JPS63207990A - Manufacture of heat exchange element - Google Patents
Manufacture of heat exchange elementInfo
- Publication number
- JPS63207990A JPS63207990A JP62041114A JP4111487A JPS63207990A JP S63207990 A JPS63207990 A JP S63207990A JP 62041114 A JP62041114 A JP 62041114A JP 4111487 A JP4111487 A JP 4111487A JP S63207990 A JPS63207990 A JP S63207990A
- Authority
- JP
- Japan
- Prior art keywords
- hot melt
- melt resin
- melting point
- low melting
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 229920005989 resin Polymers 0.000 claims abstract description 51
- 239000011347 resin Substances 0.000 claims abstract description 51
- 239000012943 hotmelt Substances 0.000 claims abstract description 45
- 238000002844 melting Methods 0.000 claims abstract description 41
- 230000008018 melting Effects 0.000 claims abstract description 40
- 239000000463 material Substances 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 15
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 238000005304 joining Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 239000002985 plastic film Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 abstract description 10
- 238000000576 coating method Methods 0.000 abstract description 10
- 238000005520 cutting process Methods 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000004831 Hot glue Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
- F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野コ
この発明は積層構造を成すプレート・フィン型の熱交換
素子の製造方法、より詳しくは積層した構成単位とな１
部材のそれぞれを一挙に接合することができる製造方法
に関するものである。[Detailed Description of the Invention] [Industrial Field of Application] This invention relates to a method for manufacturing a plate-fin type heat exchange element having a laminated structure, more specifically, a method for manufacturing a plate-fin type heat exchange element having a laminated structure.
The present invention relates to a manufacturing method that allows members to be joined at once.
［従来の技術］
プレート・フィン型の熱交換素子は単位体積当たりの伝
熱面積が広く、比較的小形で高効率の熱交換素子として
広く用いられている。それらは熱交換すべき二流体の流
れ方の違いから、向流型、対向流型及び交差流型（直交
、斜交を含む）に分けることができるが、空調装置に対
しては対向流型や直向流型が多く採用されている。この
種のものの基本的な構成は、例えば特公昭４７−１９９
９０号公報に開示されている。[Prior Art] A plate-fin type heat exchange element has a large heat transfer area per unit volume, and is widely used as a relatively small and highly efficient heat exchange element. They can be divided into counterflow type, counterflow type, and crossflow type (including orthogonal and diagonal) based on the flow of the two fluids to exchange heat, but for air conditioners, counterflow type The direct flow type is often used. The basic structure of this kind of thing is, for example,
It is disclosed in Publication No. 90.
即ち、第４図の斜視図によって示すように、熱交換すべ
き二流体を仕切るプレート１０１を複列の平行流路を構
成する波形状のフィン１０２を挟んで積層したものであ
る。空調用の熱交換素子１００にあってはそのプレート
１０１が、伝熱性と透湿性を合わせ持つ紙質をベースに
した加工紙で形成され、フィン１０２もプレート１０１
と同様な紙材を波形加工することで得られている。上記
熱交換素子１００は、第５図に示されているプレート１
０１とフィン１０２から構成される単位部材１０３を予
め作っておいて２、この単位部材１０３を平行流路が交
互に直交するように複数枚積層することで製造されてき
たが、生産性があまり高くなく、高コストでもあった。That is, as shown in the perspective view of FIG. 4, plates 101 for partitioning two fluids to be heat exchanged are stacked with corrugated fins 102 forming double rows of parallel flow paths interposed therebetween. In the heat exchange element 100 for air conditioning, the plate 101 is formed of processed paper based on a paper that has both heat conductivity and moisture permeability, and the fins 102 are also made of plate 101.
It is obtained by corrugating a similar paper material. The heat exchange element 100 includes a plate 1 shown in FIG.
01 and fins 102 are made in advance, and a plurality of unit members 103 are laminated so that the parallel channels are alternately orthogonal to each other, but the productivity is low. It wasn't expensive, but it was also expensive.
