JPS63193810A - Manufacture of large-sized resin molded body - Google Patents
Manufacture of large-sized resin molded bodyInfo
- Publication number
- JPS63193810A JPS63193810A JP2675887A JP2675887A JPS63193810A JP S63193810 A JPS63193810 A JP S63193810A JP 2675887 A JP2675887 A JP 2675887A JP 2675887 A JP2675887 A JP 2675887A JP S63193810 A JPS63193810 A JP S63193810A
- Authority
- JP
- Japan
- Prior art keywords
- raw material
- mold
- monomer
- polymer
- polymerization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title claims description 11
- 229920005989 resin Polymers 0.000 title claims description 11
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000000178 monomer Substances 0.000 claims abstract description 56
- 239000002994 raw material Substances 0.000 claims abstract description 55
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 24
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 21
- 229920000642 polymer Polymers 0.000 claims abstract description 20
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 239000007788 liquid Substances 0.000 claims description 61
- 230000000379 polymerizing effect Effects 0.000 claims description 3
- 238000005034 decoration Methods 0.000 claims description 2
- 238000006116 polymerization reaction Methods 0.000 abstract description 37
- 238000000034 method Methods 0.000 abstract description 21
- 239000003505 polymerization initiator Substances 0.000 abstract description 18
- 239000000203 mixture Substances 0.000 abstract description 13
- 239000000463 material Substances 0.000 abstract description 9
- 239000011800 void material Substances 0.000 abstract description 5
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 abstract description 4
- 238000005187 foaming Methods 0.000 abstract description 4
- 239000000654 additive Substances 0.000 abstract description 2
- 239000003795 chemical substances by application Substances 0.000 abstract 3
- 230000000996 additive effect Effects 0.000 abstract 1
- 239000012752 auxiliary agent Substances 0.000 abstract 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 40
- 239000000047 product Substances 0.000 description 37
- -1 aliphatic alcohols Chemical class 0.000 description 26
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 15
- 239000006188 syrup Substances 0.000 description 15
- 235000020357 syrup Nutrition 0.000 description 15
- 238000002156 mixing Methods 0.000 description 13
- 238000002360 preparation method Methods 0.000 description 11
- 238000002347 injection Methods 0.000 description 9
- 239000007924 injection Substances 0.000 description 9
- 238000000465 moulding Methods 0.000 description 9
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 8
- 150000001412 amines Chemical class 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2,2'-azo-bis-isobutyronitrile Substances N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 7
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 7
- 238000009415 formwork Methods 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 150000002989 phenols Chemical class 0.000 description 6
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 4
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 150000002366 halogen compounds Chemical class 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- BFDDMZKDAIOGFP-UHFFFAOYSA-N n,n-dimethyloctan-1-amine;hydrochloride Chemical compound [Cl-].CCCCCCCC[NH+](C)C BFDDMZKDAIOGFP-UHFFFAOYSA-N 0.000 description 3
- 150000002894 organic compounds Chemical class 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 2
- VZVNPHQRMOLXML-SNAWJCMRSA-N (z)-2-tert-butylbut-2-enedioic acid Chemical compound CC(C)(C)C(\C(O)=O)=C\C(O)=O VZVNPHQRMOLXML-SNAWJCMRSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- KTZVZZJJVJQZHV-UHFFFAOYSA-N 1-chloro-4-ethenylbenzene Chemical compound ClC1=CC=C(C=C)C=C1 KTZVZZJJVJQZHV-UHFFFAOYSA-N 0.000 description 2
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 2
- PSYGHMBJXWRQFD-UHFFFAOYSA-N 2-(2-sulfanylacetyl)oxyethyl 2-sulfanylacetate Chemical compound SCC(=O)OCCOC(=O)CS PSYGHMBJXWRQFD-UHFFFAOYSA-N 0.000 description 2
- LTHJXDSHSVNJKG-UHFFFAOYSA-N 2-[2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOCCOC(=O)C(C)=C LTHJXDSHSVNJKG-UHFFFAOYSA-N 0.000 description 2
- PMNLUUOXGOOLSP-UHFFFAOYSA-N 2-mercaptopropanoic acid Chemical compound CC(S)C(O)=O PMNLUUOXGOOLSP-UHFFFAOYSA-N 0.000 description 2
- HTSABYAWKQAHBT-UHFFFAOYSA-N 3-methylcyclohexanol Chemical compound CC1CCCC(O)C1 HTSABYAWKQAHBT-UHFFFAOYSA-N 0.000 description 2
- MQWCXKGKQLNYQG-UHFFFAOYSA-N 4-methylcyclohexan-1-ol Chemical compound CC1CCC(O)CC1 MQWCXKGKQLNYQG-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229940120693 copper naphthenate Drugs 0.000 description 2
- SEVNKWFHTNVOLD-UHFFFAOYSA-L copper;3-(4-ethylcyclohexyl)propanoate;3-(3-ethylcyclopentyl)propanoate Chemical compound [Cu+2].CCC1CCC(CCC([O-])=O)C1.CCC1CCC(CCC([O-])=O)CC1 SEVNKWFHTNVOLD-UHFFFAOYSA-L 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 239000000113 methacrylic resin Substances 0.000 description 2
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 238000007142 ring opening reaction Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 238000003856 thermoforming Methods 0.000 description 2
- 150000003585 thioureas Chemical class 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- KPQOXMCRYWDRSB-UHFFFAOYSA-N 1-(2-chlorophenyl)pyrrole-2,5-dione Chemical compound ClC1=CC=CC=C1N1C(=O)C=CC1=O KPQOXMCRYWDRSB-UHFFFAOYSA-N 0.000 description 1
- QYOJZFBQEAZNEW-UHFFFAOYSA-N 1-(2-methylphenyl)pyrrole-2,5-dione Chemical compound CC1=CC=CC=C1N1C(=O)C=CC1=O QYOJZFBQEAZNEW-UHFFFAOYSA-N 0.000 description 1
- WGGLDBIZIQMEGH-UHFFFAOYSA-N 1-bromo-4-ethenylbenzene Chemical compound BrC1=CC=C(C=C)C=C1 WGGLDBIZIQMEGH-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- OBETXYAYXDNJHR-UHFFFAOYSA-N 2-Ethylhexanoic acid Chemical compound CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- OXHVCLNCFNQWON-UHFFFAOYSA-N 2-methyladamantan-1-ol Chemical compound C1C(C2)CC3CC1C(C)C2(O)C3 OXHVCLNCFNQWON-UHFFFAOYSA-N 0.000 description 1
- LFYXNXGVLGKVCJ-UHFFFAOYSA-N 2-methylisoborneol Chemical compound C1CC2(C)C(C)(O)CC1C2(C)C LFYXNXGVLGKVCJ-UHFFFAOYSA-N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- PMNLUUOXGOOLSP-UHFFFAOYSA-M 2-sulfanylpropanoate Chemical compound CC(S)C([O-])=O PMNLUUOXGOOLSP-UHFFFAOYSA-M 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- HNNQYHFROJDYHQ-UHFFFAOYSA-N 3-(4-ethylcyclohexyl)propanoic acid 3-(3-ethylcyclopentyl)propanoic acid Chemical compound CCC1CCC(CCC(O)=O)C1.CCC1CCC(CCC(O)=O)CC1 HNNQYHFROJDYHQ-UHFFFAOYSA-N 0.000 description 1
- WGKYSFRFMQHMOF-UHFFFAOYSA-N 3-bromo-5-methylpyridine-2-carbonitrile Chemical compound CC1=CN=C(C#N)C(Br)=C1 WGKYSFRFMQHMOF-UHFFFAOYSA-N 0.000 description 1
- LJFGNNHKXSJWFF-UHFFFAOYSA-N 3-ethyladamantan-1-ol Chemical compound C1C(C2)CC3CC2(O)CC1(CC)C3 LJFGNNHKXSJWFF-UHFFFAOYSA-N 0.000 description 1
- MKTOIPPVFPJEQO-UHFFFAOYSA-N 4-(3-carboxypropanoylperoxy)-4-oxobutanoic acid Chemical compound OC(=O)CCC(=O)OOC(=O)CCC(O)=O MKTOIPPVFPJEQO-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- DTGKSKDOIYIVQL-MRTMQBJTSA-N Isoborneol Natural products C1C[C@@]2(C)[C@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-MRTMQBJTSA-N 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- KFFQABQEJATQAT-UHFFFAOYSA-N N,N'-dibutylthiourea Chemical compound CCCCNC(=S)NCCCC KFFQABQEJATQAT-UHFFFAOYSA-N 0.000 description 1
