JPS63223024A - Resin composition - Google Patents
Resin compositionInfo
- Publication number
- JPS63223024A JPS63223024A JP5533887A JP5533887A JPS63223024A JP S63223024 A JPS63223024 A JP S63223024A JP 5533887 A JP5533887 A JP 5533887A JP 5533887 A JP5533887 A JP 5533887A JP S63223024 A JPS63223024 A JP S63223024A
- Authority
- JP
- Japan
- Prior art keywords
- composition
- polyoxyalkylene glycol
- silica powder
- resin
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims abstract description 35
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 27
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000000843 powder Substances 0.000 claims abstract description 14
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 13
- 239000000835 fiber Substances 0.000 claims abstract description 11
- 150000008065 acid anhydrides Chemical class 0.000 claims abstract description 7
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 7
- 239000003822 epoxy resin Substances 0.000 claims abstract description 5
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 5
- 238000002156 mixing Methods 0.000 claims abstract description 4
- 239000000203 mixture Substances 0.000 abstract description 36
- 239000003365 glass fiber Substances 0.000 abstract description 7
- 230000008646 thermal stress Effects 0.000 abstract description 5
- 238000009413 insulation Methods 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 abstract description 3
- 239000004593 Epoxy Substances 0.000 description 21
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 239000004020 conductor Substances 0.000 description 8
- 230000035882 stress Effects 0.000 description 4
- 229920003319 Araldite® Polymers 0.000 description 3
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 210000003608 fece Anatomy 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- -1 oxyalkylene glycol Chemical compound 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
- 239000010695 polyglycol Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
Landscapes
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【発明の詳細な説明】 〔発明の目的〕 （産業上の利用分野） 本発明は絶縁成形に用いられる樹脂組成物に関する。[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a resin composition used for insulation molding.
（従来の技術）
従来、導体をエポキシ樹脂（以下、エポキシという。）
で絶縁成形するときは、エポキシ樹脂組成物（以下、エ
ポキシ組成物という。）の硬化・収縮による応力や、埋
込んだ導体との熱膨張係数の差によるクランクを防ぐた
め、導体とエポキシ組成物間に可どう性のある樹脂やゴ
ムなどの応力緩和層を設けている。(Prior art) Conventionally, conductors were made of epoxy resin (hereinafter referred to as epoxy).
When performing insulation molding, the conductor and the epoxy composition must be molded to prevent stress caused by curing and shrinkage of the epoxy resin composition (hereinafter referred to as the epoxy composition) and to prevent cranking due to the difference in thermal expansion coefficient between the conductor and the embedded conductor. A stress-relaxing layer made of flexible resin or rubber is provided in between.
（発明が解決しようとする問題点）
しかし、この樹脂やゴムは、高湿度中で加水分解して液
化したり、熱で劣化して特性が下がる。(Problems to be Solved by the Invention) However, these resins and rubbers are hydrolyzed and liquefied in high humidity, or deteriorated by heat, resulting in a decrease in their properties.
そこで、この応力緩和層を省くため、エピ・ビス系エポ
キシ、酸無水物硬化剤及びシリカ粉末を含む樹脂組成物
（以下、組成物という、）に無機短繊維を配合したエポ
キシ組成物（以下、繊維充てんエポキシ組成物という）
と、エピ・ビス系エポキシ、酸無水物硬化剤及びシリカ
粉末を含む組成物にポリオキシアルキレングリコールを
配合したエポキシ組成物（以下ポリグリコール添加エポ
キシ組成物という）を使って単純形状の導体を応力緩和
層なしで成形すると、クラックがでないが、複雑形状で
はできる。更に、ポリグリコール添加エポキシ組成物は
、ポリオキシアルキレングリコールの添加で熱変形温度
が下がり、耐熱性が要るものには使えない。Therefore, in order to eliminate this stress relaxation layer, an epoxy composition (hereinafter referred to as "composition") is prepared by blending inorganic short fibers into a resin composition (hereinafter referred to as "composition") containing epi-bis epoxy, an acid anhydride curing agent, and silica powder. fiber-filled epoxy composition)
Then, an epoxy composition containing polyoxyalkylene glycol (hereinafter referred to as polyglycol-added epoxy composition) is used to stress a simple conductor. Cracks do not occur when molded without a relaxation layer, but they do occur in complex shapes. Furthermore, the addition of polyoxyalkylene glycol lowers the heat distortion temperature of polyglycol-added epoxy compositions, making them unsuitable for applications requiring heat resistance.
本発明の目的は、耐熱性と耐クラツク性に優れた組成物
を得ることにある。An object of the present invention is to obtain a composition having excellent heat resistance and crack resistance.
（問題点を解決するための手段）
本発明の組成物は、エピ・ビス系エポキシと酸無水物硬
化剤に通常のシリカ粉末を配合し、さらに無機短ｗｔｍ
とポリオキシアルキレングリコールを配合して得られる
。(Means for Solving the Problems) The composition of the present invention contains epi-bis epoxy and an acid anhydride curing agent mixed with ordinary silica powder, and further contains an inorganic short wt.
and polyoxyalkylene glycol.
