JPS63197356U - - Google Patents

Info

Publication number
JPS63197356U
JPS63197356U JP8986187U JP8986187U JPS63197356U JP S63197356 U JPS63197356 U JP S63197356U JP 8986187 U JP8986187 U JP 8986187U JP 8986187 U JP8986187 U JP 8986187U JP S63197356 U JPS63197356 U JP S63197356U
Authority
JP
Japan
Prior art keywords
power supply
chip
substrate
bonding
metallized wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8986187U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8986187U priority Critical patent/JPS63197356U/ja
Publication of JPS63197356U publication Critical patent/JPS63197356U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP8986187U 1987-06-10 1987-06-10 Pending JPS63197356U (US07968547-20110628-C00004.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8986187U JPS63197356U (US07968547-20110628-C00004.png) 1987-06-10 1987-06-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8986187U JPS63197356U (US07968547-20110628-C00004.png) 1987-06-10 1987-06-10

Publications (1)

Publication Number Publication Date
JPS63197356U true JPS63197356U (US07968547-20110628-C00004.png) 1988-12-19

Family

ID=30949226

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8986187U Pending JPS63197356U (US07968547-20110628-C00004.png) 1987-06-10 1987-06-10

Country Status (1)

Country Link
JP (1) JPS63197356U (US07968547-20110628-C00004.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993017457A1 (en) * 1989-07-01 1993-09-02 Ryo Enomoto Substrate for mounting semiconductor and method of producing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993017457A1 (en) * 1989-07-01 1993-09-02 Ryo Enomoto Substrate for mounting semiconductor and method of producing the same

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