JPS6324071U - - Google Patents
Info
- Publication number
- JPS6324071U JPS6324071U JP11809086U JP11809086U JPS6324071U JP S6324071 U JPS6324071 U JP S6324071U JP 11809086 U JP11809086 U JP 11809086U JP 11809086 U JP11809086 U JP 11809086U JP S6324071 U JPS6324071 U JP S6324071U
- Authority
- JP
- Japan
- Prior art keywords
- hot wire
- present
- wiping part
- passed
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11809086U JPS6324071U (enExample) | 1986-07-31 | 1986-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11809086U JPS6324071U (enExample) | 1986-07-31 | 1986-07-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6324071U true JPS6324071U (enExample) | 1988-02-17 |
Family
ID=31004214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11809086U Pending JPS6324071U (enExample) | 1986-07-31 | 1986-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6324071U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996022869A1 (en) * | 1995-01-26 | 1996-08-01 | Yugen Kaisha Sanki Seisakusho | Molding method for embedding wire-shaped part in molding |
-
1986
- 1986-07-31 JP JP11809086U patent/JPS6324071U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996022869A1 (en) * | 1995-01-26 | 1996-08-01 | Yugen Kaisha Sanki Seisakusho | Molding method for embedding wire-shaped part in molding |