本発明は、樹脂に通常の粉砕や溶融シリカ粉末を配合し
、無機短繊維を高密度に充てんし、さらにポリオキシア
ルキレングリコールを添加して成る組成物である。The present invention is a composition in which a resin is blended with ordinary pulverized or fused silica powder, filled with inorganic short fibers at a high density, and further polyoxyalkylene glycol is added.
（作 用）
上記配合で硬化させた組成物は、シリカ粉末とガラス短
繊維を多く含んでいる（樹脂分が相対的に少ない）ので
、樹脂硬化時の収縮が小さく、熱膨張率が小さい、その
ため、温度変化による導体と樹脂層の熱膨張率の差によ
る熱応力の影響が少なく、更に、ポリオキシアルキレン
グリコールで樹脂に可どう性をもたせ熱応力を緩和して
クラックを防ぐ、一般に、ポリオキシアルキレングリコ
ールを添加すると熱変形温度が下がるが、本発明の組成
物は、ポリオキシアルキレングリコールを添加しても多
量に充てんされたガラス短繊維で熱変形温度は下がらな
い。(Function) The composition cured with the above formulation contains a large amount of silica powder and short glass fibers (relatively low in resin content), so shrinkage during resin curing is small, and the coefficient of thermal expansion is small. Therefore, the influence of thermal stress due to the difference in thermal expansion coefficient between the conductor and the resin layer due to temperature changes is small, and in addition, polyoxyalkylene glycol gives flexibility to the resin to alleviate thermal stress and prevent cracks. Addition of oxyalkylene glycol lowers the heat distortion temperature, but in the composition of the present invention, even if polyoxyalkylene glycol is added, the heat distortion temperature does not decrease due to the glass short fibers filled in a large amount.
（実施例）
以下２本発明の一実施例を説明する。この組成物は、ア
ラルダイトＣＴ２Ｏ０（日本チバガイギー社の商品名）
のエピ・ビス系エポキシ１００重量部、アラルダイトＨ
Ｔ９０３ （日本チバガイギー社の商品名）の酸無水物
硬化剤３０重量部、 クリスタライト（株式会社龍森の
商品名、粒子径１．０５〜３０ミクロン）のシリカ粉末
１６０重量部、サーフニーストランド（日本板硝子社の
商品名、繊維径０．３〜１３ミクロン、長さ４０〜６０
ミクロン）のガラス短繊維１７０重量部、アラルダイト
ＤＹＯ４０（日本チバガイギー社の商品名）のポリオキ
シアルキレングリコール１０重量部を配合する。(Example) Two examples of the present invention will be described below. This composition is Araldite CT2O0 (trade name of Ciba Geigy Japan)
100 parts by weight of epi-bis epoxy, Araldite H
30 parts by weight of acid anhydride curing agent T903 (trade name of Nippon Ciba Geigy), 160 parts by weight of silica powder of Crystallite (trade name of Ryumori Co., Ltd., particle size 1.05 to 30 microns), Surf Knee Strand ( Product name of Nippon Sheet Glass Co., Ltd., fiber diameter 0.3-13 microns, length 40-60
170 parts by weight of short glass fibers (Micron) and 10 parts by weight of polyoxyalkylene glycol Araldite DYO40 (trade name of Ciba Geigy, Japan) were blended.
製造方法は、図のようにエポキシにあらかじめ乾燥した
シリカ粉末を入れ、約１時間減圧下で撹拌し、混練する
。この後、あらかじめ乾燥したガラスＩＭｍ維を徐々に
入れ、約１時間減圧下で撹拌し、混練する。更にこの後
、ポリオキシアルキレングリコールと酸無水物硬化剤を
入れ、再び約１０分減圧下で撹拌する。その後、それを
電気機器の各部分にセットした金型に流し込み、この組
成物を１２０℃で１５時間加熱硬化させ、取出し後、更
に１３０℃で１５時間加熱硬化させる。As shown in the figure, the manufacturing method is to add pre-dried silica powder to epoxy, stir and knead under reduced pressure for about 1 hour. Thereafter, glass IMm fibers that have been dried in advance are gradually added, and the mixture is stirred and kneaded under reduced pressure for about 1 hour. Furthermore, after this, polyoxyalkylene glycol and an acid anhydride curing agent were added, and the mixture was again stirred for about 10 minutes under reduced pressure. Thereafter, it is poured into a mold set in each part of the electrical equipment, and the composition is heated and cured at 120°C for 15 hours, and after being taken out, it is further heated and cured at 130°C for 15 hours.
