JPS63198332A - Etchant composition - Google Patents
Etchant compositionInfo
- Publication number
- JPS63198332A JPS63198332A JP3223987A JP3223987A JPS63198332A JP S63198332 A JPS63198332 A JP S63198332A JP 3223987 A JP3223987 A JP 3223987A JP 3223987 A JP3223987 A JP 3223987A JP S63198332 A JPS63198332 A JP S63198332A
- Authority
- JP
- Japan
- Prior art keywords
- silicone oil
- alcohol
- modified silicone
- etching agent
- surface tension
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 17
- 238000005530 etching Methods 0.000 claims abstract description 32
- 239000004094 surface-active agent Substances 0.000 claims abstract description 18
- 229920002545 silicone oil Polymers 0.000 claims abstract description 17
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 claims abstract description 15
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims abstract description 15
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 8
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 5
- 229910000040 hydrogen fluoride Inorganic materials 0.000 claims abstract description 5
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 4
- 239000007864 aqueous solution Substances 0.000 claims abstract description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 25
- 125000004432 carbon atom Chemical group C* 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 8
- 229910052814 silicon oxide Inorganic materials 0.000 abstract description 8
- 238000001914 filtration Methods 0.000 abstract description 4
- 238000010521 absorption reaction Methods 0.000 abstract 1
- -1 sulfuric acid ester Chemical class 0.000 description 8
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 239000008139 complexing agent Substances 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- KWIUHFFTVRNATP-UHFFFAOYSA-N Betaine Natural products C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- KWIUHFFTVRNATP-UHFFFAOYSA-O N,N,N-trimethylglycinium Chemical compound C[N+](C)(C)CC(O)=O KWIUHFFTVRNATP-UHFFFAOYSA-O 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 229960003237 betaine Drugs 0.000 description 1
- 239000012490 blank solution Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000000572 ellipsometry Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Weting (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、各種シリコン酸化膜のエツチング剤組成物に
関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to etching agent compositions for various silicon oxide films.
更に詳しくは、洩れ性を向上させる特定のアルコール変
性シリコーンオイルを界面活性剤として含有する各種シ
リコン酸化膜のエツチング剤組成物に関する。More specifically, the present invention relates to etching agent compositions for various silicon oxide films containing a specific alcohol-modified silicone oil as a surfactant that improves leakage properties.
〈従来の技術〉
近年、半導体集積回路の微細加工化に伴ない、レジスト
膜で形成された２μｍ以下の微細パターンの間隙にエツ
チング液が入り込み均一なエツチングをするために瀧れ
性の良好なエツチング剤が求められてきた。そのため各
種シリコン酸化膜の湿式エツチング剤として、フッ化水
素酸とフッ化アンモニウムの混合液が使用されており、
通常５０重量％フッ化水素酸１容量に対して４０重承％
フッ化アンモニウム水溶液５容】以上の比率で混合され
ている。<Conventional technology> In recent years, with the miniaturization of semiconductor integrated circuits, etching liquid has entered the gaps between fine patterns of 2 μm or less formed by a resist film, and etching with good drainage has been developed to achieve uniform etching. drugs have been sought. Therefore, a mixture of hydrofluoric acid and ammonium fluoride is used as a wet etching agent for various silicon oxide films.
Usually 40% by weight per volume of 50% hydrofluoric acid
5 volumes of ammonium fluoride aqueous solution] are mixed at the above ratio.
しかしながら、フッ化アンモニウム混合比率の高いエツ
チング剤では表面張力が高いという欠点を有していた。However, etching agents with a high mixing ratio of ammonium fluoride have a drawback of high surface tension.
例えば５０重ゑ％フッ化水素と４０ｔｆ１％フッ化アン
モニウムの容量比が１：６で８８ ｄｙｎｅ ／１ｙｘ
−Ｑある。For example, if the capacity ratio of 50% hydrogen fluoride and 40tf 1% ammonium fluoride is 1:6, 88 dyne/1yx
-There is a Q.
この為、従来から湿式エツチングの前処理としてアルコ
ール処理或いは界面活性剤処理を行い、レジスト膜とエ
ツチング液との濡れ性を改良しているが、アルコール処
理の’ｌｉ 合ウェハー上に残留したアルコールによっ
て微細パターンの間隙でフッ化アンモニウムの析出トラ
ブルが生じ易く問題である。For this reason, alcohol treatment or surfactant treatment has traditionally been performed as a pretreatment for wet etching to improve the wettability between the resist film and the etching solution. This is problematic because ammonium fluoride tends to precipitate in the gaps between fine patterns.
