Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
  • H01L24/98—Methods for disconnecting semiconductor or solid-state bodies
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
  • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
  • H01L24/799—Apparatus for disconnecting

Landscapes

• Engineering & Computer Science (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Electric Connection Of Electric Components To Printed Circuits (AREA)
• Die Bonding (AREA)

Priority Applications (1)

Applications Claiming Priority (1)

Publications (1)

Family

ID=30999114

Family Applications (1)

Country Status (1)

Cited By (1)

• 1986
  • 1986-07-28 JP JP11545086U patent/JPS6322734U/ja active Pending

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