JPS63197620A - Mold device for molding - Google Patents

Abstract

PURPOSE:To enable the positioning of a contact plate to be surely achieved by a method in which a bearing kit is fitted to a runner ejection plate, and an ejector guide pin is arranged so as to fit to this bearing kit. CONSTITUTION:A bearing kit 31 is composed of a bearing holder, steel balls, a ring spring and a bearing bush. After a case has been formed on a contact plate, a runner ejection pin 14 is projected by lifting a runner ejection plate 6 by an ejector rod 10, and the runner having been formed at the time of forming a case is removed. In this case, since the bearing kit 31 is fitted to the runner ejection plate 6, it slides an ejector guide pin 12 upward similarly to the runner ejection plate 6, and moves it position. Further a molding ejection plate 7 is raised by the ejector rod 10, thereby projecting a molding ejection pin 15 and lifting the contact plate 1 to the side of an upper stationary mold. Consequently, a finger pin 23 is inserted in the positioning hole 1a of the contact plate 1.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a molding device that is applied to insert molding a case for a pushbutton switch or the like.

[Prior Art] For example, the structure shown in FIG. 6 is known as a molding die device used when insert molding a case for a push button switch. Reference numeral 22 denotes a lower movable mold, which is disposed opposite to an upper fixed mold (not shown), and is composed of the following members. Reference numerals 3 and 4 denote a pair of guide plates, and as shown in FIG. ．． Runner ejecting plate 6, molded product ejecting plate 7, movable mold receiving plate 8. A die set 9 is provided respectively, and an ejector rod 10 that can press the runner ejecting plate 6 and the molded product ejecting plate 7 upward is similarly arranged.

Further, a return pin 11 is provided between the pair of guide plates 3, 4 and the runner protrusion plate 6.
and the ejector guide pin 1 between the molded product ejecting plate 7
2 are placed respectively.

13 is a coil spring arranged between the movable template 5 and the molded product ejecting plate 7; 14 is a runner ejecting pin protruding upward from the runner ejecting plate 6;

15 is a molded product ejecting bottle that projects upward from the molded product ejecting plate 7. A pilot pin 16 projects from the movable mold plate 5 and is inserted into the positioning hole 1a of the contact plate 1 shown in FIG. 7 to position the contact plate 1. Although not shown, similar pilot bins protrude downward from the upper fixed mold, and the contact plate 1 is positioned by the pilot bins of the upper and lower molds.

When molding the push button switch case by insert molding the contact plate 1 based on the above configuration, the upper fixed mold 18 is arranged so as to face the lower movable mold 22 as shown in FIG. sandwich the contact plate 1 between them, and connect the sprue 19.
Runner 20. This is done by injecting molten resin into the cavity 17 through the submarine gate 21.

After the case is molded, it is separated by moving the lower movable mold 22 from the integrated upper and lower molds.

Subsequently, the runner ejecting plate 6 is pushed up by the ejector rod 10 which is pressed upward by hydraulic pressure, so that the runner ejecting pin 14 is ejected, and the runner 20 formed during case molding is removed.

The pressure of the ejector rod 10 further advances and pushes up the molded product ejection plate 7, causing the molded product ejection bin 1 to be pushed up.
5 and push up the contact plate 1 toward the upper fixed mold. As a result, the positioning hole 1a of the contact plate 1 is inserted into the finger pin 23, and by sliding the contact plate 1 using the subsequent air cylinder, the other unmolded fixed contact parts of the case can be moved in the same way as in the previous case. The case is similarly molded by placing it in the cavity 17 between the upper and lower molds.

[Problems to be solved by the invention] By the way, in such a conventional molding die device,
When the ejector rod 10 is pressed to push up the runner ejection plate 6 and the molded product ejection plate 7, the pair of guide plates 3 and 4 are also moved upward by the return bin 11 and ejector guide pin 12, respectively.

Therefore, since there is no positioning means when the ejector rod 10 is pushed up, the contact plate 1 comes off the finger pin 23 due to the reaction of this pushing up force, so the air cylinder There is a risk that the contact plate 1 may not slide when the finger pin is slid or the contact plate 1 may be positioned between the finger pin 23 and the pilot bottle 16, so when the upper and lower molds are tightened, the contact plate 1 There is a problem in that the fixed contacts do not fit into the grooves of the mold and are crushed.

The present invention has been made in response to such problems, and an object of the present invention is to provide a molding die device that can reliably position a contact plate.

[Means for Solving the Problems] In order to achieve the above object, the present invention has a lower movable mold disposed opposite to an upper fixed mold, and this lower movable mold has at least a molded object. a guide plate that holds the
In a molding mold device equipped with a runner ejector plate disposed below the guide plate and an ejector guide pin slidably inserted through the runner ejector plate, a bearing kit is attached to the runner ejector plate, and the bearing kit is attached to the runner ejector plate. The present invention is characterized in that the ejector guide pin is arranged so as to fit with the kit.

[Operation] Since the bearing kit is attached to the runner ejector plate so as to fit with the ejector guide pin, when the runner ejector plate is pushed up by the ejector rod, the bearing kit also slides at the same time. This allows the contact plate to be positioned reliably.

[Embodiment of the Invention] Fig. 1 is a schematic cross-sectional view showing an embodiment of the molding device of the present invention, in which 1 is a contact plate, 2 is a fixed contact, 3°4 is an integral guide plate, and 5 is a movable The side template plate, 6 is a runner ejecting plate, and 7 is a molded product ejecting plate.