- GHAZCVNUKKZTLG-UHFFFAOYSA-N N-ethyl-succinimide Natural products CCN1C(=O)CCC1=O GHAZCVNUKKZTLG-UHFFFAOYSA-N 0.000 description 1
- HDFGOPSGAURCEO-UHFFFAOYSA-N N-ethylmaleimide Chemical compound CCN1C(=O)C=CC1=O HDFGOPSGAURCEO-UHFFFAOYSA-N 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- MNOILHPDHOHILI-UHFFFAOYSA-N Tetramethylthiourea Chemical compound CN(C)C(=S)N(C)C MNOILHPDHOHILI-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- FOWDOWQYRZXQDP-UHFFFAOYSA-N adamantan-2-ol Chemical compound C1C(C2)CC3CC1C(O)C2C3 FOWDOWQYRZXQDP-UHFFFAOYSA-N 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- CKDOCTFBFTVPSN-UHFFFAOYSA-N borneol Natural products C1CC2(C)C(C)CC1C2(C)C CKDOCTFBFTVPSN-UHFFFAOYSA-N 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- FSRYENDEMMDKMT-UHFFFAOYSA-N butoxy ethaneperoxoate Chemical compound CCCCOOOC(C)=O FSRYENDEMMDKMT-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- SHZIWNPUGXLXDT-UHFFFAOYSA-N caproic acid ethyl ester Natural products CCCCCC(=O)OCC SHZIWNPUGXLXDT-UHFFFAOYSA-N 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- NKKMVIVFRUYPLQ-NSCUHMNNSA-N crotononitrile Chemical compound C\C=C\C#N NKKMVIVFRUYPLQ-NSCUHMNNSA-N 0.000 description 1
- VOMQDZMRGKGVQT-UHFFFAOYSA-N cyclohex-2-yn-1-ol Chemical compound OC1CCCC#C1 VOMQDZMRGKGVQT-UHFFFAOYSA-N 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- DTGKSKDOIYIVQL-UHFFFAOYSA-N dl-isoborneol Natural products C1CC2(C)C(O)CC1C2(C)C DTGKSKDOIYIVQL-UHFFFAOYSA-N 0.000 description 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 1
- PGQAXGHQYGXVDC-UHFFFAOYSA-N dodecyl(dimethyl)azanium;chloride Chemical compound Cl.CCCCCCCCCCCCN(C)C PGQAXGHQYGXVDC-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Chemical compound CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000004817 gas chromatography Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910000039 hydrogen halide Inorganic materials 0.000 description 1
- 239000012433 hydrogen halide Substances 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- DCUFMVPCXCSVNP-UHFFFAOYSA-N methacrylic anhydride Chemical compound CC(=C)C(=O)OC(=O)C(C)=C DCUFMVPCXCSVNP-UHFFFAOYSA-N 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000847 nonoxynol Polymers 0.000 description 1
- NWAHZAIDMVNENC-UHFFFAOYSA-N octahydro-1h-4,7-methanoinden-5-yl methacrylate Chemical compound C12CCCC2C2CC(OC(=O)C(=C)C)C1C2 NWAHZAIDMVNENC-UHFFFAOYSA-N 0.000 description 1
- KZCOBXFFBQJQHH-UHFFFAOYSA-N octane-1-thiol Chemical compound CCCCCCCCS KZCOBXFFBQJQHH-UHFFFAOYSA-N 0.000 description 1
- 150000004967 organic peroxy acids Chemical class 0.000 description 1
- 125000003854 p-chlorophenyl group Chemical group [H]C1=C([H])C(*)=C([H])C([H])=C1Cl 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- GCKZNUDNTDWGFM-UHFFFAOYSA-N pentane-2,4-dione;tin Chemical compound [Sn].CC(=O)CC(C)=O GCKZNUDNTDWGFM-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000000864 peroxy group Chemical group O(O*)* 0.000 description 1
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 150000008301 phosphite esters Chemical class 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- XTTGYFREQJCEML-UHFFFAOYSA-N tributyl phosphite Chemical compound CCCCOP(OCCCC)OCCCC XTTGYFREQJCEML-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、ビニル系樹脂による、大型の成形体を注型重
合で製造する方法に関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a method for producing a large-sized molded article of vinyl resin by cast polymerization.
〈従来の技術〉
一般にビニル系単量体から得られるビニル系樹脂は、家
庭用、工業用を問わず、幾多の成形体が出回っている。<Prior Art> In general, many molded products of vinyl resins obtained from vinyl monomers are on the market, whether for household or industrial use.
ビニル系樹脂の成形は、粉末状、ビーズ状、ペレット状
、シート状等の重合体を高温で溶融、軟化させ、射出圧
形、圧縮成形、熱成形などの方法により行なわれている
。Vinyl resins are molded by melting and softening polymers in the form of powders, beads, pellets, sheets, etc. at high temperatures, and using methods such as injection molding, compression molding, and thermoforming.
一方、ビニル系の単量体から直接得るべき成形体の形状
に重合硬化させる注型重合の方法がある。On the other hand, there is a casting polymerization method in which a vinyl monomer is directly polymerized and cured into the shape of a molded article to be obtained.
この単量体としてメタクリル酸メチルやエチレングリコ
ールビスアリルカーボネートt−用い、ガラス製の型枠
内で通常数時間以上の時間を要し、ゆっくり重合しメタ
クリル樹脂板やメガネレンズを得る方法が知られている
。A known method is to use methyl methacrylate or ethylene glycol bisallyl carbonate t- as the monomer and slowly polymerize it in a glass mold, usually for several hours or more, to obtain methacrylic resin plates and eyeglass lenses. ing.
特開昭60−258219号公報、特開昭61−207
408号公報などにおいては、メタクリル酸メチルやス
チレン系単量体を用い、型枠内で重合硬化させて得られ
るディスク用基盤が提案されている。JP-A-60-258219, JP-A-61-207
No. 408, etc., proposes a disk base obtained by polymerizing and curing in a mold using methyl methacrylate or a styrene monomer.
これらの従来の注型重合法では、単量体と重合開始剤等
の各成分は一括混合し、型枠に流し込んで重合させてい
る。In these conventional cast polymerization methods, components such as a monomer and a polymerization initiator are mixed all at once, and the mixture is poured into a mold and polymerized.
〈発明が解決しようとする問題〉
ビニル系重合体を射出成形などの溶融成形により、大型
の成形品を得るためには、溶融した状態においても粘度
が高いことから金型に注入するため、特に高温・高圧を
必要とする。<Problem to be solved by the invention> In order to obtain large molded products by melt molding such as injection molding, vinyl polymers have a high viscosity even in the molten state, so it is especially difficult to inject them into a mold. Requires high temperature and pressure.
これらの重合体は、一般に高温下では熱分解や劣化が起
る。These polymers generally undergo thermal decomposition and deterioration at high temperatures.
また、板状のビニル系重合体を軟化させて成形する圧縮
成形や熱成形においては、加工性が劣り、複雑な形状へ
の適用に限界がある。Furthermore, compression molding and thermoforming, in which plate-shaped vinyl polymers are softened and molded, have poor processability, and there are limits to their applicability to complex shapes.
更に、かかる重合体を用いる成形では、粘度が高いこと
から大型の成形品や型面の精密な転写の要求される成形
品への適用に限界があり、多くの場合多大な費用と高度
の技術を要し、また内部歪みが大きく、変形やが性能の
低下が起きやすい。Furthermore, due to the high viscosity of molding using such polymers, there is a limit to its application to large molded products or molded products that require precise transfer of the mold surface, and in many cases requires large costs and advanced technology. In addition, internal distortion is large, and deformation and performance deterioration are likely to occur.
一方、ビニル系単量体を主とする原料液から注型重合に
より製品を得るには、重合に伴ない原料液が、発熱と体
積収縮を伴なうため、長時間を要している。On the other hand, it takes a long time to obtain a product by cast polymerization from a raw material liquid mainly containing vinyl monomers because the raw material liquid undergoes heat generation and volumetric contraction during polymerization.
特開昭60−258219号公報、特開昭61−207
408号公報のように薄く比較的小さいディスク等では
、発熱による発泡や体積収縮による表面のヒケ、内部の
ボイドあるいは歪みなどは少ないが、この方法をそのま
ま大型成形体を短時間で製作する場合には、大きな問題
となる。JP-A-60-258219, JP-A-61-207
In the case of thin and relatively small disks such as those disclosed in Publication No. 408, there are few surface sinks, internal voids, or distortions due to foaming due to heat generation or volumetric contraction, but this method is not suitable for producing large molded objects in a short time. becomes a big problem.
本発明の目的は、比較的短時間で表面、内部にへこみボ
イド歪み等がない型面が正確に転写された大型の成形品
を提供することにある。An object of the present invention is to provide a large-sized molded product whose mold surface is accurately transferred without dents, voids, distortions, etc. on the surface or inside in a relatively short time.
