JPS63195748U - - Google Patents
Info
- Publication number
- JPS63195748U JPS63195748U JP1987086587U JP8658787U JPS63195748U JP S63195748 U JPS63195748 U JP S63195748U JP 1987086587 U JP1987086587 U JP 1987086587U JP 8658787 U JP8658787 U JP 8658787U JP S63195748 U JPS63195748 U JP S63195748U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- memory alloy
- shape memory
- electronic component
- elastic member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims 2
- 230000020169 heat generation Effects 0.000 claims 1
- 230000008646 thermal stress Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987086587U JPS63195748U (US08066781-20111129-C00013.png) | 1987-06-03 | 1987-06-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987086587U JPS63195748U (US08066781-20111129-C00013.png) | 1987-06-03 | 1987-06-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63195748U true JPS63195748U (US08066781-20111129-C00013.png) | 1988-12-16 |
Family
ID=30943028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987086587U Pending JPS63195748U (US08066781-20111129-C00013.png) | 1987-06-03 | 1987-06-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63195748U (US08066781-20111129-C00013.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0794912A (ja) * | 1993-07-12 | 1995-04-07 | Nec Corp | マイクロ波回路の実装構造 |
| WO2002074032A1 (en) * | 2001-03-02 | 2002-09-19 | Sanyo Electric Co., Ltd. | Electronic device |
-
1987
- 1987-06-03 JP JP1987086587U patent/JPS63195748U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0794912A (ja) * | 1993-07-12 | 1995-04-07 | Nec Corp | マイクロ波回路の実装構造 |
| WO2002074032A1 (en) * | 2001-03-02 | 2002-09-19 | Sanyo Electric Co., Ltd. | Electronic device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS63195748U (US08066781-20111129-C00013.png) | ||
| JPH02104696U (US08066781-20111129-C00013.png) | ||
| JPS63200346U (US08066781-20111129-C00013.png) | ||
| JPS59123387U (ja) | 発熱部品の取付装置 | |
| JPH029445U (US08066781-20111129-C00013.png) | ||
| JPH02113341U (US08066781-20111129-C00013.png) | ||
| JPS5926260U (ja) | 電子部品のリ−ド構造 | |
| JPS5827945U (ja) | 発熱電子部品の放熱構造 | |
| JPS5911452U (ja) | 放熱器付き電子部品装置 | |
| JPS6052629U (ja) | 混成集積回路装置 | |
| JPS6039291U (ja) | 電子部品の締付機構 | |
| JPH0217891U (US08066781-20111129-C00013.png) | ||
| JPH0279048U (US08066781-20111129-C00013.png) | ||
| JPS6039290U (ja) | 電子部品の締付機構 | |
| JPH0415892U (US08066781-20111129-C00013.png) | ||
| JPS58162645U (ja) | 放熱具 | |
| JPS59177955U (ja) | プリント配線基板に用いられる放熱器 | |
| JPH031489U (US08066781-20111129-C00013.png) | ||
| JPS60118291U (ja) | プリント基板アセンブリ | |
| JPS62178593U (US08066781-20111129-C00013.png) | ||
| JPH01169088U (US08066781-20111129-C00013.png) | ||
| JPS58166089U (ja) | プリント配線板装置 | |
| JPS6071195U (ja) | プリント基板における放熱装置 | |
| JPS61196572U (US08066781-20111129-C00013.png) | ||
| JPS6112281U (ja) | 熱発生素子取付金具 |