そこで、性能の向上と生産性の向上とを可能にする第６
図に示すような構成の熱交換素子２００が開発された（
特開昭６１−１８６７９５号公報）。この熱交換素子２
００は、フィンに相当する部材をプレート２０１との結
合性の良い非金属材料製の棒状ないしは紐状のリブ２０
２とし、プレート２０１上に任意の高さ及びピッチのリ
ブ２０２を精度良く配設して第７図に示すような単位部
材２０３を形成しつつリブ２０２のプレート２０１側と
反対の端面に接着剤を塗布し、各単位部材２０３を積層
し接合させることによって製造されている。Therefore, the sixth method that enables improved performance and productivity is
A heat exchange element 200 having the configuration shown in the figure was developed (
(Japanese Unexamined Patent Publication No. 61-186795). This heat exchange element 2
00, the member corresponding to the fin is a rod-shaped or string-shaped rib 20 made of a non-metallic material that has good bonding properties with the plate 201.
2, and while forming a unit member 203 as shown in FIG. 7 by accurately arranging ribs 202 of arbitrary height and pitch on a plate 201, adhesive is applied to the end surface of the ribs 202 opposite to the plate 201 side. It is manufactured by coating the unit members 203 and stacking and joining each unit member 203.
［発明が解決しようとする問題点］
上記した従来の熱交換素子の製造において、単位部材２
０３を精度良く積層することは、リブ２０２の端面に塗
布した粘着性のある接着剤が接合時に拘束作用を呈し位
置の修正を阻む働きをするために困難度が高く、不良品
が出易いこともあって現実には生産性はそれ程向上しな
いといった問題点がある。[Problems to be Solved by the Invention] In manufacturing the above-described conventional heat exchange element, the unit member 2
Accurately stacking 03 is highly difficult because the sticky adhesive applied to the end surface of the rib 202 acts as a restraint during bonding and prevents correction of the position, resulting in the production of defective products. However, in reality, there is a problem that productivity does not improve that much.
従って単位部材の積層工程においては粘着性を示さず、
積層が完了し各単位部材を位置決めした後、−挙に単位
部材群を接合できる方法が要望されている。Therefore, it does not exhibit adhesion during the lamination process of unit members,
There is a need for a method that can join a group of unit members all at once after lamination is completed and each unit member is positioned.
この発明は上記のような問題点を解消するとともに、上
記要望を満たすためになされたもので、熱交換素子の性
能向上が図れ、生産性に優れた熱交換素子の製造方法を
提供することを目的とする。This invention has been made to solve the above-mentioned problems and to satisfy the above-mentioned needs.It is an object of the present invention to provide a method for manufacturing a heat exchange element that can improve the performance of the heat exchange element and has excellent productivity. purpose.
［問題点を解決するための手段］
この発明の熱交換素子の製造方法は、平板状のプレート
の一面に熱媒体が流通する並行流路を構成するフィンを
並列にホットメルト樹脂で接着して単位部材を形成する
工程、上記フィンのプレートと反対側の端面に上記フィ
ンを接着するホットメルト樹脂よりも溶融温度の低い低
融点ホットメルト樹脂を塗布する工程、上記単位部材の
低融点ホットメルト樹脂を塗布した端面と次段のプレー
トの他面とを合わせて上記単位部材を複数個積層する工
程、及び積層した単位部材群を低融点ホットメルト樹脂
の溶融温度より高く上記フィンとプレートとの接着に供
したホットメルト樹脂の溶融温度より低い温度で加熱し
て上記単位部材群を接合する工程を施すものである。[Means for Solving the Problems] The method for manufacturing a heat exchange element of the present invention includes bonding fins constituting parallel flow paths through which a heat medium flows on one surface of a flat plate in parallel with hot melt resin. a step of forming a unit member; a step of applying a low melting point hot melt resin having a lower melting temperature than the hot melt resin bonding the fin to the end surface of the fin opposite to the plate; a low melting point hot melt resin of the unit member; A step of stacking a plurality of unit members by matching the end surface coated with the other surface of the next plate, and adhering the stacked unit members to a temperature higher than the melting temperature of the low melting point hot melt resin with the fins and the plate. The unit member group is joined by heating at a temperature lower than the melting temperature of the hot melt resin subjected to the process.