く問題を解決するための手段〉
本発明は、重合体を含むまたは含まないビニル系単量体
から主としてなる原料液を用い、型枠内に注入し、加熱
加圧下で重合硬化させることを特徴とする大型の樹脂成
形体の製造方法である。Means for Solving the Problems The present invention is characterized by using a raw material liquid mainly consisting of a vinyl monomer containing or not containing a polymer, injecting it into a mold, and polymerizing and curing it under heat and pressure. This is a method for manufacturing a large resin molded body.
本発明で用いる重合体を含むまたは含まないビニル系単
量体から主としてなる原料液とは、ビニル単量体または
ビニリデン単量体を主として用いた単量体組成物あるい
は、これらの単量体に可溶な重合体を溶存させた単量体
組成物を主剤とし、これに重合開始剤を含有するもので
あり、必要に応じ、重合促進剤等の各種補助剤、添加剤
類等を一緒あるいは別々に混合、溶解させたものである
。The raw material liquid mainly composed of vinyl monomers containing or not containing polymers used in the present invention refers to monomer compositions mainly containing vinyl monomers or vinylidene monomers, or monomer compositions containing mainly vinyl monomers or vinylidene monomers, or The main ingredient is a monomer composition in which a soluble polymer is dissolved, and it contains a polymerization initiator, and if necessary, various auxiliaries and additives such as a polymerization accelerator may be added together or They are mixed and dissolved separately.
本発明において反応性原料液の主成分として用いられる
ビニル系単量体とは、分子内に少なくとも一つの重合可
能な不飽和炭素結合を有する単量体をいい、具体的には
、(メタ)アクリル酸メチル、(メタ)アクリル酸エチ
ル、(メタ)アクリル酸ブチル、(メタ)アクリル酸イ
ソプロピル、(メタ)アクリル酸イソボルニル、(メタ
)アクリル酸ボルニル、(メタ)アクリル酸シクロヘキ
ノル、(メタ)アクリル酸ジシクロペンタニル、(メタ
)アクリル酸フェニル、(メタ)アクリル酸ベンジル、
(メタ)アクリル酸トリブロモフェニル、(メタ)アク
リル酸フルフリルなどの炭素数1〜25の脂肪族アルコ
ール、脂環式アルコール、複素環式アルコール、芳香族
アルコールまたはフェノール、ハロゲン含有芳香族アル
コールまたはフェノールとのアクリル酸エステル類及び
メタクリル酸エステル類;あるいはスチレン、α−メチ
ルスチレン、p−メチルスチレン、p−クロルスチレン
、p−ブロムスチレンなどの芳香族ビニル化合物:アク
リロニトリル、メタクリロニトリル、クロトニトリルな
どのビニルニトリル類:酢酸ビニルなどのビニルエステ
ル類:(メタ)アクリル酸銅、(メタ)アクリル酸ネオ
ジウム、(メタ)アクリル酸鉛などの(メタ)アクリル
酸金属塩ニアクリル酸、メタクリル酸、マレイン酸、無
水マレイン酸などの不飽和カルボン酸類:N−フェニル
マレイミド、N−)リルマレイミド、N−シクロヘキシ
ルマレイミド、N −0−ブロムフェニルマレイミド、
N−エチルマレイミド等のマレイミド類などを挙げるこ
とができる。The vinyl monomer used as the main component of the reactive raw material liquid in the present invention refers to a monomer having at least one polymerizable unsaturated carbon bond in the molecule, and specifically, (meth) Methyl acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, isopropyl (meth)acrylate, isobornyl (meth)acrylate, bornyl (meth)acrylate, cyclohexynol (meth)acrylate, (meth)acrylate dicyclopentanyl acrylate, phenyl (meth)acrylate, benzyl (meth)acrylate,
C1-25 aliphatic alcohols, alicyclic alcohols, heterocyclic alcohols, aromatic alcohols or phenols, halogen-containing aromatic alcohols or phenols, such as tribromophenyl (meth)acrylate, furfuryl (meth)acrylate, etc. acrylic esters and methacrylic esters; or aromatic vinyl compounds such as styrene, α-methylstyrene, p-methylstyrene, p-chlorostyrene, p-bromustyrene: acrylonitrile, methacrylonitrile, crotonitrile, etc. Vinyl nitriles: Vinyl esters such as vinyl acetate: Metal salts of (meth)acrylates such as copper (meth)acrylate, neodymium (meth)acrylate, and lead (meth)acrylate Niacrylic acid, methacrylic acid, and maleic acid , unsaturated carboxylic acids such as maleic anhydride: N-phenylmaleimide, N-)lylmaleimide, N-cyclohexylmaleimide, N-0-bromphenylmaleimide,
Examples include maleimides such as N-ethylmaleimide.
かかるビニルまたはビニリデン単量体の選択は、目的と
する重合体の具備すべき性能によって定める。The selection of the vinyl or vinylidene monomer is determined by the desired performance of the polymer.
例えば、耐熱性が要求される成形体においては、重合体
のガラス転移温度が高い単量体を主として選べば良い。For example, in a molded article that requires heat resistance, monomers whose polymer glass transition temperature is high may be mainly selected.
かかる単量体としては、例えば(メタ)アクリル酸イソ
ボルニル、(メタ)アクリル酸ボルニル、(メタ)アク
リル酸フェニル、メタアクリル酸フェンチル、(メタ)
アクリル酸ジシクロペンタニル、(メタ)アクリル酸1
−アダマンクン、(メタ)アクリル酸3.5ジメチルア
ダマンクン、α−メチルスチレン、N−フェニルマレイ
ミド、N−トリルマレイミド、N−(O−クロロフェニ
ル)マレイミド、無水マレイン酸、無水メタクリル酸等
が挙げられる。Examples of such monomers include isobornyl (meth)acrylate, bornyl (meth)acrylate, phenyl (meth)acrylate, fentyl methacrylate, and (meth)acrylate.
Dicyclopentanyl acrylate, (meth)acrylic acid 1
-adamancune, 3.5 dimethyladamancune (meth)acrylate, α-methylstyrene, N-phenylmaleimide, N-tolylmaleimide, N-(O-chlorophenyl)maleimide, maleic anhydride, methacrylic anhydride, etc. .
また、例えば低@湿性が要求される成形体においては、
炭素数が6〜25の脂肪族アルコール、脂環式アルコー
ル、芳香族アルコールまたはフェノールとの(メタ)ア
クリル酸エステルや芳香族ビニル化合物から選1fれた
単量体を主として選べば良い。In addition, for example, in molded products that require low humidity,
The monomer selected from among aliphatic alcohols having 6 to 25 carbon atoms, alicyclic alcohols, aromatic alcohols, or (meth)acrylic acid esters with phenols and aromatic vinyl compounds may be mainly selected.
かかる単量体としては、例えば炭素数が6〜25のアル
コールまたはフェノールとしてフェノール、ベンジルア
ルコール、シクロヘキサノール、4−メチルシクロヘキ
サノール、2,2゜5−トリメチルシクロヘキサノール
、2−アダマンタノール、3−メチル−1−アダマンタ
ノール、3−エチルアダマンタノール、p−メンタノー
ル−8、p−メンタノール−2、オクタヒドロ−4,7
−メンタフインデン−1−イルメタノール、イソボルネ
オール、2−メチルカンファノール、l−メンタノール
などとのメタクリル酸エステルやスチレン、α−メチル
スチレン、ビニルトルエン等の芳香族ビニル化合物が挙
げられる。Examples of such monomers include alcohols having 6 to 25 carbon atoms or phenols such as phenol, benzyl alcohol, cyclohexanol, 4-methylcyclohexanol, 2,2°5-trimethylcyclohexanol, 2-adamantanol, and 3-methylcyclohexanol. Methyl-1-adamantanol, 3-ethyladamantanol, p-menthanol-8, p-menthanol-2, octahydro-4,7
Examples include methacrylic acid esters with -menthafinden-1-ylmethanol, isoborneol, 2-methylcamphanol, l-menthanol, etc., and aromatic vinyl compounds such as styrene, α-methylstyrene, and vinyltoluene.
また、更に高屈折率を要求される成形体においては、芳
香族アルコールまたはフェノール、ハロゲン含有芳香族
アルコールまたはフェノールとの(メタ)アクリル酸エ
ステル、あるいは芳香族ビニル単量体から主として選べ
ば良い。In addition, in the case of a molded article requiring a higher refractive index, the material may be mainly selected from aromatic alcohols or phenols, (meth)acrylic acid esters with halogen-containing aromatic alcohols or phenols, or aromatic vinyl monomers.