又、界面活性剤によりフッ化アンモニウムを含むエツチ
ング剤の表面張力を低下させて濡れ性を改良することが
考えられ、例えば、特開昭５８−５５８２４号公報では
フッ化水素酸とフッ化アンモニウムを混合したエツチン
グ剤に酢酸を１０〜３０容量％と界面活性剤を０．０１
〜５容量％添加し、更に必要に応じアルコールを２〜１
５容量％添加して表面張力を下げて濡れ性を良くする方
法が提案されている。It is also possible to improve wettability by lowering the surface tension of an etching agent containing ammonium fluoride using a surfactant. Add 10 to 30% by volume of acetic acid and 0.01% of surfactant to the mixed etching agent.
Add ~5% by volume, and add 2~1% alcohol if necessary.
A method of adding 5% by volume to lower surface tension and improve wettability has been proposed.
この場合の界面活性剤としてはカルボン酸、硫酸エステ
ル、スルホン酸、リン酸エステル等のアニオン性界面活
性剤、第１級アミン塩、第２級アミン塩、第８級アミン
塩、第４級アンモニウム塩等のカチオン性界面活性剤、
アミノ酸型、ベタイン型等の両性界面活性剤、ポリエチ
レングリコール型、多価アルコール型等の非イオン性界
面活性剤等が挙げられている。In this case, the surfactants include anionic surfactants such as carboxylic acid, sulfuric acid ester, sulfonic acid, phosphoric acid ester, primary amine salt, secondary amine salt, 8th class amine salt, and quaternary ammonium salt. Cationic surfactants such as salts,
Examples include amphoteric surfactants such as amino acid type and betaine type, and nonionic surfactants such as polyethylene glycol type and polyhydric alcohol type.
しかしこれらの方法では、これら炭化水素系界面活性剤
の添加直後の濡れ性は良くなるが、一般に半導体メーカ
ーではエラチン剤を使用する前に一過精製を行うのが普
通であり、エツチング剤を一過するとフィルターに界面
活性剤が吸着されて表面張力が大きくなるものが多く、
更に界面活性剤のミセル化析出防止用に添加したアルコ
ールにより微細パターンの間隙でのフッ化アンモニウム
析出トラブルを生じ易い問題点を有する。゛
一方、フッ化水素酸にフッ化アンモニウムを混合したエ
ツチング剤に特定の含フツ素モノアミン、ジアミン又は
それらの塩からなるフッ素系界面活性剤、或はポリオキ
シエチレン含有の非イオン性フッ素系界面活性剤を０．
０００１〜５重量％添加して表面張力を下げて濡れ性を
良くする方法が提案されているが、フッ素系界面活性剤
は上記のエツチング剤中で分離し易（、又濾過でフィル
ターに吸着され易く問題である。However, although these methods improve the wettability immediately after adding these hydrocarbon surfactants, it is common for semiconductor manufacturers to perform temporary purification before using the etching agent. If the filter is filtered, the surfactant will be adsorbed to the filter and the surface tension will increase.
Furthermore, there is a problem in that the alcohol added to prevent micellar precipitation of the surfactant tends to cause ammonium fluoride precipitation in the gaps between the fine patterns.゛On the other hand, an etching agent that is a mixture of hydrofluoric acid and ammonium fluoride, a fluorine-based surfactant made of a specific fluorine-containing monoamine, diamine, or a salt thereof, or a nonionic fluorine-based interface containing polyoxyethylene. Activator at 0.
A method has been proposed in which fluorine-based surfactants are added in an amount of 1 to 5% by weight to lower the surface tension and improve wettability. This is easily a problem.
（特開昭５８−５８９８０号、特開昭５８−８４９７４
号、特開昭５９−５６４８２号公報）
〈発明が解決しようとする問題点〉
本発明が解決すべき問題点、即ち本発明の目的は一過で
フィルター吸着されない界面活性剤を添加して、従来と
変らないエツチング速度を保ち、且つ表面張力を下げて
濡れ性を大幅に向上させるエツチング剤組成物を提供す
ることにある。(JP-A-58-58980, JP-A-58-84974
(No. 59-56482) (Problems to be Solved by the Invention) The problems to be solved by the present invention, that is, the purpose of the present invention is to It is an object of the present invention to provide an etching agent composition which maintains the same etching speed as before and lowers surface tension to significantly improve wettability.
