to keep the temperature of the chemical solution constant. By the operation of the pressure pump 43, the chemical liquid passes through the introduction pipe 20 and enters each nozzle 8a, 8.
sent to b. When not injecting, the plunger 2 in the nozzle 8
5, the injection port 24 is blocked by the inlet pipe 2.
The chemical liquid that entered the introduction chamber 28 of the nozzle 8 from 0 passes through the communication path 31 in the plunger 25, is returned from the discharge pipe 21 to the heat exchange pipe 42 of the chemical liquid supply device 32 via the pressure regulator 45, and is always maintained at a constant level. It circulates at a temperature of Then, the electromagnetic coil 27 is activated by the injection signal from the processing control device 52.
By driving the plunger 25 and opening the injection port 24, the chemical solution is sprayed onto the rotating wave surface treatment substrate 2 for a predetermined period of time. In this case, both nozzles 8 may eject at the same time, or may eject only from one of them or alternately. next,
A different chemical solution is stored in each chemical solution tank 47 and each nozzle 8a,
A case where different chemical solutions are injected from 8b and a mixture of 2N chemical solutions is used will be described with reference to FIG.

The processing control device 52 has a built-in clock pulse signal CP that serves as a reference for the injection time of the chemical liquid, and the frequency of this clock pulse signal CP is 10 KHz. Therefore, the period is 0.1 m5ec, and each nozzle 8a
, 8b are amplified clock pulses CP, and the mixing ratio of the chemical liquid can be varied by changing the ratio of the number of pulses of the injection signals IA and IB output to the nozzle 8. Let's do it. For example, when the mixing injection ratio is 3 near, the injection signal IA to one nozzle 8a is
The number of pulses is 300, and the injection signal I to the other nozzle 8b is
If the number of pulses B is 700, the injection time for one nozzle 8a is TAI -300t1, the injection time for the other nozzle 8b is TA2 -700t, and TAI = 30ms e
c, Ta2-70 msec. Since the injection amount of the chemical liquid is proportional to the product of the pressure of the chemical liquid and the injection time, if the pressure of each chemical liquid is made the same, the mixing ratio of the chemical liquids can be controlled to 3=7.

Further, in order to continuously perform mixed injection of the chemical liquid, the injection signal IA and the injection signal IB are repeatedly outputted to the chemical liquid nozzle at a period T1. If the chemical liquid injection per cycle T1 is a unit injection, the total injection amount of the chemical liquid is determined by the number of repetitions n of the unit injection.

In this way, the mixing ratio of the chemical liquid is determined by each injection signal IA.

By changing the ratio of the number of IB pulses, it is possible to arbitrarily vary the ratio, and by changing the ratio of the number of pulses for each unit injection, it is also possible to change the chemical mixture ratio over time. Note that the amount of chemical liquid injection per unit time is determined by the non-injection time TD1. This may be done by changing TD2; in this case, if TDl is decreased, the amount of chemical liquid injection per unit time will increase, and conversely, if TD2 is increased, it will be decreased.

In addition, when correcting the injection amount based on temperature fluctuations in the processing chamber 1, the temperature change in the processing chamber 1 is detected by receiving the output signal of the temperature sensor 23 in the processing chamber 1, and the processing control device 52 adjusts the amount depending on the chemical liquid to be used. Since the temperature dependence of the treatment reaction is different, the chemical injection time is controlled to be increased or decreased so that the injection amount of the chemical liquid is the amount necessary for the optimum treatment reaction for each chemical liquid. The amount of chemical liquid injection is increased or decreased by changing the injection times TAI and TBI for each unit injection by increasing or decreasing the number of pulses of the injection signals IA and IB.

Therefore, in this embodiment, it is possible to always inject the chemical liquid at the optimum temperature and according to the temperature of the processing chamber 1.
Moreover, since the mixing of two or more chemical solutions can be controlled with high precision, the surface of the substrate 2 to be surface-treated can be stably treated, and the quality and precision of the substrate 2 to be surface-treated can be improved. becomes possible.

In the above embodiment, two nozzles are provided, but three or more nozzles may be provided, or the spin chuck may be moved horizontally instead of being driven rotationally.

〔Effect of the invention〕

As described above, the processing device according to the present invention is provided with two or more nozzles, each of which is connected to a pipe through which a chemical solution is constantly circulated, the chemical solution is maintained at a predetermined temperature, and the chemical solution is sprayed from the nozzle. Since we have installed a process control device that accurately controls the time according to the process chamber temperature, it is possible to inject two or more chemical solutions at any mixing ratio and with high precision, and it also prevents the nozzle injection port from becoming clogged. When you are doing
Since the chemical solution is constantly circulated, temperature fluctuations of the chemical solution do not occur, and processing stability can be significantly improved.

As a result, the surface of the substrate to be surface-treated can be stably processed, and the quality and precision of the substrate to be surface-treated can be improved.

[Brief explanation of drawings]

FIG. 1 is a configuration diagram showing one embodiment of the present invention, and FIG.
FIG. 3 is an explanatory diagram showing an output signal when two chemical solutions are mixed, and FIG. 4 is a configuration diagram showing a conventional processing device. DESCRIPTION OF SYMBOLS 1... Processing chamber, 2... Substrate to be surface treated, 3... Spin chuck, 8... Nozzle, 19... Rotation control device, 20... Chemical solution introduction piping, 21... Chemical solution Discharge piping, 23.39...Temperature sensor, 24...Injection port, 2
5... Plunger, 32... Chemical solution supply device, 33.
... Constant temperature water tank, 38... Semiconductor heat exchanger, 40...
Temperature control device, 42... Heat exchange piping, 47... Chemical tank, 52... Processing control device.

Claims (1)

[Scope of Claims] 1. A spin chuck that rotatably holds the substrate to be surface-treated provided in the processing chamber, and a plurality of spin chucks disposed above the inside of the processing chamber so as to face the substrate to be surface-treated. a chemical liquid injection nozzle; a plunger that is slidably provided inside each of the injection nozzles and opens and closes the injection port by energizing an electromagnetic coil; An inlet pipe and a discharge pipe for a chemical solution that communicate with each other, and a chemical solution supply device to which the introduction pipe and the discharge pipe are connected to circulate and supply the chemical solution at a predetermined temperature;
A clock pulse signal is built in, and this pulse signal is output to each of the above injection nozzles, and by changing the ratio of the number of pulses to each injection nozzle, the injection time of the chemical liquid is controlled, and from each injection nozzle per unit time. 1. A processing device comprising: a processing control device that controls the injection amount of a chemical solution, and controls the temperature of a chemical solution in the chemical solution supply device according to the temperature inside the processing chamber. 2. Different chemical solutions are supplied to each of the injection nozzles, and the mixing ratio of each chemical solution is controlled by the processing control device by changing the injection time ratio from each injection nozzle. Processing equipment described in Section 1. 3. Claim 2, characterized in that the processing control device changes the chemical liquid injection time from each injection nozzle over time, and changes the mixing ratio of the chemical liquid over time. processing equipment. 4. The processing apparatus according to claim 1, wherein the injection time of the chemical solution is controlled in accordance with temperature changes in the processing chamber so as to provide an optimum reaction time for the chemical solution.