かかる単量体としては、例えば(メタ)アクリル酸フェ
ニル、(メタ)アクリル酸ベンジル、(メタ)アクリル
酸フェネチル、(メタ)アクリル酸p−ブロムフェニル
、(メタ)アクリル酸−p−クロルフェニル、(メタ)
アクリル酸トリブロムフェニル、(メタ)アクリル酸−
p−ブロムベンジル、スチレン、α−メチルスチレン、
p−クロルスチレン、p−ブロムスチレンなどが挙げら
れる。Examples of such monomers include phenyl (meth)acrylate, benzyl (meth)acrylate, phenethyl (meth)acrylate, p-bromphenyl (meth)acrylate, p-chlorophenyl (meth)acrylate, (meta)
Tribromphenyl acrylate, (meth)acrylic acid-
p-Brombenzyl, styrene, α-methylstyrene,
Examples include p-chlorostyrene and p-bromstyrene.
特に、重合硬化性及び透明性等の点で、分子内にアクリ
ロキシ基、メタクリロキシ基を含有する単量体、芳香族
ビニル化合物がら選ばれた少なくとも一種を主として用
いることが好ましい。In particular, from the viewpoint of polymerization curability and transparency, it is preferable to mainly use at least one selected from monomers containing acryloxy groups and methacryloxy groups in the molecule, and aromatic vinyl compounds.
かかるビニル系単量体は、単独あるいは併用して用いる
ことができ、更に他の共重合可能な単量体を併用するこ
ともできる。Such vinyl monomers can be used alone or in combination, and other copolymerizable monomers can also be used in combination.
かかる他の共重合可能な単量体としては、アクリルアミ
ド、メタクリルアミド等の不飽和アミド類ニゲリシジル
(メタ)アクリレート、2−ヒドロキシエチル(メタ)
アクリレート、ジアミノエチル(メタ)クリレートなど
を挙げることができる。Such other copolymerizable monomers include unsaturated amides such as acrylamide and methacrylamide, nigericidyl (meth)acrylate, 2-hydroxyethyl (meth)
Examples include acrylate, diaminoethyl (meth)acrylate, and the like.
かかる他の共重合可能な単量体は、ビニル系単量体に対
し、重合体の性能に支障のない範囲で使用できるが、通
常、50重量%以下の範囲で使用する。Such other copolymerizable monomers can be used within a range that does not adversely affect the performance of the polymer, but are usually used in an amount of 50% by weight or less relative to the vinyl monomer.
また、本発明において、更に成形品の強度や耐薬品性な
どを向上させるため、分子内に少なくとも二つ以上の重
合可能な不飽和炭素結合を有する多官能性不飽和単量体
を用いることができる。In addition, in the present invention, in order to further improve the strength and chemical resistance of the molded article, it is possible to use a polyfunctional unsaturated monomer having at least two or more polymerizable unsaturated carbon bonds in the molecule. can.
かかる多官能性不飽和単量体としては、エチレングリコ
ールジ(メタ)アクリレート、ジエチレングリコールジ
(メタ)アクリレート、トリエチレングリコールジ(メ
タ)アクリレート、テトラエチレングリコールジ(メタ
)アクリレート、ノナエチレングリコールジ(メタ)ア
クリレート、テトラデ力エチレングリコールジ(メタ)
アクリレートなどのエチレングリコールまたはそのオリ
ゴマーの両末端水酸基をアクリル酸またはメタクリル酸
でエステル化したちの;ネオペンチルグリコールジ(メ
タ)アクリレート、ヘキサンジオールジ(メタ)アクリ
レート、ブタンジオールジ(メタ)アクリレート等の他
の2価アルコールの水酸基をアクリル酸またはメタクリ
ル酸でエステル化したもの;ビスフェノールAまたはビ
スフェノール−へのアルキレンオキサイド付加物または
これらのハロゲン置換体の両末端水酸基を、アクリル酸
またはメタクリル酸でエステル化したちの;トリメチロ
ールプロパン、ペンタエリスリトール等の多価アルコー
ルをアクリル酸またはメタクリル酸でエステル化したも
の;及び、これらの2価アルコールまたは多価アルコー
ルの末端水酸基にグリシジルアクリレートまたはグリシ
ジルメタクリレートのエポキシ基を開環付加させたちの
;コハク酸、アジピン酸、テレフタール酸、フタール酸
またはこれらのハロゲン置換体等の二塩基酸、またはこ
れらのアルキレンオキサイド付加物にグリシジルアクリ
レートまたはグリシジルメタクリレートのエポキシ基を
開環付加させたちの;アリールメタクリレート、ジビニ
ルベンゼン等が挙げられる。Examples of such polyfunctional unsaturated monomers include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, and nonaethylene glycol di(meth)acrylate. meth)acrylate, tetradeoxyethylene glycol di(meth)
Ethylene glycol, such as acrylate, or its oligomer, whose both terminal hydroxyl groups are esterified with acrylic acid or methacrylic acid; neopentyl glycol di(meth)acrylate, hexanediol di(meth)acrylate, butanediol di(meth)acrylate, etc. Those in which the hydroxyl groups of other dihydric alcohols are esterified with acrylic acid or methacrylic acid; bisphenol A or bisphenol-alkylene oxide adducts, or halogen-substituted products thereof, with both terminal hydroxyl groups esterified with acrylic acid or methacrylic acid. Polyhydric alcohols such as trimethylolpropane and pentaerythritol are esterified with acrylic acid or methacrylic acid; and epoxy groups of glycidyl acrylate or glycidyl methacrylate are added to the terminal hydroxyl groups of these dihydric alcohols or polyhydric alcohols. Ring-opening addition; Ring-opening addition of the epoxy group of glycidyl acrylate or glycidyl methacrylate to dibasic acids such as succinic acid, adipic acid, terephthalic acid, phthalic acid, or their halogen-substituted products, or their alkylene oxide adducts. Examples include aryl methacrylate, divinylbenzene, etc.
多官能性不飽和単量体は、単量体組成物中30重量%以
下の範囲で用いることができる。The polyfunctional unsaturated monomer can be used in an amount of 30% by weight or less in the monomer composition.
30重量%を越えると重合が不均一となりやすく、内部
歪みが大きくなり、また機械的強度の維持が困難となる
ため、好ましくない。If it exceeds 30% by weight, polymerization tends to be non-uniform, internal distortion becomes large, and it becomes difficult to maintain mechanical strength, which is not preferable.
本発明において用いられる、かかるビニル単量体は、単
量体のままでも使用できるが、重合硬化性、取り扱い性
の点で、一部重合体を含有する液として用いることも有
用である。The vinyl monomer used in the present invention can be used as a monomer, but it is also useful to use it as a liquid partially containing a polymer in terms of polymerization curability and handling properties.
一部重合体を含有する液としては、重合体を単量体に溶
解する方法、あるいは単量体を予備重合する方法等の公
知の方法によりつくることができる。A liquid partially containing a polymer can be prepared by a known method such as dissolving a polymer in a monomer or prepolymerizing a monomer.
重合体の量は、40重量%程度までで、液の粘度の上限
により、調節すればよい。The amount of the polymer is up to about 40% by weight, and may be adjusted depending on the upper limit of the viscosity of the liquid.
液の粘度としては、取り扱い上、また型枠への流れ性、
さらには型枠な微細な形状の転写性の点から、10〜5
ooooセンチポイズであることが好ましい。The viscosity of the liquid depends on handling, flowability into the formwork,
Furthermore, from the point of view of transferability of minute shapes such as molds, 10 to 5
Preferably it is oooo centipoise.
10センチボイズ未溝においては、型枠への流れ性は良
好であるが、原料液の重合硬化による収縮及び熱の発生
が大きく、製品内部においてボイドが発生しやすく、ま
た熱分解による副生物、分解物が多くなり、また500
00センチボイズを越す場合においては、混合時におい
て巻き込まれた気泡が抜けにくく、また、型枠の微細な
転写が充分となりやすい。With the 10 cm void groove, the flowability into the mold is good, but the shrinkage and heat generation due to polymerization and hardening of the raw material liquid are large, and voids are likely to occur inside the product, and by-products and decomposition due to thermal decomposition There are many things, and 500
When the void size exceeds 0.00 cm, air bubbles caught during mixing are difficult to escape, and fine transfer of the formwork is likely to be sufficient.
本発明において重合開始剤を用いる。A polymerization initiator is used in the present invention.
