JPS63222452A - Resin seal type semiconductor device - Google Patents
Resin seal type semiconductor deviceInfo
- Publication number
- JPS63222452A JPS63222452A JP5717087A JP5717087A JPS63222452A JP S63222452 A JPS63222452 A JP S63222452A JP 5717087 A JP5717087 A JP 5717087A JP 5717087 A JP5717087 A JP 5717087A JP S63222452 A JPS63222452 A JP S63222452A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead
- hole
- semiconductor device
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title claims abstract description 32
- 229920005989 resin Polymers 0.000 title claims abstract description 32
- 239000004065 semiconductor Substances 0.000 title claims abstract description 26
- 239000000725 suspension Substances 0.000 claims description 25
- 238000007789 sealing Methods 0.000 claims description 2
- 238000000926 separation method Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 4
- 238000010008 shearing Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、樹脂封止形半導体装置において、吊りリー
ドのカット時の吊りリードとｍ脂界面の剥離防止対策に
関するもσ〕である。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a measure for preventing peeling between a suspension lead and an M-lipid interface when cutting the suspension lead in a resin-sealed semiconductor device.
第５図は従来の樹脂封止形半導体装置を示Ｔ平面図、第
６図はその■−■線の断面図、第７図は吊りり゛−ドカ
ット装置の断面図である。これら図において、１はリー
ドフレーム枠、２は吊りリード、３は半導体チップ、４
はフレーム位置決め穴、５は外部リード、６は樹脂、７
は上記吊りリード２、半導体チップ３及びリード５の一
部と共に樹脂６で封止して形成された半導体パッケージ
であり、８．９は上記リードフレーム枠ｌを上下で挾む
ストリッパとダイ、ｌＯは突き落しパンチである。FIG. 5 is a T plan view of a conventional resin-sealed semiconductor device, FIG. 6 is a cross-sectional view taken along line 1--2, and FIG. 7 is a cross-sectional view of a suspended cord cutting device. In these figures, 1 is a lead frame frame, 2 is a hanging lead, 3 is a semiconductor chip, and 4 is a lead frame frame.
is frame positioning hole, 5 is external lead, 6 is resin, 7
8.9 is a semiconductor package formed by sealing with resin 6 together with the hanging lead 2, semiconductor chip 3, and a part of the lead 5; 8.9 is a stripper and die, 10, which sandwich the lead frame frame 1 above and below; is a downward punch.
次に動作について説明する□第５図は半導体バック−シ
フとリードフレーム枠ｌを切り離す前の平面図であり、
リード加工工程において、リード７Ｖ−ム枠ｌに連結し
た半導体パッケージ７をフレーム位置決め穴４で位置決
めし、リード５２所定の寸法に切断してリードを成形し
た後、第７図に示すように、リードフレーム枠１をスト
リッパ８とダイ９で挾み、次いで突き落しパンチｌＯＸ
！Ｅ−プレスで下降させ、半導体パッケージ７を押圧す
る。Next, we will explain the operation. □Figure 5 is a plan view before separating the semiconductor backshift and the lead frame l.
In the lead processing step, the semiconductor package 7 connected to the lead 7V-frame 1 is positioned using the frame positioning hole 4, and the leads 52 are cut to a predetermined size to form the leads. The frame frame 1 is sandwiched between the stripper 8 and the die 9, and then pushed down with a punch lOX
! It is lowered using an E-press and the semiconductor package 7 is pressed.
そして、さらにプレスで突き落しパンチＩＯを下降させ
ると、吊りリード２にせん断力が作用し、吊リリード部
は引きちぎらｎる０そして、落丁した半導体パッケージ
７は製品の排出口に−残ったリードフレーム枠ｌは別の
排出口に排出されるものである。Then, when the punch IO is further lowered by the press, a shearing force is applied to the suspension lead 2, and the suspension relead part is torn off.Then, the fallen semiconductor package 7 is placed at the product outlet - the remaining lead frame. Frame l is for discharging to another discharge port.