〈問題点を解決する為の手段〉
本発明者等は前述問題に鋭意取り組み、フッ化水素とフ
ッ化アンモニウムを混合したエツチング剤に界面活性剤
としである特定のアルコール変性シリコーンオイルを極
く僅か添加すると、一過によるフィルター吸着がなくて
、従来と変らないシリコン酸化膜のエツチング速度を保
ち、且つ表面張力を下げて濡れ性を大幅に向上出来る事
実を見い出し本発明を完成させるに至った。<Means for Solving the Problems> The present inventors worked diligently to solve the above-mentioned problems, and added a very small amount of a specific alcohol-modified silicone oil as a surfactant to an etching agent that is a mixture of hydrogen fluoride and ammonium fluoride. The present inventors discovered the fact that when added, there is no temporary filter adsorption, the etching rate of the silicon oxide film is maintained at the same rate as before, and the surface tension is lowered to greatly improve wettability, leading to the completion of the present invention.
以下本発明について具体的に説明する。The present invention will be specifically explained below.
本発明は、フッ化水素及びフッ化アンモニウムを含む水
溶液中に、界面活性剤として一般式（式中 Ｒ１は炭素
数１〜７のアルキレン基、Ｒ２及びＲ８は炭素数１〜８
のアルキル基、ｎは５〜８０の整数を表わす。）
で示されるアルコール変性シリコーンオイルを０．００
１〜１重量％含有することを特徴とするエツチング剤組
成物に係るものである。The present invention provides a surfactant having the general formula (where R1 is an alkylene group having 1 to 7 carbon atoms, R2 and R8 are an alkylene group having 1 to 8 carbon atoms, and
an alkyl group, n represents an integer of 5 to 80. ) 0.00 alcohol-denatured silicone oil
This relates to an etching agent composition characterized in that it contains 1 to 1% by weight.
ここに本発明に於ける界面活性剤として一般式
で示されるアルコール変性シリコーンオイルとは Ｒ１
が炭素数１〜７のアルキレン基で具体的にはメチレン、
エチレン、プロピレン、ブチレン、アミジノ、ヘキシレ
ン基等であり Ｒ２及びＲ８は炭素数１〜８のアルキル
基で、具体的にはメチル及び／又はエチル基等で、最適
は共にメチル基の場合である。What is the alcohol-modified silicone oil represented by the general formula as a surfactant in the present invention? R1
is an alkylene group having 1 to 7 carbon atoms, specifically methylene,
These include ethylene, propylene, butylene, amidino, hexylene groups, etc., and R2 and R8 are alkyl groups having 1 to 8 carbon atoms, specifically methyl and/or ethyl groups, and the most preferred is when both are methyl groups.
ポリシロキサンの両末端に一級のアルコール性水酸基を
有するアルコール変性シリコーンオイルとしては、ジメ
チルポリシロキサン、ジエチルポリシロキサン、メチル
エチル？リシロキサンのアルコール変性物等があるが、
特にジメチルポリシロキサンのアルコール変性物が好ま
しい。このものとしては例えば“５Ｆ８４２７″″（ト
ーレ・シリコーン（…、商品名）、“ｘ−２２−１６０
ＡＳ“（信越化学■、商品名）、又は“Ｘ−２２−１６
０Ｃ−（信越化学■、商品名）等が市販されている。Alcohol-modified silicone oils that have primary alcoholic hydroxyl groups at both ends of polysiloxane include dimethylpolysiloxane, diethylpolysiloxane, and methylethyl? There are alcohol-denatured products of resiloxane, etc.
Particularly preferred is an alcohol-modified product of dimethylpolysiloxane. Examples of this include "5F8427"" (Tore Silicone (..., product name), "x-22-160"
AS" (Shin-Etsu Chemical ■, product name) or "X-22-16
0C- (Shin-Etsu Chemical ■, trade name) and the like are commercially available.
