JPS63197340U - - Google Patents

Info

Publication number
JPS63197340U
JPS63197340U JP1987088281U JP8828187U JPS63197340U JP S63197340 U JPS63197340 U JP S63197340U JP 1987088281 U JP1987088281 U JP 1987088281U JP 8828187 U JP8828187 U JP 8828187U JP S63197340 U JPS63197340 U JP S63197340U
Authority
JP
Japan
Prior art keywords
output
ultrasonic transducer
circuit
horn
arbitrarily set
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987088281U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987088281U priority Critical patent/JPS63197340U/ja
Publication of JPS63197340U publication Critical patent/JPS63197340U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例におけるボンデイン
グ面接触検出装置のブロツク図、第２図は第１図
のブロツク図に於ける主要部の動作波形、第３図
は従来のボンデイング面接触検出装置のブロツク
図、第４図は第３図のブロツク図に於ける主要部
の動作波形図である。 図中、１はキヤピラリ、２はホーン、３は超音
波振動子、４は超音波発生器、５は電流検出回路
、１２は比較回路、１３は誤検出防止回路である
。なお各図中同一符号は同一又は相当部分を示す
。 Fig. 1 is a block diagram of a bonding surface contact detection device according to an embodiment of the present invention, Fig. 2 is an operational waveform of the main parts in the block diagram of Fig. 1, and Fig. 3 is a conventional bonding surface contact detection device. FIG. 4 is an operational waveform diagram of the main parts in the block diagram of FIG. 3. In the figure, 1 is a capillary, 2 is a horn, 3 is an ultrasonic transducer, 4 is an ultrasonic generator, 5 is a current detection circuit, 12 is a comparison circuit, and 13 is an error detection prevention circuit. Note that the same reference numerals in each figure indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] キヤピラリを取付けたホーンと、これを振動せ
しめる超音波振動子と、該超音波振動子を交流定
電圧で駆動する超音波発生回路と、前記超音波振
動子の電流を検出する電流検出回路と、検出した
電流値が任意設定電流値を下回つた場合に信号を
出力しない比較回路と、該出力を誤検出か否か任
意設定時間枠で監視する誤検出防止回路とからな
るボンデイング面接触検出装置。 a horn to which a capillary is attached; an ultrasonic transducer for vibrating the horn; an ultrasonic generation circuit for driving the ultrasonic transducer with an AC constant voltage; a current detection circuit for detecting the current of the ultrasonic transducer; A bonding surface contact detection device consisting of a comparison circuit that does not output a signal when the detected current value falls below an arbitrarily set current value, and an erroneous detection prevention circuit that monitors the output in an arbitrarily set time frame to determine whether or not the output is a erroneous detection. .
JP1987088281U 1987-06-08 1987-06-08 Pending JPS63197340U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987088281U JPS63197340U (en) 1987-06-08 1987-06-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987088281U JPS63197340U (en) 1987-06-08 1987-06-08

Publications (1)

Publication Number Publication Date
JPS63197340U true JPS63197340U (en) 1988-12-19

Family

ID=30946253

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987088281U Pending JPS63197340U (en) 1987-06-08 1987-06-08

Country Status (1)

Country Link
JP (1) JPS63197340U (en)

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