JPS6322678Y2 - - Google Patents

Info

Publication number
JPS6322678Y2
JPS6322678Y2 JP1983008664U JP866483U JPS6322678Y2 JP S6322678 Y2 JPS6322678 Y2 JP S6322678Y2 JP 1983008664 U JP1983008664 U JP 1983008664U JP 866483 U JP866483 U JP 866483U JP S6322678 Y2 JPS6322678 Y2 JP S6322678Y2
Authority
JP
Japan
Prior art keywords
external
lead
insulator
external leads
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983008664U
Other languages
English (en)
Japanese (ja)
Other versions
JPS59115653U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP866483U priority Critical patent/JPS59115653U/ja
Publication of JPS59115653U publication Critical patent/JPS59115653U/ja
Application granted granted Critical
Publication of JPS6322678Y2 publication Critical patent/JPS6322678Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP866483U 1983-01-25 1983-01-25 絶縁物封止半導体装置 Granted JPS59115653U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP866483U JPS59115653U (ja) 1983-01-25 1983-01-25 絶縁物封止半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP866483U JPS59115653U (ja) 1983-01-25 1983-01-25 絶縁物封止半導体装置

Publications (2)

Publication Number Publication Date
JPS59115653U JPS59115653U (ja) 1984-08-04
JPS6322678Y2 true JPS6322678Y2 (h) 1988-06-22

Family

ID=30140147

Family Applications (1)

Application Number Title Priority Date Filing Date
JP866483U Granted JPS59115653U (ja) 1983-01-25 1983-01-25 絶縁物封止半導体装置

Country Status (1)

Country Link
JP (1) JPS59115653U (h)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0419799Y2 (h) * 1986-05-22 1992-05-06
JPH0451489Y2 (h) * 1987-03-31 1992-12-03
KR102192997B1 (ko) * 2014-01-27 2020-12-18 삼성전자주식회사 반도체 소자
JP6373332B2 (ja) * 2016-11-24 2018-08-15 三菱電機株式会社 パワーモジュールの製造方法
WO2024203066A1 (ja) * 2023-03-28 2024-10-03 ローム株式会社 半導体装置および車両

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58209147A (ja) * 1982-05-31 1983-12-06 Toshiba Corp 樹脂封止型半導体装置

Also Published As

Publication number Publication date
JPS59115653U (ja) 1984-08-04

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