8 is a movable mold receiving plate, 9 is a die set, 10 is an ejector rod, 11 is a return pin, 12 is an ejector guide pin, and 13 is a coil spring.

14 is a runner ejecting pin, 15 is a molded product ejecting pin, 16 is a pilot pin, 17 is a cavity, 18 is an upper fixing mold, and 19 is a sprue.

Reference numeral 20 indicates a runner, 21 indicates a submarine gate, 22 indicates a lower movable mold, and 23 indicates a finger pin. Although the above-mentioned members are the same as those of the prior art, the feature of the present invention lies in the following configuration.

That is, 31 is a bearing kit attached to the runner ejecting plate 6, and this bearing kit 31 is configured to fit with the ejector guide pin 12. FIGS. 2(a), (b), and (c) show a side view, a top view, and a cross-sectional view of the bearing kit 31. As shown in FIG. 3, the bearing kit 31 includes (a) a bearing holder, ( Consists of b) steel balls, (Q) ring springs, and (d) bearing bushes. The assembly method is as follows: (a) After installing (b) the steel ball into the mounting hole 30 formed in the bearing holder, (a) fitting the (c) ring spring from below the bearing holder; After installing the bearing bushing (d) from below so as to surround it,
Make sure to fasten the screws to this side.

FIG. 4 shows an enlarged view of the ejector guide pin 12, and fitting grooves 12a and 12b for fitting the bearing kit 31 are provided on the side surface.

Next, the operation of this embodiment will be explained.

After forming a case on the contact plate 1, first push up the runner ejector plate 6 with the ejector rod 10 to eject the runner ejector pin 14, and remove the runner 20 formed during case molding. Since the ejector guide pin 12 is attached to the plate 6, the ejector guide pin 12 is slid upward in the same way as the runner ejector plate 6, as shown in FIGS. 5(a) to 5(b).
Move to the position.

Further, by pushing up the molded product ejecting plate 7 with the ejector rod 10, the molded product ejecting pin 15 is projected, and the contact plate 1 is pushed up toward the upper fixed mold. As a result, the positioning hole 1a of the contact plate 1 is inserted into the finger pin 23. When the push-up of the ejector rod 10 is released, the molded product ejecting plate 7 is pushed down by the spring pressure of the coil spring 13. Next, by sliding the contact plate 1 with an air cylinder, the other non-molded fixed contacts of the case are moved. The part is placed in the cavity 17 between the upper and lower molds to mold the case. When the upper and lower molds are clamped, the lower movable mold 22 is moved to the upper fixed mold 1.
8 is pushed up to the lower surface, and at this time the pair of guide plates 3 and 4 are pressed down by coming into contact with the upper fixed mold.

The bearing kit 31 in the position shown in FIG. 5(b) is pushed down to the position shown in FIG. 5(a). After the positioning hole 1a of the contact plate 1 is inserted into the pilot pin of the upper fixed mold,
It comes off from the finger pin 23 and is inserted into the pilot pin 16 of the lower movable mold 22, and the mold clamping is completed and the case is molded.

Therefore, according to this embodiment, since the contact plate 1 is reliably positioned, there is no risk of the finger pin 23 coming off or being positioned between the finger pin 23 and the pilot pin 16, so when the upper and lower molds are tightened. The fixed contacts of the contact plate 1 are prevented from being crushed.

[Effects of the Invention] As described above, according to the present invention, since the bearing kit is attached to the runner projecting plate so as to fit with the ejector guide pin, the positioning of the contact plate can be performed reliably.

[Brief explanation of the drawing]

FIG. 1 is a schematic sectional view showing an embodiment of the molding die device of the present invention, and FIGS. 2(a), (b), and (c) are side views showing a bearing kit used in the device of this embodiment. Plan view, sectional view, Figures 3(a) to (d) are configuration diagrams of the bearing kit, Figure 4 is a side view of the ejector pin used in the device of this embodiment, Figures 5(a) and (b) 6 is a side view explaining the operation of this embodiment, FIG. 6 is a schematic sectional view of the conventional example, and FIG.
The figure is a plan view showing the shape of the contact plate, and FIG. 8 is a sectional view showing the insert molding method. 1... Contact plate. 3.4...Guide plate. 6...Runner protruding board. 7... Molded product ejecting plate. DESCRIPTION OF SYMBOLS 10... Ejector rod, 12... Ejector guide pin, 12a, 12b... Fitting groove, 14... Runner ejecting bin, 15... Molded product ejecting bin. 16...Pilot bin. 17...Cavity, 18...Upper fixed mold. 19... Sprue, 20... Runner, 22... Lower movable mold, 23.e.finger bin, 31... Bearing kit. Patent applicant Alps Electric Co., Ltd. (c) Fig. 5 30 Kl Soi#Ipu'2〈 (CI)' (Alink゛Hono νri“- (b) Steel Yne゛(c) Ring high power (d)′\“ Aringu y'/s Fig. 3 Fig. 7

Claims (1)

[Claims] The lower movable mold is disposed opposite to the upper fixed mold, and the lower movable mold includes at least a guide plate for holding a molded object, a runner ejecting plate disposed below the guide plate, In a molding device equipped with an ejector guide pin slidably inserted through the runner ejector plate, a bearing kit is attached to the runner ejector plate, and the ejector guide pin is arranged so as to fit with the bearing kit. A molding device characterized by: