JPS63215266A - Ccd video camera equipment - Google Patents

Abstract

PURPOSE:To prevent the invasion of external noise from a connection cable or the like by mounting a drive circuit driving electrically a solid-state image pickup element onto a camera heat. CONSTITUTION:The camera head 10 consists of a lens 11, a CCD (charge cou pled device) 12, a sample holding circuit (preamplifier section 13 and a drive circuit 14 for driving a CCD. The CCD 12, the sample holding circuit 13 and the drive circuit 14 are mounted onto the camera head 10, resulting that the disadvantage of deteriorated S/N is eliminated without increasing the size of the head.

Description

Detailed Description of the Invention (Industrial Applications! 7) The present invention provides a solid-state imaging camera (particularly a CCD camera) in which the camera body and the camera head are separate structures, in which a COD drive circuit is installed in the camera head. etc.

The present invention relates to a solid-state imaging device that is equipped with a plurality of block circuits to improve various characteristics.

(Prior Art) As a conventional solid-state imaging device (particularly a CCD camera), for example, as shown in FIG. 4, the camera head l including the objective lens is constructed separately from the camera body 2 and is connected using a multi-core cable. In addition to the connection, there is also a camera head l equipped with a charge-coupled device (COD) 3. The circuit shown in FIG. 4 is a basic operating circuit that omits additional circuits in the currently commonly used interline transfer method and frame transfer method, and includes a charge-coupled device 3,
The circuit configurations differ somewhat depending on the surrounding IC groups.

The purpose of separating the camera head section 1 from the main body 2 is to obtain the optimal shooting position for the subject depending on the installation space of the camera at the shooting location and other environmental restrictions. The request is big.

Due to such demands for reduction in size and weight, until now it has only been possible to mount a charge-coupled device 3 in addition to the lens in the camera head, and a relatively large charge-coupled device drive circuit,
The other circuits were built into the second part of the camera body.

(Problems to be Solved by the Invention) However, the conventional solid-state imaging device described above has a structure in which the camera body and the camera head are separated and connected by a multi-core cable, and the output voltage of one part to the camera is small. Because the S/N is small, the length of the connection cable between the camera head and the camera body must be several meters (approximately 1 to 2 meters).
If the extension is longer than this, attenuation will increase, and noise such as electric fields, low frequencies, high frequencies, electric fields, magnetism, a-sonic waves, mechanical ridges, etc. that enter the head, connection cable, and main body from the outside or internal noise will increase. There is a problem in that target noise is superimposed, degrading the S/N ratio. If a drive circuit is mounted on the head side to solve the problem of such attenuation and a decrease in S/N ratio due to external noise, there is a risk that the head section will become larger as described above. It is possible to increase the output from the camera head by installing an amplifier in the camera head, but installing an amplifier increases the size of the head.
Similar problems arise, such as a reduction in the S/N ratio and furthermore, the above-mentioned external noise enters from the connection cable etc. and causes superimposition.

(Means for Solving the Problems) The present invention has been made in view of the above, and it is possible to mount a charge-coupled device and its drive circuit in the camera head without increasing the size of the camera head. It is an object of the present invention to provide a solid-state imaging device that solves problems such as a decrease in S/N ratio.

In order to achieve the above object, the solid-state imaging device of the present invention includes:
It consists of a camera head section equipped with an objective lens and a solid-state image sensor, a camera body section that has an RGB matrix circuit, a process amplifier circuit, an encoder circuit, etc.; In a solid-state imaging device, which is a separate structure connected by a cable.

A feature of the camera head is that a drive circuit for electrically driving the solid-state image sensor is mounted on the camera head.

(Example) Hereinafter, the solid-state imaging device of the present invention will be explained in detail.

FIG. 1 is a block diagram showing the overall configuration of an embodiment of the present invention, and FIG. 2 is an external view of the camera head section.

This solid-state imaging device includes a camera head section 10.

It consists of a -2 drive section 10 and a camera amplifier section (main body section) 20 connected to the camera via a multi-core cable 19. The camera head section 10 and the camera amplifier section 20 are housed in independent casings.

The camera head section 10 includes a lens 11, a CCD (charge coupled device) 12, a sample hold circuit (and preamplifier section) 13, and a drive circuit 14 for driving COD.

The camera amplifier section 20 includes a timing generator circuit 2
1, an RGB matrix circuit 23, a process amplifier circuit 24, an encoder circuit 25, and a power supply circuit 26. The power source may also be of separate construction.

The circuit configuration of the camera is determined by the CCD 12, its surrounding ICs, and other parts, but there are some differences in the attached circuits determined based on the type of CCD 12 and its specifications. For example, MID-272 (or VI
D-267) as the sample hold circuit 13.
-1593 as the drive circuit 14, TMS-3472,
3473 respectively. Further, for example, the timing generator circuit 21 of the camera amplifier section 20 may be TMS-3471, the matrix circuit 23 may be TL-4558, and the process amplifier 24 may be HA.
-11767 or HA-11775, encoder circuit 2
HA-11776 is used as No. 5.

