JPS6324268U - - Google Patents
Info
- Publication number
- JPS6324268U JPS6324268U JP11867186U JP11867186U JPS6324268U JP S6324268 U JPS6324268 U JP S6324268U JP 11867186 U JP11867186 U JP 11867186U JP 11867186 U JP11867186 U JP 11867186U JP S6324268 U JPS6324268 U JP S6324268U
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic cell
- nozzles
- plating liquid
- steel plate
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 7
- 238000009713 electroplating Methods 0.000 claims description 4
- 238000011144 upstream manufacturing Methods 0.000 claims description 4
- 238000005406 washing Methods 0.000 claims description 4
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- 239000010410 layer Substances 0.000 claims 1
- 239000002356 single layer Substances 0.000 claims 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
第１図は本考案の第一の実施例を示す側面図、
第２図は従来の複層電気めつきラインを示す側面
図、第３図はめつき液ノズルを示す斜視図、第４
図はめつき液移送用配管の他の例を示す側面図、
第５図は本考案の第二の実施例を示す側面図であ
る。
図中、１：上流側電解槽、２：上流側めつき本
タンク、５ａ，５ｂ：水洗ノズル、６：下流側電
解槽、７：下流側めつき本タンク、８：鋼板、１
１：受パン、１２ａ，１２ｂ：めつき液ノズル、
２２：カバー。
FIG. 1 is a side view showing the first embodiment of the present invention;
Fig. 2 is a side view showing a conventional multilayer electroplating line, Fig. 3 is a perspective view showing a plating liquid nozzle, and Fig. 4 is a side view showing a conventional multilayer electroplating line.
The figure is a side view showing another example of plating liquid transfer piping.
FIG. 5 is a side view showing a second embodiment of the present invention. In the figure, 1: Upstream electrolytic cell, 2: Upstream main plating tank, 5a, 5b: Washing nozzle, 6: Downstream electrolytic cell, 7: Downstream main plating tank, 8: Steel plate, 1
1: Receiving pan, 12a, 12b: Plating liquid nozzle,
22: Cover.
Claims (1)
８通過面に向かつて配設された水洗ノズル５ａ，
５ｂおよびめつき液ノズル１２ａ，１２ｂと、前
記鋼板８の通過面の下方に配設され、複層電気め
つき操業のときに水洗ノズル５ａ，５ｂから噴出
された洗浄水の排液を受け、単層めつき操業のと
きにノズル１２ａ，１２ｂから噴霧されためつき
液と上流側電解槽１から持ち出されるめつき液と
を回収する受パン１１とを備えることを特徴とす
る複層電気めつき装置。 A water washing nozzle 5a disposed facing the steel plate 8 passage surface between the upstream electrolytic cell 1 and the downstream electrolytic cell 6,
5b and plating liquid nozzles 12a, 12b, which are disposed below the passing surface of the steel plate 8, and receive the drainage liquid of washing water spouted from the washing nozzles 5a, 5b during multilayer electroplating operation; Multi-layer electroplating characterized by comprising a receiving pan 11 that collects the plating liquid sprayed from nozzles 12a and 12b and the plating liquid taken out from the upstream electrolytic cell 1 during single-layer plating operation. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11867186U JPH0421826Y2 (en) | 1986-07-31 | 1986-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11867186U JPH0421826Y2 (en) | 1986-07-31 | 1986-07-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6324268U true JPS6324268U (en) | 1988-02-17 |
| JPH0421826Y2 JPH0421826Y2 (en) | 1992-05-19 |
Family
ID=31005346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11867186U Expired JPH0421826Y2 (en) | 1986-07-31 | 1986-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0421826Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7611584B2 (en) | 2005-12-13 | 2009-11-03 | Lg Electronics Inc. | Electroless metal film-plating system |
-
1986
- 1986-07-31 JP JP11867186U patent/JPH0421826Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7611584B2 (en) | 2005-12-13 | 2009-11-03 | Lg Electronics Inc. | Electroless metal film-plating system |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0421826Y2 (en) | 1992-05-19 |
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