その具体例はベンゾイルパーオキサイド、ラウロイルパ
ーオキサイド、ジサクシニックアシッドバーオキサイド
などのジアシルパーオキサイド:ジ−t−ブチルパーオ
キサイド、t−ブチルクミルパーオキサイド、ジクミル
パーオキサイド等のジアルキルパーオキサイド、t−ブ
チルパーオキシアセテート、t−ブチルパーオキシピバ
レート、t−ブチルパーオキシベンゾエート、t−ブチ
ルマレイン酸ヘミパーエステル等のパーオキシエステル
:t−ブチルハイドロパーオキサイド、クメンハイドロ
パーオキサイド等のハイドロパーオキサイド:メチルエ
チルケトンパーオキサイドなどのケトンパーオキサイド
などの有機過酸個物及び、2.2−アゾビスイソブチロ
ニトリル、2.2−アゾビス(2,4−ジメチルバレロ
ニトリル)などのアゾ系化合物が挙げられる。Specific examples include diacyl peroxides such as benzoyl peroxide, lauroyl peroxide, and disuccinic acid peroxide; dialkyl peroxides such as di-t-butyl peroxide, t-butylcumyl peroxide, and dicumyl peroxide; Peroxy esters such as butyl peroxyacetate, t-butyl peroxy pivalate, t-butyl peroxybenzoate, and t-butyl maleic acid hemiperester; Hydroperoxides such as t-butyl hydroperoxide and cumene hydroperoxide : Organic peracids such as ketone peroxide such as methyl ethyl ketone peroxide, and azo compounds such as 2,2-azobisisobutyronitrile and 2,2-azobis(2,4-dimethylvaleronitrile). It will be done.
本発明において重合開始剤として、10時時間域温度が
50℃以上の温度である重合開始剤を主として用いるこ
とが好ましい。In the present invention, it is preferable to mainly use a polymerization initiator whose temperature in the 10 o'clock time range is 50° C. or higher.
50℃未満の10時時間域温度の重合開始剤を主として
用いることが好ましい。It is preferable to mainly use a polymerization initiator having a temperature in the 10 hour range of less than 50°C.
50℃未満の10時時間域温度の重合開始剤として主と
して用いた場合は、保管中に重合が進みやすいという問
題があり、好ましくない。If it is mainly used as a polymerization initiator with a temperature in the 10 hour range of less than 50°C, there is a problem that polymerization tends to proceed during storage, which is not preferable.
重合開始剤は、単量体組成100重量部に対し、0.0
1〜10重量部の範囲で使用する。The polymerization initiator is 0.0 parts by weight per 100 parts by weight of the monomer composition.
It is used in an amount of 1 to 10 parts by weight.
単量体と重合開始剤の組み合わせによっても、温度条件
を適度に設定することにより、充分な反応速度を得るこ
とができる。A sufficient reaction rate can also be obtained by appropriately setting temperature conditions depending on the combination of monomer and polymerization initiator.
更に、反応速度を高め、または温度を低く抑える場合に
は、前記の重合開始剤の他、重合促進剤、更に重合促進
剤の補助成分も使用することができ、かかる重合促進剤
としては、還元性物質がまた、重合促進剤の補助的成分
としては、金属含有有機化合物、アミンまたは、アミン
のハロゲン化合物などがある。Furthermore, in order to increase the reaction rate or keep the temperature low, in addition to the above-mentioned polymerization initiator, a polymerization accelerator and auxiliary components of the polymerization accelerator can also be used. Auxiliary components of the polymerization accelerator include metal-containing organic compounds, amines, and halogen compounds of amines.
かかる重合促進剤の還元性物質としては、ラウリルメル
カプタン、オクチルメルカプタン、2−エチルヘキシル
、メルカプタン、グリコールジメルカプトアセテート、
グリコールメルカプトプロピオネート等のメルカプタン
類ニジブチルチオ尿素、テトラメチルチオ尿素などのチ
オ尿素類ニトリメチルホスファイト、トリーn−ブチル
ホスファイト等の亜リン酸エステル類などが挙げられる
。Such reducing substances as polymerization accelerators include lauryl mercaptan, octyl mercaptan, 2-ethylhexyl, mercaptan, glycol dimercaptoacetate,
Examples include mercaptans such as glycol mercaptopropionate, thioureas such as dibutylthiourea, tetramethylthiourea, nitrimethylphosphite, and phosphite esters such as tri-n-butylphosphite.
また、金属含有有機化合物としては、鉄、銅、コバルト
、ニッケル、スズ、アルミニウム、パラジウム、アンチ
モンから選ばれた金属の有機酸塩、または有機錯体が挙
げられる。Examples of the metal-containing organic compound include organic acid salts of metals selected from iron, copper, cobalt, nickel, tin, aluminum, palladium, and antimony, or organic complexes.
また、アミンまたはアミンのハロゲン化合物としては、
−級アミン、二級アミン、三級アミンあるいはそれらの
ハロゲン化水素塩、ハロゲン化四級アンモニウムが挙げ
られる。In addition, as amines or halogen compounds of amines,
-class amines, secondary amines, tertiary amines, hydrogen halides thereof, and quaternary ammonium halides.
反応速度を高め重合を完結する上で、重合開始剤、重合
促進剤及びその補助的成分の組み合わせとしては、重合
開始剤として、パーオキシエステル類、重合促進剤とし
てメルカプタン類、チオ尿素類及び重合促進剤の補助的
成分として、アミンのハロゲン化水素塩あるいはハロゲ
ン化四級アンモニウム及び銅含有化合物の組み合わせあ
るいは、重合開始剤としてパーオキシエステルの内、ヘ
ミパーエステル類、重合促進剤としてメルカプタン類、
重合促進剤の補助的成分として、アミンあるいはアミン
のハロゲン化合物及びスズ、アルミニウム、アンチモン
を含有する有機化合物の組み合せが好ましい。In order to increase the reaction rate and complete polymerization, combinations of polymerization initiators, polymerization promoters, and their auxiliary components include peroxyesters as polymerization initiators, mercaptans, thioureas, and polymerization promoters as polymerization promoters. As an auxiliary component of the accelerator, a combination of a hydrogen halide salt of an amine or a quaternary ammonium halide and a copper-containing compound, hemiperesters among peroxyesters as a polymerization initiator, mercaptans as a polymerization accelerator,
As an auxiliary component of the polymerization accelerator, a combination of an amine or a halogen compound of an amine and an organic compound containing tin, aluminum, or antimony is preferred.
かかる重合促進剤及び重合促進剤の補助的成分は、単量
体組成物100重量部に対し0.00001〜1重量%
の範囲で使用する。The amount of such polymerization accelerator and auxiliary components of the polymerization accelerator is 0.00001 to 1% by weight based on 100 parts by weight of the monomer composition.
Use within the range.
単量体組成物に、・重合開始剤、重合促進剤及びその補
助的成分を、一括添加、逐次添加し混合して原料液とす
ることができるが、反応速度が早い重合開始剤系では、
単量体組成物の一部に重合開始剤を含有させてなる原料
液と重合促進剤を含有させてなる原料液とに分けて準備
し、型枠へ注入する直前に混合する方法をとることが好
ましい。A polymerization initiator, a polymerization accelerator, and their auxiliary components can be added all at once or sequentially to the monomer composition and mixed to form a raw material liquid.
A method is adopted in which a raw material solution containing a polymerization initiator and a polymerization accelerator are separately prepared as part of the monomer composition, and mixed immediately before pouring into the mold. is preferred.
重合促進剤の補助的成分は、重合開始剤を含有する原料
液または、重合促進剤を含有する液のいずれにも添加溶
解して用いることができる。The auxiliary component of the polymerization accelerator can be used by being added and dissolved in either the raw material liquid containing the polymerization initiator or the liquid containing the polymerization accelerator.
原料液には、その他、必要に応じて、紫外線吸収剤、熱
安定剤、滑剤、離型剤、着色剤を添加することもできる
。In addition, an ultraviolet absorber, a heat stabilizer, a lubricant, a mold release agent, and a coloring agent can be added to the raw material liquid as necessary.
原料液の混合は50℃以下の温度、10分間以下より短
い時間で行なうのが好ましい。It is preferable to mix the raw material liquids at a temperature of 50° C. or lower and for a time shorter than 10 minutes.
混合時の温度が50℃より高いと、混合中に部分的に重
合が進むので好ましくない。If the temperature during mixing is higher than 50°C, polymerization will partially proceed during mixing, which is not preferable.
また混合時間が長いと混合中に重合が進み好ましくない
。Moreover, if the mixing time is long, polymerization will proceed during mixing, which is undesirable.
充分混合されるのであれば混合時間は短い程好ましい。The shorter the mixing time, the better, as long as sufficient mixing is achieved.
混合方法は、小さな成形体を成形するには、バッチ方式
で原料液を混合した後、型枠・\注入する方法でも行え
るが、大きな成形体を成形するには、この方法では難し
い。As for the mixing method, to mold small molded bodies, it is possible to mix the raw material liquid in a batch method and then pour it into a mold, but this method is difficult to mold large molded bodies.
