JPS63192672U - - Google Patents
Info
- Publication number
- JPS63192672U JPS63192672U JP1987082237U JP8223787U JPS63192672U JP S63192672 U JPS63192672 U JP S63192672U JP 1987082237 U JP1987082237 U JP 1987082237U JP 8223787 U JP8223787 U JP 8223787U JP S63192672 U JPS63192672 U JP S63192672U
- Authority
- JP
- Japan
- Prior art keywords
- multilayer board
- terminal
- fitted
- board
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011810 insulating material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 3
Landscapes
- Multi-Conductor Connections (AREA)
Description
第１図は本考案の端子の一実施例の一部破断側
面図、第２図は取付け状態を示す断面図である。 １……鍔、２……筒状部、３……カラー、４…
…多層基板、５……穴、６……中間導体層、７…
…表面導体層、８……裏面導体層。
面図、第２図は取付け状態を示す断面図である。 １……鍔、２……筒状部、３……カラー、４…
…多層基板、５……穴、６……中間導体層、７…
…表面導体層、８……裏面導体層。
Claims (1)
- 多層基板に開設した穴内に挿通されて基板に固
着される端子であつて、一端に鍔を有する金属性
筒状部の周囲に、前記穴内に嵌入可能でかつ多層
基板の板厚に略等しい軸方向長さの絶縁材からな
るカラーを嵌装してなることを特徴とする多層基
板用端子。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987082237U JPS63192672U (ja) | 1987-05-30 | 1987-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987082237U JPS63192672U (ja) | 1987-05-30 | 1987-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63192672U true JPS63192672U (ja) | 1988-12-12 |
Family
ID=30934707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987082237U Pending JPS63192672U (ja) | 1987-05-30 | 1987-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63192672U (ja) |
-
1987
- 1987-05-30 JP JP1987082237U patent/JPS63192672U/ja active Pending