し作用］
この発明においては、単位部材積層時には単位部材相互
を接合する低融点ホットヌル１〜樹脂が接着性を示さな
いので、単位部材相互の位置調整が可能になり、精度良
く早く単位部材を積層することができるとともに、単位
部材同志の接着時には単位部材にかける温度を設定する
ことで精度良く積層した単位部材群をそのままの状態で
一挙に低融点ホットメルト樹脂によって接合できる。In this invention, since the low melting point hot null 1~resin that joins the unit members together does not exhibit adhesive properties when unit members are laminated, it is possible to adjust the positions of the unit members, and the unit members can be laminated quickly and accurately. In addition, by setting the temperature applied to the unit members when adhering the unit members together, the group of unit members laminated with high precision can be bonded together in one go using a low melting point hot melt resin in the same state.
［実施例］
この発明における平板状のプレートとしては種々の紙材
、加工紙の池にプラスチックシートや薄い金属板を用い
ることもできる。前者の場合は顕熱く温度）ばかりでな
く潜熱（湿度）の交換も行われるため全熱交換素子が製
造される。[Example] As the flat plate in this invention, various paper materials, a plastic sheet or a thin metal plate can be used for processed paper. In the former case, a total heat exchange element is manufactured because not only sensible heat (temperature) but also latent heat (humidity) is exchanged.
後者の場合は顕然の交換を行う熱交換素子が製造される
。In the latter case, heat exchange elements are produced that perform overt exchange.
フィンを形成する材料としては、紙材１紙紐。The materials for forming the fins are paper material and paper string.
合成樹脂を棒状又は紐状に成形したもの或は、上記材料
の混成物を棒状ないしは紐状にしたものが用いられる。A synthetic resin molded into a rod or string shape, or a mixture of the above materials molded into a rod or string shape is used.
ホットメルト樹脂としては積層後の加熱接着時にプレー
トとフィンとの結合性を損わない様に、フィンの頂上部
に塗布する低融点ホットメルト樹脂との関係の基に、Ｅ
ＶＡ（エチレン−ビニルアセテート）系、ポリアミド系
、ポリエステル系等がプレートとフィンの材質に応じて
適宜選択される。As a hot melt resin, E is selected based on its relationship with the low melting point hot melt resin applied to the top of the fin so as not to damage the bond between the plate and the fin during heat bonding after lamination.
VA (ethylene-vinyl acetate), polyamide, polyester, etc. are appropriately selected depending on the materials of the plate and fins.
