JPS63193880U - - Google Patents
Info
- Publication number
- JPS63193880U JPS63193880U JP1987084727U JP8472787U JPS63193880U JP S63193880 U JPS63193880 U JP S63193880U JP 1987084727 U JP1987084727 U JP 1987084727U JP 8472787 U JP8472787 U JP 8472787U JP S63193880 U JPS63193880 U JP S63193880U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- components
- component surface
- solder surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Housings And Mounting Of Transformers (AREA)
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987084727U JPS63193880U (ko) | 1987-05-30 | 1987-05-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987084727U JPS63193880U (ko) | 1987-05-30 | 1987-05-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63193880U true JPS63193880U (ko) | 1988-12-14 |
Family
ID=30939488
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987084727U Pending JPS63193880U (ko) | 1987-05-30 | 1987-05-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63193880U (ko) |
-
1987
- 1987-05-30 JP JP1987084727U patent/JPS63193880U/ja active Pending