JPS63207560A - Surface grinding attachment - Google Patents

Surface grinding attachment

Info

Publication number
JPS63207560A
JPS63207560A JP3554387A JP3554387A JPS63207560A JP S63207560 A JPS63207560 A JP S63207560A JP 3554387 A JP3554387 A JP 3554387A JP 3554387 A JP3554387 A JP 3554387A JP S63207560 A JPS63207560 A JP S63207560A
Authority
JP
Japan
Prior art keywords
grinding
motor
wheel
grindstone
shaft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3554387A
Other languages
Japanese (ja)
Inventor
Fumio Watanabe
文雄 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Via Mechanics Ltd
Original Assignee
Hitachi Seiko Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Seiko Ltd filed Critical Hitachi Seiko Ltd
Priority to JP3554387A priority Critical patent/JPS63207560A/en
Publication of JPS63207560A publication Critical patent/JPS63207560A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To check chattering marks to be produced on a grinding surface to the minimum, by changing impressed voltage to a motor over to a corresponding small voltage when a grinding wheel is moved up to the specified position and shifted to spark-out grinding. CONSTITUTION:A grinding wheel 11 is attached to a holder 10 and a workpiece 17 to a chuck 16, respectively, while compressed air is fed to bearings 7 and 13, floating a wheel spindle 8 and a table shaft 14, and motors 9 and 15 are driven by a command of a control circuit 18, the wheel spindle 8 and the table shaft 14 are rotated, while the wheel 11 is moved to the side of the work 17 by operation of a motor 6, and infeed grinding is carried out. And, when a table 4 is moved up to the specified position, infeed is over and the motor 6 comes to a stop, impressed voltage for these motors 9 and 15 is transferred to a small voltage for spark-out grinding and, after this sparkout grinding is performed as long as the specified time, these motors 9 and 15 are stopped, and the wheel 11 is separated from the workpiece together with the table 4 by the motor 6. Thus, electromagnetic vibration in the motor is minimized, that is, chattering marks on a grinding surface are minimized.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、平面研削装置に係り、特に、シソコンウェハ
の研削のように、ワークを自転させて研削する平面研削
装置に関するものである。   。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a surface grinding device, and particularly to a surface grinding device that rotates and grinds a workpiece, such as grinding a silicon wafer. .

〔従来技術〕[Prior art]

たとえば、シリコンウェハのような硬脆材から。 For example, from hard and brittle materials like silicon wafers.

成るワークを高精度に研削する平面研削装置とじて、特
開昭59−187445号のようなワーブ自転式の平面
研削装置が知られている。
As a surface grinding device for grinding a workpiece with high precision, there is a known surface grinding device of a warb rotation type as disclosed in Japanese Patent Application Laid-open No. 59-187445.

このような平面研削装置においては、研削中におけるワ
ークと砥石の接触面積が常に一定である。
In such a surface grinding device, the contact area between the workpiece and the grindstone during grinding is always constant.

ので、高精度の平面研削を行なうことができる。J′″
〔発明が解決しようとする問題点〕 しかし、砥石軸とモータの間、および、テープ・ル軸と
モータの間に配置された伝動機構で発生する振動や、各
モータで発生する電磁振動等の影響・で、鏡面研削され
たワークの表面にびびシマー久が残シ、ワークの品質を
低下させる問題点があつ。
Therefore, highly accurate surface grinding can be performed. J′″
[Problems to be solved by the invention] However, vibrations generated in the transmission mechanism disposed between the grinding wheel shaft and the motor, and between the tape le shaft and the motor, and electromagnetic vibrations generated in each motor, etc. As a result, chattering and shimmer remain on the surface of mirror-ground workpieces, causing problems that reduce the quality of the workpiece.

た。Ta.

本発明の目的は、上記した問題点に鑑み、ワー。In view of the above problems, an object of the present invention is to solve the problems described above.

りの研削面のびびシマークを最小にし、高品質の。Minimizes chatter marks on the grinding surface and ensures high quality.

研削を行なうようにした平面研削装置を提供することに
ある。
An object of the present invention is to provide a surface grinding device that performs grinding.