大きな成形体を成形でき均一混合が容易である等の理由
で、原料液を連続的に混合しながら型枠の中へ注入する
方法が好ましい。A method in which the raw material liquid is continuously mixed and injected into the mold is preferred because a large molded body can be molded and uniform mixing is easy.
いずれにしても混合した後、注入までの時間は短い程望
ましい。In any case, it is desirable that the time from mixing to injection be as short as possible.
混合器への送液、引き続き型枠への注入は、ピストンポ
ンプ、ギヤーポンプのごとき、加圧できて定量性有る汎
用の送液装置が用いられる。For feeding the liquid to the mixer and subsequently injecting it into the mold, a general-purpose liquid feeding device that can pressurize and has quantitative properties, such as a piston pump or a gear pump, is used.
連続混合は衝突混合器、ダイナミックミキサー、スタテ
ィックミキサーなどを用いた衆知慣用の液体の混合方法
で行うことができる。Continuous mixing can be performed by a well-known and commonly used liquid mixing method using an impingement mixer, dynamic mixer, static mixer, or the like.
これらの混合器は 型枠に近接している程よい。The closer these mixers are to the formwork, the better.
本発明では、従来の溶融樹脂の射出成形法に比べて、成
形材料として取扱う原料液が溶融樹脂に比べて粘度が低
いため注入圧が低くくてよい。In the present invention, compared to the conventional molten resin injection molding method, the injection pressure may be lower because the raw material liquid used as the molding material has a lower viscosity than the molten resin.
型枠は金型、樹脂型、ゴム型、木型等が使用されるが精
度、耐久性より金型が特に好ましい。As the mold, metal molds, resin molds, rubber molds, wooden molds, etc. can be used, but metal molds are particularly preferred in terms of accuracy and durability.
型枠の加熱は、型枠内にヒーターを埋め込み加熱するヒ
ーター加熱、空冷により冷却する方法、型枠にジャケッ
トあるいは熱媒の通る通路を付は温水または熱媒油を通
す方法等公知の方法によって行なわれる。The formwork can be heated using known methods such as heater heating by embedding a heater in the formwork, cooling by air cooling, or adding a jacket or passage for a heat medium to the formwork or passing hot water or heat medium oil through it. It is done.
型枠内の加圧は、型枠内に原料液が注入され充填される
空間の容積を外力により縮小しうる型枠構造により、圧
縮する方法、例えば特開昭60−97815号公報、特
開昭60−212318号公報、特開昭59−1069
39号公、報等に記載の方法、あるいは型枠内の原料液
に外部より圧縮空気等の圧縮された流体を導入する方法
、例えば特開昭56−146743号公報等に記載の方
法等、公知の方法でよい。The pressure inside the mold can be applied using a mold structure that can reduce the volume of the space filled by injecting the raw material liquid into the mold using an external force, for example, JP-A-60-97815, Publication No. 60-212318, JP-A-59-1069
39, the method described in the publication, etc., or the method of introducing compressed fluid such as compressed air from the outside into the raw material liquid in the mold, for example, the method described in JP-A-56-146743, etc. Any known method may be used.
型枠の温度は、50〜150℃程度であり、更には70
〜120℃の範囲が好ましい。The temperature of the formwork is about 50 to 150℃, and even 70℃.
A range of 120°C to 120°C is preferred.
50℃未満の温度においては、重合硬化に長時間を要し
、また150℃を越える温度においては、重合発熱の制
御が困難となり、分解や発泡を起しやすく歪みが残りや
すいため好ましくない。At temperatures below 50°C, it takes a long time for polymerization and curing, and at temperatures above 150°C, it becomes difficult to control the heat generated by polymerization, which is undesirable because decomposition and foaming are likely to occur and distortions are likely to remain.
加圧条件としては、重合硬化中、型枠内の反応性原料を
最高1〜100kir/ajの圧力で加圧することが好
ましく、更には、最高10〜50kg/−の圧力にする
ことがより好ましい。As for the pressurizing conditions, during polymerization and curing, it is preferable to pressurize the reactive raw material in the mold at a maximum pressure of 1 to 100 kir/aj, and more preferably a maximum pressure of 10 to 50 kg/aj. .
また加圧は、反応の進行に従い増加させ、反応終了以降
は任意に圧力を下げることができる。Further, the pressure can be increased as the reaction progresses, and the pressure can be lowered arbitrarily after the reaction is completed.
Lkg/−未満の圧力においては、重合硬化における原
料液の収縮により、型枠の転写が充分できず、製品にボ
イドや表面のへこみが生じやすく、型枠の正確な転写が
できにり<、また単量体の気化による気泡が起きやすい
。If the pressure is less than Lkg/-, the mold cannot be transferred sufficiently due to contraction of the raw material liquid during polymerization and curing, and voids and surface dents are likely to occur in the product, making it impossible to accurately transfer the mold. In addition, bubbles are likely to occur due to vaporization of the monomer.
100 kg/dを越える圧力においては、成形品に圧
縮応力による歪みが残りやすいため好ましくない。Pressures exceeding 100 kg/d are not preferred because distortions due to compressive stress tend to remain in the molded product.
また硬化した後、内部歪みを軽減するためには重合体の
ガラス転移温度以上で、熱処理することもできる。Further, after curing, heat treatment can be performed at a temperature equal to or higher than the glass transition temperature of the polymer in order to reduce internal distortion.
本発明の方法による重合時間は、重合開始剤、更に重合
促進剤の種類、濃度及び型枠の温度等の条件を選ぶこと
によって10分以下の短時間で行なわれる。The polymerization time according to the method of the present invention can be shortened to 10 minutes or less by selecting conditions such as the type and concentration of the polymerization initiator and the polymerization accelerator, and the temperature of the mold.
大型の樹脂成形体としては、型枠を種々変えることによ
り、あらゆる形状、大きさの製品に適用できる。As a large-sized resin molded product, it can be applied to products of all shapes and sizes by changing the mold.
本発明は、溶融成形方法では成形上困難な大型成形品に
適用できる。The present invention can be applied to large molded products that are difficult to mold using melt molding methods.
例としては、自動車グレージング部品として、サンルー
フ、サイドウィンドー、リヤウィンドー、三角窓等;自
動車外部装飾部品として、リヤ・パネル、センター・ピ
ラー、リヤー・ピラー、フロントグリル等;家屋の備品
・装飾品としてバスタブ、集光形ソーラーコレクター、
採光用ドーム、ドア材、窓材、間切り材、テーブル・ト
ップ、洗面化粧台、カウンター・トップ、看板、表示板
等である。Examples include automobile glazing parts such as sunroofs, side windows, rear windows, triangular windows, etc.; automobile exterior decorative parts such as rear panels, center pillars, rear pillars, front grills, etc.; house fixtures and decorations. Bathtub, concentrating solar collector,
These include lighting domes, door materials, window materials, partition materials, table tops, bathroom vanities, counter tops, signboards, display boards, etc.
〈発明の効果〉
本発明によれば、ビニル系単量体から主としてなる原料
液に重合開始剤等を添加し、均一混合したのち、直ちに
型枠内に注入し、加熱加圧して重合硬化させることによ
り、大型の成形体でありながら表面のへこみ、内部の発
泡やボイド歪みが少なく、外観上、性能上において優れ
ており、しかも約10分程度あるいはそれ以下の短時間
で成形できる。<Effects of the Invention> According to the present invention, a polymerization initiator and the like are added to a raw material liquid mainly composed of vinyl monomers, mixed uniformly, and then immediately poured into a mold and heated and pressurized to polymerize and harden. As a result, although it is a large molded product, there are few surface dents, internal foaming, and void distortion, and it has excellent appearance and performance, and can be molded in a short time of about 10 minutes or less.
〈実施例〉 以下、本発明を実施例により説明する。<Example> The present invention will be explained below using examples.
尚、本実施例では、原料液を、各原料液タンクから配管
を通じ、油圧により作動するピストンポンプにより加圧
して、金型に付属している衝突混合器に導き、該混合器
中で、各原料液を高圧で衝突させ混合させながら金型内
に注入する。In this example, the raw material liquid is pressurized by a piston pump operated by hydraulic pressure through piping from each raw material liquid tank, and guided to the collision mixer attached to the mold. The raw material liquid is injected into the mold while colliding and mixing under high pressure.
注入完了したのち、混合器の原料液出口を遮断し、更に
金型のキャビティ一部の一面を構成するスライド可能な
コア部材を、油圧により摺動させ、キャビティ一部の空
間容積を縮小しつつ、原料液を加圧する構造の金型を用
いた。After the injection is completed, the raw material liquid outlet of the mixer is shut off, and the slideable core member that forms one side of the mold cavity is slid by hydraulic pressure, reducing the space volume of the part of the cavity. A mold with a structure that pressurizes the raw material liquid was used.
