JPS6318877U - - Google Patents

Info

Publication number

JPS6318877U

JPS6318877U JP11299586U JP11299586U JPS6318877U JP S6318877 U JPS6318877 U JP S6318877U JP 11299586 U JP11299586 U JP 11299586U JP 11299586 U JP11299586 U JP 11299586U JP S6318877 U JPS6318877 U JP S6318877U

Authority

JP

Japan

Prior art keywords

circuit board

mounting structure

electronic component

utility

registration request

Prior art date

1986-07-22

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 238000007598 dipping method Methods 0.000 claims 1
• 229910000679 solder Inorganic materials 0.000 claims 1
• 238000010586 diagram Methods 0.000 description 1