JPS63191429U - - Google Patents

Info

Publication number
JPS63191429U
JPS63191429U JP8063187U JP8063187U JPS63191429U JP S63191429 U JPS63191429 U JP S63191429U JP 8063187 U JP8063187 U JP 8063187U JP 8063187 U JP8063187 U JP 8063187U JP S63191429 U JPS63191429 U JP S63191429U
Authority
JP
Japan
Prior art keywords
board
electronic component
soldered
mounting mechanism
conductive pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8063187U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8063187U priority Critical patent/JPS63191429U/ja
Publication of JPS63191429U publication Critical patent/JPS63191429U/ja
Pending legal-status Critical Current

Links

JP8063187U 1987-05-26 1987-05-26 Pending JPS63191429U (US06272168-20010807-M00014.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8063187U JPS63191429U (US06272168-20010807-M00014.png) 1987-05-26 1987-05-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8063187U JPS63191429U (US06272168-20010807-M00014.png) 1987-05-26 1987-05-26

Publications (1)

Publication Number Publication Date
JPS63191429U true JPS63191429U (US06272168-20010807-M00014.png) 1988-12-09

Family

ID=30931612

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8063187U Pending JPS63191429U (US06272168-20010807-M00014.png) 1987-05-26 1987-05-26

Country Status (1)

Country Link
JP (1) JPS63191429U (US06272168-20010807-M00014.png)

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