JPS6320444U - - Google Patents
Info
- Publication number
- JPS6320444U JPS6320444U JP1986114872U JP11487286U JPS6320444U JP S6320444 U JPS6320444 U JP S6320444U JP 1986114872 U JP1986114872 U JP 1986114872U JP 11487286 U JP11487286 U JP 11487286U JP S6320444 U JPS6320444 U JP S6320444U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- resin
- circuit board
- resin frame
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000004020 conductor Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986114872U JPS6320444U (US20030220297A1-20031127-C00074.png) | 1986-07-25 | 1986-07-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986114872U JPS6320444U (US20030220297A1-20031127-C00074.png) | 1986-07-25 | 1986-07-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6320444U true JPS6320444U (US20030220297A1-20031127-C00074.png) | 1988-02-10 |
Family
ID=30998004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986114872U Pending JPS6320444U (US20030220297A1-20031127-C00074.png) | 1986-07-25 | 1986-07-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6320444U (US20030220297A1-20031127-C00074.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007037458A1 (ja) * | 2005-09-27 | 2007-04-05 | Epson Toyocom Corporation | パッケージ及び電子デバイス |
-
1986
- 1986-07-25 JP JP1986114872U patent/JPS6320444U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007037458A1 (ja) * | 2005-09-27 | 2007-04-05 | Epson Toyocom Corporation | パッケージ及び電子デバイス |
