JPS632126U - - Google Patents
Info
- Publication number
- JPS632126U JPS632126U JP9614686U JP9614686U JPS632126U JP S632126 U JPS632126 U JP S632126U JP 9614686 U JP9614686 U JP 9614686U JP 9614686 U JP9614686 U JP 9614686U JP S632126 U JPS632126 U JP S632126U
- Authority
- JP
- Japan
- Prior art keywords
- temperature sensor
- outside
- electronic device
- casing
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012778 molding material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Description
第１図はこの考案の実施例である電子機器の主
要部を表す図、第２図は同電子機器に組み込まれ
る温度センサの外観を表す図、第３図Ａ〜Ｅは同
温度センサの製造手順を表す図、第４図は他の実
施例に係る温度センサを表す。第５図Ａ，Ｂは従
来用いられている温度センサの形状を表す図、第
６図は第５図Ａに示した温度センサの使用例を表
す図である。
１…温度センサ、２…筐体、３…回路基板、５
…温度センサ素子、６…保護膜、１０…略円柱状
部、１１…フランジ部。
Fig. 1 is a diagram showing the main parts of an electronic device that is an embodiment of this invention, Fig. 2 is a diagram showing the external appearance of a temperature sensor incorporated in the electronic device, and Figs. 3 A to E are manufacture of the same temperature sensor. A diagram showing the procedure, FIG. 4, shows a temperature sensor according to another embodiment. 5A and 5B are diagrams showing the shape of a conventionally used temperature sensor, and FIG. 6 is a diagram showing an example of use of the temperature sensor shown in FIG. 5A. 1... Temperature sensor, 2... Housing, 3... Circuit board, 5
...Temperature sensor element, 6...Protective film, 10...Substantially cylindrical part, 11...Flange part.
Claims (1)
えた電子機器において、 前記外気温センサは、 リード先端部に温度センサ素子が電気的に接続
され、この温度センサ素子の周囲に、リード側を
フランジ部とし、頭部側を略円柱状または略角柱
状に成形されたモールド材によりモールドされた
温度センサを前記筐体に設けられた開口部より筐
体外部に対向配置して構成したことを特徴とする
電子機器。[Scope of Claim for Utility Model Registration] In an electronic device equipped with an outside temperature sensor that detects the outside temperature outside the housing, the outside temperature sensor has a temperature sensor element electrically connected to the tip of a lead, and the temperature sensor A temperature sensor is molded around the element with a molding material having a flange on the lead side and a substantially cylindrical or prismatic shape on the head side, and is exposed to the outside of the casing through an opening provided in the casing. An electronic device characterized by being configured so that they are arranged facing each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9614686U JPS632126U (en) | 1986-06-23 | 1986-06-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9614686U JPS632126U (en) | 1986-06-23 | 1986-06-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS632126U true JPS632126U (en) | 1988-01-08 |
Family
ID=30961571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9614686U Pending JPS632126U (en) | 1986-06-23 | 1986-06-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS632126U (en) |
-
1986
- 1986-06-23 JP JP9614686U patent/JPS632126U/ja active Pending
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