ところが以上のような製造工程で吊りリード２を切断す
る際、吊りリードにせん断力と引張り力がかかることに
より、吊りリードと樹脂の接触面か剥離し易くなる。そ
して吊りリードと樹脂の界面が剥°離すると、そのｗｍ
面から水分等が侵入し、半導体チップ３の信頼性を損な
うなどの問題点があった。即ち第８図は吊りリード近傍
の樹脂部の剥離状態を示す断面図で、吊りリード２と樹
脂６の間に丁きま口が生じた状態を示している。However, when the suspension lead 2 is cut in the manufacturing process as described above, shearing force and tensile force are applied to the suspension lead, so that the contact surface between the suspension lead and the resin tends to peel off. When the interface between the hanging lead and the resin peels off, the
There was a problem in that moisture etc. entered from the surface, impairing the reliability of the semiconductor chip 3. That is, FIG. 8 is a sectional view showing a peeled state of the resin portion near the suspension lead, and shows a state in which a gap has been created between the suspension lead 2 and the resin 6.
この発明は上記のような問題点を解消Ｔるためになされ
たもので、吊りリードの切り離し時に、吊りリードと樹
脂の間のすきまの発生を防ぐことができ、信頼性の高い
半導体装置を得ることを目的とする。This invention was made to solve the above-mentioned problems, and it is possible to prevent a gap from forming between the suspension lead and the resin when the suspension lead is cut off, thereby obtaining a highly reliable semiconductor device. The purpose is to
この発明に係る樹脂封止形半導体装置は、吊りリードの
樹脂内部に、該吊りリードカットする孔もしくは凹部を
設けたものである。In the resin-sealed semiconductor device according to the present invention, a hole or a recess for cutting the suspension lead is provided inside the resin of the suspension lead.
この発明においては、吊りリードに設けた貫通孔もしく
は凹部内に樹脂が流れ込んで硬化し、その連結作用によ
り、リードフレーム枠と半導体パッケージの切り離し時
に、吊りリードと樹脂部の間に丁きまの発生を防止する
０
〔実施例〕
第１図はこの発明の一実施例を示す平面図、第２図はそ
の■−■線の断面図であり、図において、１１は吊りリ
ード２の樹脂内部に設けらｎた貫通孔である。なお、そ
の他のＷ４成は従来例と同様であるので説明を省略する
。このような貫通孔１１をもつ吊りリード２を従来と同
様な方法で樹脂封止すると、貫通孔Ｈの中に樹脂が流ｎ
込んで、硬化するようになる。その後は従来の半導体装
置と同様に、タイバカット、リードカット、リード成形
し、従来の吊りリードカットｉｕｔでカットする。In this invention, the resin flows into the through holes or recesses provided in the hanging lead and hardens, and due to its connecting action, a gap is created between the hanging lead and the resin part when the lead frame frame and the semiconductor package are separated. [Embodiment] Fig. 1 is a plan view showing an embodiment of the present invention, and Fig. 2 is a cross-sectional view taken along the line ■-■. There are two through holes provided. Note that the other W4 configurations are the same as those in the conventional example, so explanations will be omitted. When the suspension lead 2 having such a through hole 11 is sealed with resin in the same manner as in the conventional method, the resin flows into the through hole H.
It becomes dense and hardens. Thereafter, tie bar cutting, lead cutting, and lead shaping are performed in the same manner as conventional semiconductor devices, and cutting is performed using a conventional hanging lead cut IUT.
以上のように、吊りリード２の貫通孔Ｕには、樹脂が充
満して硬化し、吊りリードの上面樹脂と下面の樹脂を強
く連結Ｔるため、吊りリードの引きちぎり時のせん断や
引張りに対して大きな抵抗になる。従って、吊りリード
の引きちぎり時に、吊りリードに力が掛っても、吊りリ
ードと樹脂の境界は容易にはすべりを起こさず、第８図
のように境界にすきまが発生しなくなる。As described above, the through hole U of the suspension lead 2 is filled with resin and hardened to strongly connect the resin on the upper surface and the resin on the lower surface of the suspension lead. There will be great resistance against it. Therefore, even if a force is applied to the suspension lead when the suspension lead is torn off, the boundary between the suspension lead and the resin does not easily slip, and no gap is generated at the boundary as shown in FIG. 8.
