JPS63187393U - - Google Patents

Info

Publication number
JPS63187393U
JPS63187393U JP1987079156U JP7915687U JPS63187393U JP S63187393 U JPS63187393 U JP S63187393U JP 1987079156 U JP1987079156 U JP 1987079156U JP 7915687 U JP7915687 U JP 7915687U JP S63187393 U JPS63187393 U JP S63187393U
Authority
JP
Japan
Prior art keywords
heat
conductor
conducts
contacting
connects
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987079156U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987079156U priority Critical patent/JPS63187393U/ja
Publication of JPS63187393U publication Critical patent/JPS63187393U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401Disposition
    • H01L2224/40135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/40137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1987079156U 1987-05-25 1987-05-25 Pending JPS63187393U (fi)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987079156U JPS63187393U (fi) 1987-05-25 1987-05-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987079156U JPS63187393U (fi) 1987-05-25 1987-05-25

Publications (1)

Publication Number Publication Date
JPS63187393U true JPS63187393U (fi) 1988-11-30

Family

ID=30928753

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987079156U Pending JPS63187393U (fi) 1987-05-25 1987-05-25

Country Status (1)

Country Link
JP (1) JPS63187393U (fi)

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