JPS63199452U - - Google Patents

Info

Publication number

JPS63199452U

JPS63199452U JP8971587U JP8971587U JPS63199452U JP S63199452 U JPS63199452 U JP S63199452U JP 8971587 U JP8971587 U JP 8971587U JP 8971587 U JP8971587 U JP 8971587U JP S63199452 U JPS63199452 U JP S63199452U

Authority

JP

Japan

Prior art keywords

button

battery

terminal plate

plating layer

sealing gasket

Prior art date

1987-06-12

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 238000007789 sealing Methods 0.000 claims description 4
• 229910052802 copper Inorganic materials 0.000 claims description 3
• 239000010949 copper Substances 0.000 claims description 3
• 238000007747 plating Methods 0.000 claims description 3
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
• 230000002209 hydrophobic effect Effects 0.000 claims description 2
• 238000010248 power generation Methods 0.000 claims description 2
• 229910000831 Steel Inorganic materials 0.000 claims 1
• 150000001879 copper Chemical class 0.000 claims 1
• RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Substances C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 1
• 230000002093 peripheral effect Effects 0.000 claims 1
• 239000010959 steel Substances 0.000 claims 1
• PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
• 238000000576 coating method Methods 0.000 description 1
• 229910052748 manganese Inorganic materials 0.000 description 1
• 239000011572 manganese Substances 0.000 description 1
• 239000000203 mixture Substances 0.000 description 1