なお上記実施例では、吊りリードを貫通する孔Ｕを設け
たが、ｗ１４図のように吊りリードを貫通しない凹ｓ１
２を設けてもよく、上記実施例と同様の効果ご奏する。In the above embodiment, a hole U that penetrates the suspension lead is provided, but a recess s1 that does not penetrate the suspension lead is provided as shown in figure w14.
2 may be provided, and the same effect as in the above embodiment can be achieved.
以上のようにこの発明によｎば・吊りリードの樹脂内部
に貫通孔あるいは凹部を構成し、その中に樹脂が充満す
るようにしたので、吊りリードの引きちぎり時における
樹脂と吊りリードの界面の剥離を防止し、信頼性の高い
半導体装置が得られる効果がある。As described above, according to the present invention, a through hole or a recess is formed inside the resin of the suspension lead, and the resin is filled in the through hole or recess, so that the interface between the resin and the suspension lead when the suspension lead is torn off. This has the effect of preventing peeling of the film and providing a highly reliable semiconductor device.
第１肉はこの発明の一実施例を示す平面図、第２図はそ
の■−■線の断面図、ＢＳ図は吊りリードカット後の状
態を示Ｔ側面図・第４図はこの発明σ〕他の実施例を示
す断面図・第５図は従来の半導体装置を示す平面図、第
６図は第５図の■−■線の断面図、第７図は吊りリード
カット装置を示Ｔ側面図、第８図は従来の吊りリードカ
ット後の半導体装置を示す側面図で、ＷＸＢ図に対応す
る図である。
図中、ｌはリードフレーム枠、２は吊りリード、３は半
導体チップ、５はリード、６＆ス樹脂、７は半導体パッ
ケージ、１１は貫通孔、１２Ｇ：！凹部である。
尚・図中同一符号は同一または相当部分を示す。The first figure is a plan view showing one embodiment of the present invention, the second figure is a cross-sectional view taken along the line ■-■, the BS figure shows the state after cutting the hanging lead, the T side view, and the fourth figure is the present invention σ ] Cross-sectional view showing another embodiment - Figure 5 is a plan view showing a conventional semiconductor device, Figure 6 is a cross-sectional view taken along the line ■-■ in Figure 5, and Figure 7 shows a hanging lead cutting device. A side view, FIG. 8 is a side view showing a conventional semiconductor device after cutting the hanging leads, and corresponds to the WXB diagram. In the figure, l is a lead frame frame, 2 is a hanging lead, 3 is a semiconductor chip, 5 is a lead, 6 & resin, 7 is a semiconductor package, 11 is a through hole, 12G:! It is a recess. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
ム枠とを吊りリードにより連結してなる樹脂封止形半導
体装置において、上記半導体パッケージの樹脂内部にあ
つて、上記吊りリードを貫通する孔もしくは凹部を設け
たことを特徴とする樹脂封止形半導体装置。（２）吊り
リードの貫通孔もしくは凹部は封止樹脂の端辺近傍に設
けられている特許請求の範囲第１項記載の樹脂封止形半
導体装置。(1) In a resin-sealed semiconductor device in which a resin-sealed semiconductor package and a lead frame are connected by a hanging lead, a hole or a recess that penetrates the hanging lead is inside the resin of the semiconductor package. A resin-sealed semiconductor device characterized by being provided with. (2) A resin-sealed semiconductor device according to claim 1, wherein the through hole or recess of the suspension lead is provided near an edge of the sealing resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5717087A JPS63222452A (en) | 1987-03-11 | 1987-03-11 | Resin seal type semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5717087A JPS63222452A (en) | 1987-03-11 | 1987-03-11 | Resin seal type semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63222452A true JPS63222452A (en) | 1988-09-16 |
Family
ID=13048072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5717087A Pending JPS63222452A (en) | 1987-03-11 | 1987-03-11 | Resin seal type semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63222452A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0788157A3 (en) * | 1996-02-01 | 2004-02-25 | NEC Compound Semiconductor Devices, Ltd. | Resin molded package with excellent high frequency characteristics |
-
1987
- 1987-03-11 JP JP5717087A patent/JPS63222452A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0788157A3 (en) * | 1996-02-01 | 2004-02-25 | NEC Compound Semiconductor Devices, Ltd. | Resin molded package with excellent high frequency characteristics |
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