JPS63195749U - - Google Patents

Info

Publication number
JPS63195749U
JPS63195749U JP8622887U JP8622887U JPS63195749U JP S63195749 U JPS63195749 U JP S63195749U JP 8622887 U JP8622887 U JP 8622887U JP 8622887 U JP8622887 U JP 8622887U JP S63195749 U JPS63195749 U JP S63195749U
Authority
JP
Japan
Prior art keywords
bellows
refrigerant passage
closed
refrigerant
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8622887U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8622887U priority Critical patent/JPS63195749U/ja
Publication of JPS63195749U publication Critical patent/JPS63195749U/ja
Pending legal-status Critical Current

Links

JP8622887U 1987-06-04 1987-06-04 Pending JPS63195749U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8622887U JPS63195749U (enrdf_load_stackoverflow) 1987-06-04 1987-06-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8622887U JPS63195749U (enrdf_load_stackoverflow) 1987-06-04 1987-06-04

Publications (1)

Publication Number Publication Date
JPS63195749U true JPS63195749U (enrdf_load_stackoverflow) 1988-12-16

Family

ID=30942348

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8622887U Pending JPS63195749U (enrdf_load_stackoverflow) 1987-06-04 1987-06-04

Country Status (1)

Country Link
JP (1) JPS63195749U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100673380B1 (ko) 2004-12-20 2007-01-24 삼성전자주식회사 냉매로가 형성된 반도체 칩과, 그를 이용한 반도체 패키지및 반도체 패키지 냉각 시스템

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100673380B1 (ko) 2004-12-20 2007-01-24 삼성전자주식회사 냉매로가 형성된 반도체 칩과, 그를 이용한 반도체 패키지및 반도체 패키지 냉각 시스템

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