次にこの発明の一実施例を図について説明する。第１図
は、この一実施例に係わる単位部材を積層・接着する工
程までを施す製造ラインを示す構成図である。図におい
て１はロール巻きにされた平板状のプレート、２はフィ
ン材料、３はホットメルト樹脂、４は樹脂塗布装置、５
は低融点ホットメルト樹脂、６は低融点ホットメルト樹
脂塗布装置、７は切断装置、８は積上げ装置、９は加熱
装置を示す。紐状のフィン材料２はストッカー１０から
引き出され、ガイドビン１１．ガイドローラー１２．テ
ンションローラー１３．ガイドローラー１４を経て接着
ローラー１５に巻かれ、ここで樹脂塗布装置４により一
端面に連続的にホットメルト樹脂３が塗布されて下側か
ら供給される平板状のプレート１の上に供給され、押さ
えローラー１６によりプレート１に圧着される。フィン
材料２を接着されたプレート１は、送りローラー１７に
より低融点ホットメルト樹脂塗布装置６へ導かれる。Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a configuration diagram showing a manufacturing line that performs steps up to the step of laminating and bonding unit members according to this embodiment. In the figure, 1 is a rolled flat plate, 2 is a fin material, 3 is a hot melt resin, 4 is a resin coating device, and 5
6 is a low melting point hot melt resin, 6 is a low melting point hot melt resin coating device, 7 is a cutting device, 8 is a stacking device, and 9 is a heating device. The string-like fin material 2 is pulled out from the stocker 10 and placed in the guide bin 11. Guide roller 12. Tension roller 13. It is wound around an adhesive roller 15 via a guide roller 14, and here a hot melt resin 3 is continuously applied to one end surface by a resin coating device 4, and then supplied onto a flat plate 1 which is supplied from below. It is pressed onto the plate 1 by a pressing roller 16. The plate 1 with the fin material 2 adhered thereto is guided by a feed roller 17 to a low melting point hot melt resin coating device 6 .
溶融した低融点ホットメルト樹脂５は、ホットメルトア
プリケータ１８により低融点ホットメルト樹脂塗布装置
６へ供給されて、フィン材料２の頂上部に薄く塗布され
る。フィンの上に塗布する低融点ホットメルト樹脂５と
してはエチレンと酢酸ビニルの共重合体にワックスを配
合したいわゆるホットメルト接着剤が好適である。The melted low melting point hot melt resin 5 is supplied by the hot melt applicator 18 to the low melting point hot melt resin coating device 6, and is thinly applied to the top of the fin material 2. As the low melting point hot melt resin 5 applied on the fins, a so-called hot melt adhesive made of a copolymer of ethylene and vinyl acetate mixed with wax is suitable.
ホットメルト接着剤の溶融温度はワックスの種類あるい
は配合量を変えることにより６０〜１２０°Ｃの温度範
囲で任意に変えることができ、この実施例では溶融温度
が６０〜９０’Ｃのホットメルト接着剤を用いた。低融
点ホットメルト樹脂５の塗布された部材は、切断装置７
へ供給されて所定の寸法に切断されて単位部材１９とな
る。この単位部材１９は積上げ装置８で平行流路が一段
おきに直交する様に枠の中に複数枚積層される。積層さ
れた単位部材１つは、枠の中で位置決めされた後、上部
から荷重をかけられながら加熱装置９へ供給され、低融
点ホットメルト樹脂５の軟化点より５〜１０’Ｃ高く、
プレート１とフィンとを結合しているホットメルト樹脂
３の軟化点より低い温度の温風を５〜２０分程度公租さ
れる。これにより、低融点ホットメルト樹脂５のみが選
択的に軟化し接着性を呈して熱交換器として機能する単
位部材群のブロックとなる。このブロックは枠より取り
出されて、機器組込みの為の取付棒に入れられ、完成品
の熱交換器となる。The melting temperature of the hot melt adhesive can be arbitrarily changed within the temperature range of 60 to 120°C by changing the type or amount of wax, and in this example, the hot melt adhesive has a melting temperature of 60 to 90°C. A drug was used. The member coated with the low melting point hot melt resin 5 is cut by a cutting device 7.
The unit members 19 are supplied to the unit member 19 and cut into predetermined dimensions. A plurality of unit members 19 are stacked in a frame by a stacking device 8 so that the parallel flow paths are perpendicular to each other. After being positioned in the frame, one stacked unit member is supplied to the heating device 9 while being loaded from above, and is 5 to 10'C higher than the softening point of the low melting point hot melt resin 5.
Warm air at a temperature lower than the softening point of the hot melt resin 3 bonding the plate 1 and the fins is allowed to flow for about 5 to 20 minutes. As a result, only the low melting point hot melt resin 5 selectively softens and exhibits adhesive properties, forming a block of unit members that function as a heat exchanger. This block is taken out from the frame and placed in a mounting rod for assembly into equipment, forming a finished heat exchanger.