（実施例の作用）
このように硬化させた組成物は、シリカ粉末とガラス繊
維を多く含んでいる（樹脂分が相対的に少ない）ため、
樹脂の硬化反応による体積収縮率が小さく、熱膨張率も
小さい、そのため、導体と便脂層の熱膨張率の差による
熱応力の影響が小さく、更にポリオキシアルキレングリ
コールにより樹脂に可どう性をもたせ、熱応力を緩和し
てクラックの発生を防ぐ、一般にポリオキシアルキレン
グリコールを加えると熱変形温度が下がるが、本発明の
組成物は、ポリオキシアルキレングリコールが添加され
ても多量に充てんされているガラス短繊維で、熱変形温
度は下がらない。(Effects of Examples) The composition cured in this way contains a large amount of silica powder and glass fiber (relatively small in resin content);
The volumetric shrinkage rate due to the curing reaction of the resin is small, and the thermal expansion coefficient is also small. Therefore, the influence of thermal stress due to the difference in thermal expansion coefficient between the conductor and the feces layer is small, and the polyoxyalkylene glycol adds flexibility to the resin. Generally, adding polyoxyalkylene glycol lowers the heat distortion temperature, but the composition of the present invention is not filled with a large amount even if polyoxyalkylene glycol is added. The heat distortion temperature does not decrease with short glass fibers.
（実施例の効果）
表は、従来のシリカ粉末だけを充てんしたエポキシ組成
物、繊維布てんエポキシ組成物、ポリグリコールエポキ
シ組成物と本発明の組成物の耐クラツク指数、熱変形温
度を示す、耐クラツク指数の測定は、ＩＥＣｐｕｂ ４
５５−２に準じ、オリファントワッシャー法で行った。(Effects of Examples) The table shows the crack resistance index and heat distortion temperature of a conventional epoxy composition filled only with silica powder, a fiber cloth epoxy composition, a polyglycol epoxy composition, and the composition of the present invention. The crack resistance index is measured using IECpub 4
The Oliphant washer method was used in accordance with 55-2.
耐クラツク指数は、従来のシリカ粉末だけを充てんした
エポキシ組成物に比べ約２．７倍に上り、熱変形温度は
４３℃高くなった。また、繊維布てんエポキシ組成物や
ポリオキシアルキレングリコールを添加したエポキシ組
成物の耐クラツク指数は、従来のシリカ粉末だけを充て
んしたエポキシ組成物より上がるが１本発明の組成物よ
りも劣る。つまり、ガラス短繊維とポリオキシアルキレ
ングリコール単独では上がらず１両者の相乗作用で上が
る。The crack resistance index was approximately 2.7 times higher than that of a conventional epoxy composition filled with only silica powder, and the heat distortion temperature was 43°C higher. Furthermore, the crack resistance index of the fiber cloth epoxy composition and the epoxy composition containing polyoxyalkylene glycol is higher than that of the conventional epoxy composition filled only with silica powder, but is lower than that of the composition of the present invention. In other words, short glass fibers and polyoxyalkylene glycol alone do not increase the rate of increase, but the synergistic effect of the two increases.
以下余白
熱変形温度では、ポリオキシアルキレングリコールを添
加したエポキシ組成物は、従来のシリカ粉末だけを充て
んしたエポキシ組成物より１０℃も低い、しかし、本発
明の組成物では、ポリオキシアルキレングリコールの欠
点をガラス短繊維が補っている。The heat distortion temperature of the epoxy composition containing polyoxyalkylene glycol is 10°C lower than that of the conventional epoxy composition filled with only silica powder. The shortcomings are compensated for by short glass fibers.
以上１本発明によれば、特別な応力緩和層を設けること
なく、複雑な導体を成形しても熱応力の繰返しによるク
ラックがなく、熱変形温度の高い組成物を得ることがで
きる。According to the present invention, it is possible to obtain a composition with a high heat deformation temperature without cracking due to repeated thermal stress even if a complex conductor is molded without providing a special stress relaxation layer.
図面は本発明の樹脂組成物の製造工程を示す説明図であ
る。
代理人 弁理士 則 近 憲 佑
同 三俣弘文The drawings are explanatory diagrams showing the manufacturing process of the resin composition of the present invention. Agent Patent Attorney Nori Chika Yudo Hirofumi Mitsumata
Claims (1)
カ粉末を含む樹脂組成物に、無機短繊維とポリオキシア
ルキレングリコールを配合してなる樹脂組成物。A resin composition obtained by blending inorganic short fibers and polyoxyalkylene glycol into a resin composition containing an epi-bis type epoxy resin, an acid anhydride curing agent, and silica powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5533887A JPS63223024A (en) | 1987-03-12 | 1987-03-12 | Resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5533887A JPS63223024A (en) | 1987-03-12 | 1987-03-12 | Resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63223024A true JPS63223024A (en) | 1988-09-16 |
Family
ID=12995734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5533887A Pending JPS63223024A (en) | 1987-03-12 | 1987-03-12 | Resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63223024A (en) |
-
1987
- 1987-03-12 JP JP5533887A patent/JPS63223024A/en active Pending
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