また、得られた形成品の性能評価として、全光線透過率
、曇価はASTM D−1003により、また残留上
ツマ−の定量は、抽出液によるガスロマトグラフにより
、加熱変形温度は、ASTM D−648により各々
測定した。In addition, as a performance evaluation of the obtained molded product, the total light transmittance and haze value were determined according to ASTM D-1003, the residual upper layer was determined by gas chromatography using an extract, and the heating deformation temperature was determined according to ASTM D-1003. 648.
実施例 1
(原シロップの調製)
メチルメタクリレ−)600g、ジシクロペンタニルメ
タクリレート1300g及びアゾビスイソブチロニトリ
ル0.2gを反応容器中で60℃で撹拌しながら予備重
合し、少し粘度が上昇した時点で急冷し、粘稠な溶液で
ある原シロップを調製した。Example 1 (Preparation of raw syrup) 600 g of methyl methacrylate, 1300 g of dicyclopentanyl methacrylate, and 0.2 g of azobisisobutyronitrile were prepolymerized in a reaction vessel with stirring at 60°C, and the viscosity was slightly reduced. When the temperature rose, it was rapidly cooled to prepare a viscous solution of raw syrup.
粘度は、10ボイズであった。The viscosity was 10 voids.
(原料液への調製)
原シロップ900gに対し、テトラデ力エチレングルコ
ールジメタクリレー)100g、2〜メル力プトエタノ
ール10g、ナフテン酸銅(Cu含有量10%)の1重
量%メタルメタクリレート溶液1gを加え、均一に混合
させて原料液Aを調製した。(Preparation to raw material solution) For 900 g of raw syrup, 100 g of tetradeoxyethylene glycol dimethacrylate, 10 g of 2-merutoethanol, and 1 g of a 1% by weight metal methacrylate solution of copper naphthenate (Cu content 10%). was added and mixed uniformly to prepare raw material liquid A.
粘度(25℃)は8ボイズであった。The viscosity (25°C) was 8 voids.
(原料液Bの調製)
原シロップlooogに対し、t−ブチルパーオキシベ
ンゾエート15g、ジメチルオクチルアミン塩酸塩1g
を加え、均一に溶解させて、原料液Bを調製した。(Preparation of raw material liquid B) 15 g of t-butyl peroxybenzoate and 1 g of dimethyloctylamine hydrochloride for raw syrup looog
was added and uniformly dissolved to prepare raw material liquid B.
粘度(25℃)は、10ボイズであった。The viscosity (25°C) was 10 voids.
(注型成形)
曲率半径2000報を有し、600X600鰭大、lo
am厚の自動車用サンルーフの形状を有する金型を用い
原料液A及び原料液Bを1:1の重量比で、混合しなが
ら、70℃に温度調節された上記の金型内に7秒間で注
入した。(Cast molding) Has a radius of curvature of 2000, 600 x 600 fin size, lo
Using a mold having the shape of a sunroof for an automobile with a thickness of am, raw material liquid A and raw material liquid B were mixed at a weight ratio of 1:1 and placed in the above-mentioned mold whose temperature was adjusted to 70°C for 7 seconds. Injected.
金型内の原料液を徐々に加圧し、液注入後7分で、原料
液に20に+r/c+Jの圧力が加わるようにし、その
後圧力を減少させ、液注入後10分で金型を開き、硬化
したサンルーフ成形品を得た。Gradually pressurize the raw material liquid in the mold so that a pressure of 20 + r / c + J is applied to the raw material liquid 7 minutes after liquid injection, then reduce the pressure, and open the mold 10 minutes after liquid injection. A cured sunroof molded article was obtained.
(形成品の性能)
得られたサンルーフ成形品は、全光線透過率93.0%
、曇価0.5%と透明性にすぐれ、表面のヒケ内部のボ
イドなどの欠陥のない外観に優れた成形品であった。(Performance of molded product) The obtained sunroof molded product has a total light transmittance of 93.0%.
The molded product had excellent transparency with a haze value of 0.5%, and an excellent appearance with no defects such as voids inside sink marks on the surface.
また、成形品中の残留モノマーは、0.8%と少なく、
加熱変形温度は135℃と高く、更にエタノール中1時
間侵消した後も、クランクの発生等がなく、自動車グレ
ージング部品として、好適な成形品であった。In addition, the residual monomer in the molded product is as low as 0.8%.
The heat deformation temperature was as high as 135°C, and even after being eroded in ethanol for 1 hour, no cranking occurred, and the molded product was suitable as an automobile glazing part.
実施例 2
(原シロップの調製)
メチルメタクリレート1400gに、メタクリル樹脂(
スミペックス−B ?llI 住友化学工業■製)6
00gを溶解し、原シロップを調製した。Example 2 (Preparation of raw syrup) To 1400 g of methyl methacrylate, methacrylic resin (
Sumipex-B? llI (manufactured by Sumitomo Chemical Co., Ltd.) 6
00g was dissolved to prepare raw syrup.
粘度(25℃)は、10ボイズであった。The viscosity (25°C) was 10 voids.
(原料液Cの調製)
原シロップ900gに対し、トリメチロールプロパント
リメタクリレート100g、グリコールジメルカプトプ
ロビオネート10gを加え均一に混合させて、原料液C
を調製した。(Preparation of raw material liquid C) To 900 g of raw syrup, 100 g of trimethylolpropane trimethacrylate and 10 g of glycol dimercaptoprobionate were added and mixed uniformly.
was prepared.
粘度(25℃)は、8ボイズであった。The viscosity (25°C) was 8 voids.
(原料液りの調製)
原シロップ1000gに対し、t−ブチルマレイン酸ヘ
ミパーエステル20g1ジメチルオクチルアミン塩酸塩
1.5g、アセチルアセトン−錫錯体1gを加え、均一
に溶解させて原料液りを調製した。(Preparation of raw material liquid) To 1000 g of raw syrup, 20 g of t-butylmaleic acid hemiperester, 1.5 g of dimethyloctylamine hydrochloride, and 1 g of acetylacetone-tin complex were added and uniformly dissolved to prepare a raw material liquid. .
粘度(25℃)は、10ボイズであった。The viscosity (25°C) was 10 voids.
(注型成形)
平均厚みが3鶴であり、中30龍のリプ(立ち上り部)
を周縁に有する300X800■−大の自動車用リヤ・
パネルの形状を有する金型を用い、原料液C及び原料液
りを1:lの重量比で混合しながら、85℃に温度調節
された上記の金型内に2枚で注入した。(Cast molding) Average thickness is 3 Tsuru, medium 30 Dragon rep (rising part)
300X800■-large car rear with
Using a panel-shaped mold, the raw material liquid C and the raw material liquid were mixed at a weight ratio of 1:1 and poured in two pieces into the above-mentioned mold whose temperature was controlled to 85°C.
金型内の原料液を徐々に加圧し、液注入後3分で、原料
液に10kr/−の圧力が加わるようにし、その後圧力
を減少させ、液注入後4分で金型を開き、硬化したリヤ
・パネル成形品を得た。Gradually pressurize the raw material liquid in the mold so that a pressure of 10kr/- is applied to the raw material liquid 3 minutes after injection, then reduce the pressure, open the mold 4 minutes after injection, and harden. A molded rear panel was obtained.
(成形品の性能)
得られたリヤ・パネル成形品は、表面光沢が95と優れ
、表面のヒケ、内部のボイドなどの欠陥のない外観に優
れた成形品であった。(Performance of molded product) The obtained rear panel molded product had an excellent surface gloss of 95, and was a molded product with an excellent appearance without defects such as sink marks on the surface or internal voids.
成形品中の残留モノマーは、1.5%と少なく、またエ
タノール91時間浸漬した後もクラ、りの発生等がなく
、自動車用外部装飾部品として好適な成形品であった。The residual monomer in the molded product was as low as 1.5%, and even after immersion in ethanol for 91 hours, no cracking or sagging occurred, making the molded product suitable as an exterior decorative part for an automobile.
実施例 3
(環シロップの調製)
メチルメタクリレート700 g、フェニルメタクリレ
ート1200g、メチルアクリレート100g及びアゾ
ビスイソブチロニトリル0.2gを反応容器中で、60
℃で撹拌しながら予備重合し、粘度が少し上昇した時点
で急冷し、粘稠な溶液である環シロップを調製した。Example 3 (Preparation of Ring Syrup) 700 g of methyl methacrylate, 1200 g of phenyl methacrylate, 100 g of methyl acrylate and 0.2 g of azobisisobutyronitrile were mixed in a reaction vessel at 60 g.
Prepolymerization was carried out with stirring at °C, and when the viscosity rose slightly, the mixture was rapidly cooled to prepare a viscous solution, ie, a ring syrup.
