JPS63195756U - - Google Patents
Info
- Publication number
- JPS63195756U JPS63195756U JP8722687U JP8722687U JPS63195756U JP S63195756 U JPS63195756 U JP S63195756U JP 8722687 U JP8722687 U JP 8722687U JP 8722687 U JP8722687 U JP 8722687U JP S63195756 U JPS63195756 U JP S63195756U
- Authority
- JP
- Japan
- Prior art keywords
- container
- lid
- attached
- semiconductor chip
- container body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Casings For Electric Apparatus (AREA)
Description
第1図は本考案の実施例の縦断面図を示し、第
2図は第1図の側面図、第3図は第1図の蓋の天
面側を下方か見た断面図、第4図は第1図の容器
本体の底面側を上方から見た断面図、第5図は従
来例の側断面図である。 10……容器、11……容器本体、12……蓋
、13……底面、16……天面、4a,4b……
半導体チツプ。
2図は第1図の側面図、第3図は第1図の蓋の天
面側を下方か見た断面図、第4図は第1図の容器
本体の底面側を上方から見た断面図、第5図は従
来例の側断面図である。 10……容器、11……容器本体、12……蓋
、13……底面、16……天面、4a,4b……
半導体チツプ。
Claims (1)
- 【実用新案登録請求の範囲】 (1) 中空を有する容器の互いに対向する内面の
それぞれに、集積回路が印刷された半導体チツプ
を取着して成ることを特徴とする半導体装置。 (2) 容器は、容器本体と蓋とから成り、容器本
体の底面と蓋の天面とにそれぞれ半導体チツプを
取着して成ることを特徴とする実用新案登録請求
の範囲第1項記載の半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8722687U JPS63195756U (ja) | 1987-06-05 | 1987-06-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8722687U JPS63195756U (ja) | 1987-06-05 | 1987-06-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63195756U true JPS63195756U (ja) | 1988-12-16 |
Family
ID=30944255
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8722687U Pending JPS63195756U (ja) | 1987-06-05 | 1987-06-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63195756U (ja) |
-
1987
- 1987-06-05 JP JP8722687U patent/JPS63195756U/ja active Pending