〔問題点を解決するための手段〕[Means for solving problems]

上記目的を達成するための本発明の手段を、実施例に対
応する第1図に基づいて説明する。  。
Means of the present invention for achieving the above object will be explained based on FIG. 1 corresponding to an embodiment. .

同図において、8は砥石軸。9はモータで、砥石軸8に
装着されたロータ9aと、ロータ9&と同心円上に配置
されたステータ9bを備えている。11′は砥石で、砥
石軸8の一端に固定されている。。
In the figure, 8 is the grinding wheel shaft. A motor 9 includes a rotor 9a attached to the grindstone shaft 8, and a stator 9b arranged concentrically with the rotor 9&. Reference numeral 11' denotes a grindstone, which is fixed to one end of the grindstone shaft 8. .

14はテーブル軸。15はモータで、テーブル軸14に
装着されたロータ15aと、このロータ1+。
14 is the table axis. Reference numeral 15 denotes a motor, including a rotor 15a mounted on the table shaft 14 and this rotor 1+.

5aと同心円上に配置されたステータ15bを備えてい
る。17はワークで、テーブル軸14の一端に・、砥石
11と対向するように固定されている。  ・18は制
御回路で、モータ9,15に、切込み研削時に発生する
研削抵抗に対応する電圧と、ん綬 パークアウト研削特に発生する研削抵抗に対応す。
The stator 15b is arranged concentrically with the stator 5a. A workpiece 17 is fixed to one end of the table shaft 14 so as to face the grindstone 11.・18 is a control circuit, which applies voltage to the motors 9 and 15 corresponding to the grinding resistance generated during cutting depth grinding, and especially corresponding to the grinding resistance generated during ribbon parkout grinding.

る電圧を切替印加する。Switch and apply the voltage.

〔作 用〕[For production]

そして、モータ9,15に切込み研削に対応す。 The motors 9 and 15 are adapted for cutting and grinding.

る電圧を印加して、砥石軸8とテーブル軸14を。Apply a voltage to connect the grinding wheel shaft 8 and the table shaft 14.

回転させ、砥石11をワーク17に送シ込んで切込み研
削を行なう。
The grindstone 11 is rotated and fed into the workpiece 17 to perform cutting and grinding.

そして、所定の位置まで砥石11が移動して止゛まシ、
スパークアウト研削に移行すると、モータ。
Then, until the grindstone 11 moves to a predetermined position and stops,
When the motor goes into spark-out grinding.

9.15に印加される電圧が、スパークアウト研・削に
対応する小さな電圧に切替えられる。   ゛このよう
にして、スパークアウト研削時におけ。
The voltage applied to 9.15 is switched to a smaller voltage corresponding to spark-out grinding.゛In this way, during spark-out grinding.

るモータ9,15の電磁撮動を最小にして研削す。Grinding is carried out by minimizing the electromagnetic movement of the motors 9 and 15.

ることによシ、研削面に発生するびびシマークを最小に
押え、高品質の加工を行なう1.1〔・〔実施例〕 以下、本発明の一実施例を第1図および第2図・に基づ
いて説明する。
1.1 [Example] An example of the present invention is shown in Fig. 1 and Fig. 2. The explanation will be based on.

同図において、1はベッド。2はベースで、べ・ラド1
上に固定されている。3はボールガイドで−、ベース2
に固定されている。4はテーブルで、ボ。
In the figure, 1 is a bed. 2 is the base, Be Lado 1
Fixed on top. 3 is the ball guide -, base 2
is fixed. 4 is at the table.

−ルガイド3に嵌合するベアリングを備え、ボー。- The ball is equipped with a bearing that fits into the ball guide 3.

ルガイド3に摺動可能に支持されている。5はギ。It is slidably supported by the guide 3. 5 is Gi.

ヤボックスで、ベッド1に固定されている。6は。It is fixed to bed 1 with Yabox. 6 is.

モータで、ギヤボックス5に固定されている。 2゜・
 3 ・ そして、モータ6は、ギヤボックス5内の歯車列(図示
せず)を介して、ボールガイド3と平行に設けられた送
りねじを回転させ、テーブル4を。
The motor is fixed to the gearbox 5. 2゜・
3. Then, the motor 6 rotates the feed screw provided in parallel to the ball guide 3 via a gear train (not shown) in the gear box 5, and rotates the table 4.