CCD12. ! - VID-270, - Kono et al.
The same effect can be obtained by using 220, -263, and 287.

The CCD 12 photoelectrically converts the condensed image from the lens 11, and the sample hold circuit (and preamplifier section) 13
Correlationally samples the signal from CD12 and outputs it to CCD12.
The signal and no signal are compared and amplified. Drive circuit 1
4 is a CCD for the signal of the timing generator circuit 21.
This is a circuit that converts it to a level that can drive l2. The timing generator circuit 21 is necessary for driving the CCD 12 and generates timing signals of various pulse signals such as lock pulses and field pulses, and the shutter circuit 22 converts the clock signal from the timing generator 21 to 1/4000 using a pulse counter circuit. The CCD 21 is made to scan at high speed. In addition, a theoretical circuit is used to determine frequency division. RGB matrix circuit 2
3 is a circuit that performs color separation into three colors, RED, GREEN, and BULUE, and each color signal separated by the RGB matrix circuit 23 is amplified by the process amplifier 24, and converted to a video signal by the encoder amplifier 25, and is sent to the video camera. It is considered as output.

An LPF (low bus filter) located between the RGB matrix circuit 23 and the process amplifier 24 has an R
Each of the GB dye signals is selected and passed through.

The power supply 26 supplies the necessary voltage and current to each circuit.

The circuit of the camera head and the circuit of the camera body as described above are connected via a multi-core cable 19 and are configured to operate as one unit.

FIG. 2 shows the external configuration of the camera head section 10-, which houses a small-diameter cylindrical first case 30 that houses an objective lens, a CCD 12° sample hold circuit 13, and a drive circuit 14. It is integrally constructed with a second case 31 having a large diameter cylindrical shape. With this configuration, the output voltage of the camera head section can be set as high as about 8Vp-p, and the noise signal mixed in from the connection cable 19 can be reduced, and the separation interval between the camera head section and the camera amplifier section can be set to 1 to 1. It is possible to eliminate operational disadvantages that may occur when the distance is set to 2 m or more.

The reason why such characteristics and operational advantages can be obtained by housing the sample hold circuit 13 and the drive circuit 14 in addition to the CCD 12 in the second case 31 of the camera head is that COD As a frame transfer method COD, especially virtual phase C
CD especially VID-220, 263, 267, 270, 2
This is due to the use of 72 (product name). That is,
For example, by using the VID-272, it becomes possible to use the TMS-3472, 3473, which are small and lightweight drive circuits, and the TL-1593, which is a sample and hold circuit.

A circular printed circuit board (not shown) is disposed in the second case 31 in parallel with the lens 11 in the first case 30, and the CCD 11 receives image information focused by the lens 11. It is positioned on the printed circuit board. Therefore, the light receiving portion of the COD is located coaxially with the lens. Since the first case 30 is eccentric in the outer radial direction (for example, downward) with respect to the axis of the second case 31, C
A space is formed inside the case 31 in the outer diameter direction (for example, below) from the storage position of the CD, and CO2 is stored in this space.
It becomes possible to mount ICs other than D.

In the above configuration, the condensed image from the lens 11 is CG
The signal from the CCD 12 is photoelectrically converted by D l 2, and the signal from the CCD 12 is sampled in a correlated manner by a sample and hold circuit 13. A timing signal from a timing generator circuit 21 that generates timing signals of various pulse signals necessary to drive the CCD 12 is converted by a drive circuit 14 to a level that allows the CCD 12 to be driven.

Among these main circuits, the CCD 12, sample hold circuit 13, and drive circuit 14 are installed inside the camera head section 10.
As a result, it is possible to solve problems such as a decrease in the S/N ratio without increasing the size of the head.

(Effects of the Invention) As described above, according to the solid-state imaging device of the present invention, (1) the output voltage from the camera head is as high as 8Vp-p, and the connection cable between the camera head and the camera body and from the main body are Mixing of various noises can be relatively reduced. Therefore, noise is less likely to be superimposed on the imaging signal from the camera head, and the S/N ratio is improved.

(2) Since the output voltage of the camera head is large, the connection cable between the camera head and the camera body can be made longer or thinner. Therefore, the camera head can be installed and used at a long distance from the main body, and since the head is small and lightweight, the range of use can be expanded.

[Brief explanation of the drawing]

FIG. 1 is a block diagram showing the overall configuration of an embodiment of the present invention, FIG. 2 is an external view of a camera head, and FIG. 4 is a block diagram showing the configuration of a conventional example. sign

Claims (1)

[Scope of Claims] Consisting of a camera head section equipped with an objective and a solid-state image sensor, a camera body section having an RGB matrix circuit, a process amplifier circuit, and an encoder circuit, the camera head section, A solid-state imaging device having a separate structure connected to a camera body by a cable, characterized in that a drive circuit for electrically driving the solid-state imaging device is mounted on the camera head. .