粘度(25℃)は、30ポイズであった。The viscosity (25°C) was 30 poise.
(原料液Eの調製)
環シロップ900gに対し、テトラエチレングリコール
ジメタクリレート100g、グリコールジメルカプトア
セテート8g1ナフテン酸銅(Cu含有量10%)の1
重量%メチルメタクリレートt9t&1gを加え、均一
に混合し、原f4液Eを調製した。(Preparation of raw material liquid E) For 900 g of ring syrup, 100 g of tetraethylene glycol dimethacrylate, 8 g of glycol dimercaptoacetate, 1 part of copper naphthenate (Cu content 10%)
Weight% methyl methacrylate t9t&1g was added and mixed uniformly to prepare raw f4 liquid E.
粘度(25℃)は、28ポイズであった。The viscosity (25°C) was 28 poise.
(原料液Fの調製)
環シロップ1000gに対し、t−ブチルパーオキシ−
2−エチルヘキサノエート15g、ジメチルラウリルア
ミン塩酸塩1gを加え、均一に混合溶解させ、原料液F
を調製した。(Preparation of raw material liquid F) For 1000 g of ring syrup, add t-butylperoxy-
Add 15 g of 2-ethylhexanoate and 1 g of dimethyl laurylamine hydrochloride, mix and dissolve uniformly, and prepare raw material solution F.
was prepared.
粘度(25℃)は、30ポイズであった。The viscosity (25°C) was 30 poise.
(注型成形)
平均厚さ5.7鶴であり、表面曲率半径2000龍であ
る直径1450鶴のドーム状点集光型フレネルレンズで
ある集光型ソーラーコレクターの形状を有する金型を用
い、原料液E及び原料液Fをl:1の重量比で、混合し
ながら、85℃に温度調節した上記の金型内に30秒で
注入した。(Cast molding) Using a mold having the shape of a concentrating solar collector, which is a dome-shaped point concentrating Fresnel lens with an average thickness of 5.7 mm and a diameter of 1450 mm and a surface curvature radius of 2000 mm, Raw material liquid E and raw material liquid F were mixed at a weight ratio of 1:1 and poured into the above-mentioned mold whose temperature was controlled to 85° C. for 30 seconds.
金型内の原料液を徐々に加圧し、液注入後3分で、20
kg/cdの圧力が原料液に加わるようにし、その後圧
力を減少させ、液注入後5分で金型を開き、硬化した集
光型ソーラーコレクター成形品を得た。Gradually pressurize the raw material liquid in the mold, and 3 minutes after injection, 20
A pressure of kg/cd was applied to the raw material liquid, and then the pressure was reduced, and the mold was opened 5 minutes after the liquid was injected to obtain a cured light-concentrating solar collector molded article.
(成形品の性能)
得られた集光型ソーラーコレクターは、全光線透過率9
1.0%の透明性を有し、表面のヒケ、内部のボイドな
どの欠陥のない外観にもすぐれた成形品であった。(Performance of molded product) The obtained concentrating solar collector has a total light transmittance of 9
The molded product had a transparency of 1.0% and had an excellent appearance with no defects such as sink marks on the surface or internal voids.
また、成形品中の残留モノマーは、1.2%と少なく、
成形収縮は0.1%と精度が高く、偏光板による肉眼観
察によっても内部歪みの認められない成形品であり、集
光型ソーラーコレクターとして好適な成形品であった。In addition, the residual monomer in the molded product is as low as 1.2%.
The molding shrinkage was highly accurate at 0.1%, and the molded product showed no internal distortion even when visually observed using a polarizing plate, making it suitable as a concentrating solar collector.
実施例 4
(環シロップの調製)
メチルメタクリレート9kir、シクロヘキシルメタク
リレート8kg、スチレン3−にアゾビスイソブチロニ
トリル40gを反応容器中で、70℃で撹拌しながら予
備重合し、粘度が少し上昇した時点で急冷し、粘稠な溶
液である環シロップを調製した。Example 4 (Preparation of ring syrup) 9 kir of methyl methacrylate, 8 kg of cyclohexyl methacrylate, 3-styrene and 40 g of azobisisobutyronitrile were prepolymerized in a reaction vessel with stirring at 70°C, and when the viscosity increased slightly. A viscous solution, a ring syrup, was prepared.
粘度(25℃)は、5ボイズであった。The viscosity (25°C) was 5 voids.
(原料液Gの調製)
環シロップ19kgに対し、テトラエチレングリコール
ジメタクリレート1kg、t−ブチルパーオキシアセテ
−)200g、2−メルカプトプロピオン酸t o o
g、ジメチルオクチルアミン塩酸塩10g及びナフテ
ン酸w4(Cu含有量10%)の1重量%メタルメタク
リレート溶液14gを加え、均一に混合溶解させて、原
料液Gを調製した。(Preparation of raw material liquid G) For 19 kg of ring syrup, 1 kg of tetraethylene glycol dimethacrylate, 200 g of t-butylperoxyacetate, and too much 2-mercaptopropionic acid.
g, 10 g of dimethyloctylamine hydrochloride, and 14 g of a 1% by weight metal methacrylate solution of naphthenic acid w4 (Cu content 10%) were added and uniformly mixed and dissolved to prepare raw material liquid G.
粘度(25℃)は、4ポイズであった。The viscosity (25°C) was 4 poise.
(注型成形)
厚み10+m、900x1800鶴大の平板状ドア材の
形状を有する金型を用い、70℃に温度調節された上記
の金型内へ原料液Gを50秒で加圧注入した。(Cast molding) Using a mold having a thickness of 10+ m and a shape of a 900 x 1800 crane-sized flat plate door material, the raw material liquid G was injected under pressure into the above-mentioned mold whose temperature was adjusted to 70° C. for 50 seconds.
金型内の原料液を徐々に加圧し、液注入後7分で50k
g/cdの圧力が原料液に加わるようにし、その後圧力
を減少させ、液注入後10分で金型を開き、硬化したド
ア材成形品を得た。Gradually pressurize the raw material liquid in the mold to 50k in 7 minutes after injection.
A pressure of g/cd was applied to the raw material liquid, and then the pressure was reduced, and 10 minutes after the liquid was injected, the mold was opened to obtain a cured door material molded product.
(成形品の性能)
得られたドア材成形品は、全光線透過率93゜0%、曇
価0.7%の透明性を有し、表面のヒケ内部のボイドな
どの欠陥のない外観のすぐれた成形品であった。(Performance of molded product) The obtained molded door material has transparency with a total light transmittance of 93.0% and a haze value of 0.7%, and has an appearance with no defects such as voids inside sink marks on the surface. It was an excellent molded product.
また、成形品中の残留モノマーは、1.5%と少なく、
成形収縮は0.1%と精度が高く、偏光板による肉眼観
察によっても内部歪みの認められない成形品であり、更
に成形品の反りは1鶴以下の家屋用材として好適な成形
品であった。In addition, the residual monomer in the molded product is as low as 1.5%.
The molding shrinkage was highly accurate at 0.1%, and the molded product showed no internal distortion even when observed with the naked eye using a polarizing plate. Furthermore, the molded product had warp of less than 1 crane, making it suitable as a material for a house. .
Claims (2)
主としてなる原料液を型枠内に注入し、加熱、加圧下重
合硬化させることを特徴とする大型の樹脂成形体の製造
方法。(1) A method for producing a large-sized resin molded article, which comprises injecting a raw material liquid mainly consisting of a vinyl monomer containing or not containing a polymer into a mold, and polymerizing and curing it under heating and pressure.
自動車外部装飾部品、家屋の備品・装飾品、である特許
請求の範囲第(1)項記載の製造方法。(2) The large resin molded body is an automobile glazing part,
The manufacturing method according to claim (1), which is an automobile exterior decorative part or a house fixture/decoration item.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2675887A JPS63193810A (en) | 1987-02-06 | 1987-02-06 | Manufacture of large-sized resin molded body |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2675887A JPS63193810A (en) | 1987-02-06 | 1987-02-06 | Manufacture of large-sized resin molded body |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63193810A true JPS63193810A (en) | 1988-08-11 |
Family
ID=12202177
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2675887A Pending JPS63193810A (en) | 1987-02-06 | 1987-02-06 | Manufacture of large-sized resin molded body |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63193810A (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61252116A (en) * | 1985-05-02 | 1986-11-10 | Kyowa Gas Chem Ind Co Ltd | Preparation of cast material with improved mold release characteristics |
-
1987
- 1987-02-06 JP JP2675887A patent/JPS63193810A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61252116A (en) * | 1985-05-02 | 1986-11-10 | Kyowa Gas Chem Ind Co Ltd | Preparation of cast material with improved mold release characteristics |
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