［発明の効果］
以上のように、この発明によれば平板状のプレートの一
面に熱媒体が流通する並行流路を構成するフィンを並列
にホットメルト樹脂で接着して単位部材を形成する工程
、上記フィンのプレートと反対側の端面に上記フィンを
接着するホットメルト樹脂よりも溶融温度の低い低融点
ホットメルト樹脂を塗布する工程、上記単位部材の低融
点ホットメルト樹脂を塗布した端面と次段のプレートの
他面とを合わせて上記単位部材を複数個積層する工程、
及び積層した単位部材群を低融点ホットメルト樹脂の溶
融温度より高く上記フィンとプレートとの接着に供した
ホットメルト樹脂の溶融温度より低い温度で加熱して上
記単位部材群を接合する工程を施すものであるから、単
位部材積層時には単位部材相互を接合する低融点ホット
メルト樹脂が接着性を示さず、単位部材相互の位置調整
が可能になる。[Effects of the Invention] As described above, according to the present invention, a unit member is formed by bonding fins constituting parallel flow paths through which a heat medium flows on one side of a flat plate in parallel with hot melt resin. , applying a low melting point hot melt resin having a lower melting temperature than the hot melt resin to which the fin is bonded to the end surface of the fin opposite to the plate; a step of stacking a plurality of the unit members together with the other surface of the step plate;
and a step of joining the unit members by heating the stacked unit members at a temperature higher than the melting temperature of the low melting point hot melt resin and lower than the melting temperature of the hot melt resin used to bond the fins and the plate. Therefore, when the unit members are laminated, the low melting point hot melt resin that bonds the unit members to each other does not exhibit adhesive properties, making it possible to adjust the positions of the unit members.
従って、精度良く早く単位部材を積層することができる
とともに、単位部材同志の接着時には単位部材にかける
温度を設定することで粘着性が必要なものだけを溶融さ
せ精度良く積層した単位部材群をそのままの状態で一挙
に低融点ホットメルト樹脂によって接合でき、高性能な
熱交換素子をばらつきなく生産性良く製造できる効果が
ある。Therefore, unit members can be laminated quickly and accurately, and when bonding unit members together, by setting the temperature applied to the unit members, only those that require adhesiveness are melted, and the group of unit members that have been laminated with high precision can be left as is. It is possible to bond them all at once using a low-melting point hot-melt resin in this state, which has the effect of making it possible to manufacture high-performance heat exchange elements with high productivity without variation.
第１図はこの発明の一実施例に係わる単位部材を積層・
接着する工程までを施す製造ラインを示す構成図、第２
図と第３図はそれぞれ実施例の単位部材を単独に示す斜
視図と側面図、第４図は従来の熱交換素子を示す斜視図
、第５図は第４図の構成の一部を示す斜視図、第６図は
この発明に係わる従来の熱交換素子を示す斜視図、第７
図は第６図の単位部材の構成を示す斜視図である。図に
おいて、１はプレート、２はフィン材料、３はホットメ
ルト樹脂、４は樹脂塗布装置、５は低融点ホットメルト
樹脂、６は低融点ホットメル、ト樹脂塗布装置、７は切
断装置、８は積上げ装置、９は加熱装置、１つは単位部
材である。なお、図中同一符号は同−又は相当部分を示
す。
代理人 大 岩 増 雄（池２名）
第４図
第５ｒＩ！Ｊ
第７図FIG. 1 shows unit members according to an embodiment of the present invention laminated and
Block diagram showing the manufacturing line that performs the process up to the bonding process, 2nd
3 and 3 are a perspective view and a side view showing the unit member of the embodiment, respectively, FIG. 4 is a perspective view showing a conventional heat exchange element, and FIG. 5 shows a part of the configuration of FIG. 4. A perspective view, FIG. 6 is a perspective view showing a conventional heat exchange element according to the present invention, and FIG.