ボールガイド3に泊って移動させる。Stay in ball guide 3 and move it.

7は静圧空気軸受(以下単に軸受という)で、′テーブ
ル4に固定されている。8は砥石軸で、軸受7に回転可
能に支持されている。9はモータで、砥石軸8に焼ばめ
されたロータ9aと、軸受7に固。
Reference numeral 7 denotes a static air bearing (hereinafter simply referred to as a bearing), which is fixed to the table 4. 8 is a grindstone shaft, which is rotatably supported by a bearing 7. Reference numeral 9 denotes a motor, which has a rotor 9a shrink-fitted to the grinding wheel shaft 8 and fixed to the bearing 7.

定されたステータ9bから成る。lOはホルダで、。It consists of a fixed stator 9b. lO is a holder.

砥石軸8の一端に固定されている。11はカップO型の
砥石で、ホルダ10に取付られている。  ・12はベ
ースで、ベッドlに固定されている。・13は静圧空気
軸受(以下単に軸受という)で、・ベース12に固定さ
れている。14はテーブル軸で、軸受13に回転可能に
支持されている。151)はモータで、テーブル軸14
に焼はめされたロー。
It is fixed to one end of the grindstone shaft 8. Reference numeral 11 denotes a cup O-shaped grindstone, which is attached to the holder 10.・12 is the base, which is fixed to the bed L. - 13 is a static pressure air bearing (hereinafter simply referred to as a bearing), - is fixed to the base 12. Reference numeral 14 denotes a table shaft, which is rotatably supported by the bearing 13. 151) is a motor that connects the table shaft 14
Roe is inlaid.

り15aと、軸受13に固定されたステータ15b。15a, and a stator 15b fixed to the bearing 13.

とを備えている。16はチャックで、テーブル軸14の
一端に固定されている。17はワークで、。
It is equipped with A chuck 16 is fixed to one end of the table shaft 14. 17 is work.

チャック16に吸着保持される。       2゜・
 4 ・ 18は制御回路で、モータ6.9.15に接続。
It is held by the chuck 16 by suction. 2゜・
4. 18 is the control circuit, connected to motor 6.9.15.

され、モータ6を作動させてテーブル4を待機位。Then, the motor 6 is activated and the table 4 is placed in the standby position.

置と切込み終了位置の間で往復移動させ、モータ。The motor moves the motor back and forth between the position and end of cut position.

9.15に、切込み研削時に発生する研削抵抗に“対応
する電圧と、スパークアウト研削時に発生す3る研削抵
抗に対応する電圧を切替印加する。  。
9. In step 9.15, apply a voltage that corresponds to the grinding resistance that occurs during depth of cut grinding and a voltage that corresponds to the grinding resistance that occurs during spark-out grinding.

上記の構成で、ホルダlOとチャック16にそ。With the above configuration, the holder lO and chuck 16 are attached.

れぞれ砥石11とワーク17を取付け、軸受7.13に
圧縮空気を供給して、砥石軸8とテーブル。
Attach the grindstone 11 and the workpiece 17, supply compressed air to the bearings 7 and 13, and turn the grindstone shaft 8 and table.

軸14を浮上させる。そして、制御回路18の指10令
に基づいて、モータ9,17を作動させ、砥石。
The shaft 14 is floated. Then, the motors 9 and 17 are operated based on the 10 commands from the control circuit 18, and the grindstone is turned.

軸8とテーブル軸14を所定の速度で回転させる゛と共
に、モータ6を作動させ、砥石11をワーク・17側へ
移動させ切込み研削を行なう。
The shaft 8 and table shaft 14 are rotated at a predetermined speed, and the motor 6 is operated to move the grindstone 11 toward the workpiece 17 to perform cutting and grinding.

そして、テーブル4が所定の位置まで移動して15切込
みが終了し、モータ6が停止すると、制御回。
Then, when the table 4 moves to a predetermined position and 15 cuts are completed and the motor 6 stops, the control cycle starts.

路18の指令に基づいて、モータ9,17に印加。Based on the command from line 18, voltage is applied to motors 9 and 17.