アルコール変性シリコーンオイルのエツチング剤中の濃
度はｏ、ｏｏｔ〜１重鼠％が好ましく、更に灯ましくは
０．００５〜０．１重量％である。The concentration of the alcohol-modified silicone oil in the etching agent is preferably from 1% to 1% by weight, and more preferably from 0.005 to 0.1% by weight.
０．００１重１％以下の一度では表面張力が充分に低く
ならず実用的でない。一方１重菫％より多く添加しても
それに見合う効果が得られず不利である。If the amount is less than 0.001% by weight, the surface tension will not be sufficiently lowered and it is not practical. On the other hand, adding more than 1% violet is disadvantageous because no commensurate effect can be obtained.
以上の改良エツチング剤組成物に更に金属錯化剤をｏ、
ｏｏｔ〜１重量％位必要に応じて適宜添加してもよい。Further, a metal complexing agent is added to the above improved etching agent composition.
If necessary, it may be added in an amount of about 1% by weight.
ここにいう金属鉛化剤としては、エチレンジアミン四節
酸ニアンモニウム等（以下ＥＤＴＡ−２ＮＨ４と略記す
る。）があげられ、ナトリウム等の金属イオン不純物を
含有しないことが要求される。Examples of the metal leading agent herein include ammonium ethylenediaminetetranodic acid (hereinafter abbreviated as EDTA-2NH4), which is required not to contain metal ion impurities such as sodium.
〈実施例〉
以下本発明を実施例、比較例により具体的に説明するが
、本発明は何等これらに限定されるものではない。<Examples> The present invention will be specifically explained below using Examples and Comparative Examples, but the present invention is not limited to these in any way.
物性値の測定は次の如く行なった。The physical property values were measured as follows.
（１）表面張力の測定
輪環法によるデュヌイの表面張力＃ＦＣ−島津製作所製
）で２８°Ｃにおける表面張力を測定した。(1) Measurement of surface tension The surface tension at 28°C was measured using Dunui's surface tension #FC (manufactured by Shimadzu Corporation) using the ring method.
（２）濾過によるフィルター吸着性の測定試験エツチン
グ剤組成物を、０，２μｍ孔径の各皿メンブランフィル
タ−を装着した住化式薬液自動供給装置（以下ＣＵとい
う。）〔住友化学■、商品名〕で１時間以上循環濾過し
た後に表面張力を再測定してフィルター吸着性を判定し
た。(2) Measurement test of filter adsorption by filtration The etching agent composition was applied to a Sumika chemical solution automatic supply device (hereinafter referred to as CU) equipped with a membrane filter of 0.2 μm pore size [Sumitomo Chemical ■, trade name] ] After circulating filtration for 1 hour or more, the surface tension was measured again to determine the filter adsorption property.
（３） シリコン酸化膜のエツチング速度測定２３゛
Ｃで浸漬法によりシリコン酸化膜をエツチングし、膜厚
変化をルドルフ・リサーチ社のエリプソメトリ−で測定
した。(3) Measurement of etching rate of silicon oxide film A silicon oxide film was etched by a dipping method at 23°C, and changes in film thickness were measured using ellipsometry manufactured by Rudolph Research.
実施例１〜８及び比較例１〜７
５０重量％フッ化水素酸と４０重量％フッ化アンモニウ
ム水溶液のに６（容量比）混合液（以下ＢＨＦ１６ブラ
ンク液という。）に、各種界面活性剤を０．０１重量％
添加した各種ランフイルターによるＣＵ通液テストの結
果を第１表に示す。Examples 1 to 8 and Comparative Examples 1 to 7 Various surfactants were added to a mixed solution (volume ratio) of 50% by weight hydrofluoric acid and 40% by weight ammonium fluoride aqueous solution (hereinafter referred to as BHF16 blank solution). 0.01% by weight
Table 1 shows the results of the CU liquid passage test using the various run filters added.
アルコール変性シリコーンオイルを添加したエツチング
剤組成物のみが、各種メンプラン通液テストでもフィル
ターに吸着されずに低い表面張力を得た。Only the etching agent composition to which alcohol-modified silicone oil was added was not adsorbed to the filter and had a low surface tension in various Menpuran liquid passage tests.