This figure is a perspective view showing the structure of the unit member in FIG. 6. In the figure, 1 is a plate, 2 is a fin material, 3 is a hot melt resin, 4 is a resin coating device, 5 is a low melting point hot melt resin, 6 is a low melting point hot melt resin coating device, 7 is a cutting device, and 8 is a 9 is a stacking device, 9 is a heating device, and 1 is a unit member. Note that the same reference numerals in the figures indicate the same or equivalent parts. Agent: Masuo Oiwa (2 people) Figure 4, Figure 5rI! J Figure 7
Claims (4)
行流路を構成するフィンを並列にホットメルト樹脂で接
着して単位部材を形成する工程、上記フィンのプレート
と反対側の端面に上記フィンを接着するホットメルト樹
脂よりも溶融温度の低い低融点ホットメルト樹脂を塗布
する工程、上記単位部材の低融点ホットメルト樹脂を塗
布した端面と次段のプレートの他面とを合わせて上記単
位部材を複数個積層する工程、及び積層した単位部材群
を低融点ホットメルト樹脂の溶融温度より高く上記フィ
ンとプレートとの接着に供したホットメルト樹脂の溶融
温度より低い温度で加熱して上記単位部材群を接合する
工程を施す熱交換素子の製造方法。(1) A step of forming a unit member by bonding fins constituting a parallel flow path through which a heat medium flows on one side of a flat plate in parallel with hot melt resin; A step of applying a low melting point hot melt resin having a lower melting temperature than the hot melt resin to which the fins are bonded; aligning the end surface of the unit member coated with the low melting point hot melt resin with the other surface of the next plate; The step of laminating a plurality of unit members, and heating the stacked unit member group at a temperature higher than the melting temperature of the low melting point hot melt resin and lower than the melting temperature of the hot melt resin used for bonding the fins and the plate. A method for manufacturing a heat exchange element that includes a step of joining a group of unit members.
の並行流路を交互に直交させて積層する工程である特許
請求の範囲第１項記載の熱交換素子の製造方法。(2) The method for manufacturing a heat exchange element according to claim 1, wherein the step of stacking a plurality of unit members is a step of stacking the unit members such that the parallel flow paths of the unit members are alternately orthogonally crossed.
状にした成形物又は、紙と樹脂との混成物を棒状あるい
は紐状にした成形物である特許請求の範囲第１項又は第
２項記載の熱交換素子の製造方法。(3) The material of the fin is a rod-shaped or string-shaped molded product of paper or resin, or a rod-shaped or string-shaped molded product of a mixture of paper and resin. 2. A method for manufacturing a heat exchange element according to item 2.
ート、金属薄板のいずれか一種を用いた特許請求の範囲
第１項又は第２項又は第３項記載の熱交換素子の製造方
法。(4) The method for manufacturing a heat exchange element according to claim 1, 2, or 3, using any one of paper, processed paper, plastic sheet, and thin metal plate as the plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62041114A JPS63207990A (en) | 1987-02-24 | 1987-02-24 | Manufacture of heat exchange element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62041114A JPS63207990A (en) | 1987-02-24 | 1987-02-24 | Manufacture of heat exchange element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63207990A true JPS63207990A (en) | 1988-08-29 |
Family
ID=12599437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62041114A Pending JPS63207990A (en) | 1987-02-24 | 1987-02-24 | Manufacture of heat exchange element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63207990A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2009004695A1 (en) * | 2007-06-29 | 2010-08-26 | 三菱電機株式会社 | Total heat exchange element and manufacturing method thereof |
-
1987
- 1987-02-24 JP JP62041114A patent/JPS63207990A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2009004695A1 (en) * | 2007-06-29 | 2010-08-26 | 三菱電機株式会社 | Total heat exchange element and manufacturing method thereof |
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