JPS63200337U - - Google Patents
Info
- Publication number
- JPS63200337U JPS63200337U JP1987090348U JP9034887U JPS63200337U JP S63200337 U JPS63200337 U JP S63200337U JP 1987090348 U JP1987090348 U JP 1987090348U JP 9034887 U JP9034887 U JP 9034887U JP S63200337 U JPS63200337 U JP S63200337U
- Authority
- JP
- Japan
- Prior art keywords
- guide pin
- photodiode array
- pin hole
- chip mounting
- mounting member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Analogue/Digital Conversion (AREA)
- Transmission And Conversion Of Sensor Element Output (AREA)
- Optical Transform (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987090348U JPH0719168Y2 (ja) | 1987-06-12 | 1987-06-12 | フォトダイオ−ドアレイの取付装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987090348U JPH0719168Y2 (ja) | 1987-06-12 | 1987-06-12 | フォトダイオ−ドアレイの取付装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63200337U true JPS63200337U (2) | 1988-12-23 |
| JPH0719168Y2 JPH0719168Y2 (ja) | 1995-05-01 |
Family
ID=30950124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987090348U Expired - Lifetime JPH0719168Y2 (ja) | 1987-06-12 | 1987-06-12 | フォトダイオ−ドアレイの取付装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0719168Y2 (2) |
-
1987
- 1987-06-12 JP JP1987090348U patent/JPH0719168Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0719168Y2 (ja) | 1995-05-01 |