JPS63189471U - - Google Patents
Info
- Publication number
- JPS63189471U JPS63189471U JP8131487U JP8131487U JPS63189471U JP S63189471 U JPS63189471 U JP S63189471U JP 8131487 U JP8131487 U JP 8131487U JP 8131487 U JP8131487 U JP 8131487U JP S63189471 U JPS63189471 U JP S63189471U
- Authority
- JP
- Japan
- Prior art keywords
- mounting board
- injection nozzles
- solder injection
- soldering device
- mounted components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002347 injection Methods 0.000 claims description 9
- 239000007924 injection Substances 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 3
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8131487U JPS63189471U (hu) | 1987-05-28 | 1987-05-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8131487U JPS63189471U (hu) | 1987-05-28 | 1987-05-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63189471U true JPS63189471U (hu) | 1988-12-06 |
Family
ID=30932940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8131487U Pending JPS63189471U (hu) | 1987-05-28 | 1987-05-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63189471U (hu) |
-
1987
- 1987-05-28 JP JP8131487U patent/JPS63189471U/ja active Pending