実施例４〜９
ＢＨＦ１６ブランク液にアルコール変性シリコーンオイ
ル（商品名ＦＳ８４２７）、及びアルコール変性シリコ
ーンオイルと金属錯化剤ＥＤＴＡ−２Ｎ）（４を添加し
た場合の表面張力を測定した結果を第２表に示す。Examples 4 to 9 Table 2 shows the results of measuring the surface tension when alcohol-modified silicone oil (trade name FS8427) and alcohol-modified silicone oil and metal complexing agent EDTA-2N) (4) were added to the BHF16 blank liquid. Shown below.
第 ２ 表
実施例１０〜１５及び比較例８，９
５０％フッ化水素酸と４０％フッ化アンモニウムの混合
比を変えたエツチング剤に、アルコール変性シリコーン
オイル及びアルコール変性シリコーンオイルと金属鉛化
剤ＥＤＴＡ−２３）Ｉ４を添加した場合のシリコン酸化
膜の２８°Ｃに於けるエツチング速匿を測定した結果を
第８表に示す。Table 2 Examples 10 to 15 and Comparative Examples 8 and 9 Etching agents with different mixing ratios of 50% hydrofluoric acid and 40% ammonium fluoride, alcohol-modified silicone oil, alcohol-modified silicone oil, and metal lead agent Table 8 shows the results of measuring the etching speed of a silicon oxide film at 28 DEG C. when EDTA-23) I4 was added.
第 ８ 表
〈発明の効果〉
本発明は、フッ化水紫（こフッ化アンモニウムを混合し
たエツチング剤に、界面活性剤として濾過によるフィル
ター吸着性のない特定のアルコール変性シリコーンオイ
ルの添加効果により、従来と反らないエツチング速度を
保ち、且つ表面張力を下げて濡れ性を大幅に向上したエ
ツチング剤組成物を提供する。Table 8 <Effects of the Invention> The present invention has the effect of adding a specific alcohol-modified silicone oil that is not adsorbed to a filter by filtration as a surfactant to an etching agent mixed with ammonium fluoride. To provide an etching agent composition which maintains an etching speed comparable to that of conventional etching agents and greatly improves wettability by lowering surface tension.
Claims (3)
中に、界面活性剤として一般式 ▲数式、化学式、表等があります▼ （式中、Ｒ＾１は炭素数１〜７のアルキレン基、Ｒ＾２
及びＲ＾３は炭素数１〜３のアルキル基、ｎは５〜８０
の整数を表わす。） で示されるアルコール変性シリコーンオイルを０．００
１〜１重量％含有することを特徴とするエッチング剤組
成物。(1) In an aqueous solution containing hydrogen fluoride and ammonium fluoride, there are general formulas, mathematical formulas, chemical formulas, tables, etc. as surfactants. (In the formula, R^1 is an alkylene group with 1 to 7 carbon atoms, R ^2
and R^3 is an alkyl group having 1 to 3 carbon atoms, and n is 5 to 80
represents an integer. ) 0.00 alcohol-denatured silicone oil
An etching agent composition characterized by containing 1 to 1% by weight.
であるアルコール変性シリコーンオイルであることを特
徴とする特許請求の範囲第１項記載のエッチング剤組成
物。(2) The etching agent composition according to claim 1, which is an alcohol-modified silicone oil in which R^2 and R^3 are a methyl group and/or an ethyl group.
０５〜０．１重量％であることを特徴とする特許請求の
範囲第１項記載のエッチング剤組成物。(3) The concentration of alcohol-modified silicone oil is 0.0
The etching agent composition according to claim 1, wherein the etching agent composition has a content of 0.05 to 0.1% by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3223987A JPS63198332A (en) | 1987-02-13 | 1987-02-13 | Etchant composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3223987A JPS63198332A (en) | 1987-02-13 | 1987-02-13 | Etchant composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63198332A true JPS63198332A (en) | 1988-08-17 |
Family
ID=12353438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3223987A Pending JPS63198332A (en) | 1987-02-13 | 1987-02-13 | Etchant composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63198332A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005120373A (en) * | 2003-10-17 | 2005-05-12 | Samsung Electronics Co Ltd | Etching composition having high etching ratio, method for producing the same, method for etching oxidized film by using the same, and method for producing semiconductor device |
-
1987
- 1987-02-13 JP JP3223987A patent/JPS63198332A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005120373A (en) * | 2003-10-17 | 2005-05-12 | Samsung Electronics Co Ltd | Etching composition having high etching ratio, method for producing the same, method for etching oxidized film by using the same, and method for producing semiconductor device |
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