されていた電圧を、スパークアウト研削用の小さ。There was a small spark-out voltage for grinding.

な電圧に切替る。Switch to the correct voltage.

そして、所定時間経過後、モータ9,17への、0通電
を止め、モータ6を作動させて、テーブル4゛を後退さ
せ、砥石11をワーク17から引離す。。
After a predetermined period of time has elapsed, the zero current supply to the motors 9 and 17 is stopped, the motor 6 is activated, the table 4' is moved backward, and the grindstone 11 is separated from the workpiece 17. .

このようにして研削を行なうことによシ、スパ。By performing the grinding in this way, it is possible to use a spa.

−クアウト研削時、すなわち仕上研削時の各モー。- Each mo during pull-out grinding, that is, finish grinding.

り9,17の電磁振動を最小限にして、高品質の1研削
加工を行なうことができる。
High-quality grinding can be performed by minimizing the electromagnetic vibrations of the wheels 9 and 17.

〔発明の効果〕〔Effect of the invention〕

以上述べた如く、本発明によれば、研削面のび“びりマ
ークを最小限にして、高品質の研削加工を。
As described above, according to the present invention, it is possible to minimize the spread marks on the grinding surface and perform high-quality grinding.

行なうことができる。             10can be done.        10

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本発明の平面研削装置の一例を示す。 正面図、第2図は、第1図の平面図である。  ・8・
・・砥石軸、  9・・・モータ、9a・・・ロータ、
・9b・・・ステータ、  11・・・砥石、  14
・・・チー15プル軸、  15・・・モータ、15a
・・・ロータ、 。 15b・・・ステータ、  17・・・ワーク、  1
8・・・制。 両回路。
FIG. 1 shows an example of a surface grinding apparatus of the present invention. The front view, FIG. 2, is a plan view of FIG. 1.・8・
... Grinding wheel shaft, 9 ... Motor, 9a ... Rotor,
・9b...Stator, 11...Whetstone, 14
...Chi 15 pull axis, 15...motor, 15a
...Rotor. 15b... Stator, 17... Work, 1
8... system. Both circuits.

Claims (1)

【特許請求の範囲】[Claims] 1、ワークを保持するテーブル軸と、砥石を保持する砥
石軸とを互いに平行に、かつ砥石の研削面がテーブル軸
の軸心を横切るように配置し、前記各軸を回転させなが
ら砥石をワークに切込ませて研削を行なうようにした平
面研削装置において、前記テーブル軸と砥石軸にそれぞ
れロータを設け、これらのローラに対応するステータを
設け、前記ロータとステータにより構成されるモータに
、切込み研削時に発生する研削抵抗に相当する電圧と、
スパークアウト研削時に発生する研削抵抗に相当する電
圧を切替印加する制御手段を設けたことを特徴とする平
面研削装置。
1. Arrange the table shaft that holds the workpiece and the grindstone shaft that holds the grindstone parallel to each other so that the grinding surface of the grindstone crosses the axis of the table shaft, and rotate the grindstone while rotating each axis. In a surface grinding device that performs grinding by making a cut in A voltage equivalent to the grinding resistance generated during grinding,
A surface grinding device characterized by being provided with a control means for switching and applying a voltage corresponding to the grinding resistance generated during spark-out grinding.
JP3554387A 1987-02-20 1987-02-20 Surface grinding attachment Pending JPS63207560A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3554387A JPS63207560A (en) 1987-02-20 1987-02-20 Surface grinding attachment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3554387A JPS63207560A (en) 1987-02-20 1987-02-20 Surface grinding attachment

Publications (1)

Publication Number Publication Date
JPS63207560A true JPS63207560A (en) 1988-08-26

Family

ID=12444644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3554387A Pending JPS63207560A (en) 1987-02-20 1987-02-20 Surface grinding attachment

Country Status (1)

Country Link
JP (1) JPS63207560A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003077871A (en) * 2001-09-04 2003-03-14 Komatsu Machinery Corp Planar grinding system of semiconductor wafer and working method therefor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003077871A (en) * 2001-09-04 2003-03-14 Komatsu Machinery Corp Planar grinding system of semiconductor wafer and working method therefor

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