JPS63187366U - - Google Patents

Info

Publication number
JPS63187366U
JPS63187366U JP7836387U JP7836387U JPS63187366U JP S63187366 U JPS63187366 U JP S63187366U JP 7836387 U JP7836387 U JP 7836387U JP 7836387 U JP7836387 U JP 7836387U JP S63187366 U JPS63187366 U JP S63187366U
Authority
JP
Japan
Prior art keywords
circuit board
flexible circuit
board according
polyolefin film
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7836387U
Other languages
Japanese (ja)
Other versions
JPH0644123Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987078363U priority Critical patent/JPH0644123Y2/en
Publication of JPS63187366U publication Critical patent/JPS63187366U/ja
Application granted granted Critical
Publication of JPH0644123Y2 publication Critical patent/JPH0644123Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、本考案の一実施例を示す断面図であ
る。 11……ポリプロピレンフイルム、12……ポ
リエステルフイルム、13……アンカー剤、14
……アルミ蒸着層、15……導電インキ。
FIG. 1 is a sectional view showing an embodiment of the present invention. 11...Polypropylene film, 12...Polyester film, 13...Anchor agent, 14
... Aluminum vapor deposition layer, 15 ... Conductive ink.

Claims (1)

【実用新案登録請求の範囲】 (1) 基材層がポリエステルフイルムとポリオレ
フインフイルムの少なくとも二層以上により構成
されている事を特徴とする可撓性回路基板。 (2) ポリオレフインフイルムの全体の層厚みが
50μm以上である事を特徴とする実用新案登録
請求の範囲第1項記載の可撓性回路基板。 (3) ポリオレフインフイルムがポリエチレン、
エチレンビニルアルコール、ポリプロピレンの何
れか若しくはその組み合わせによりなる実用新案
登録請求の範囲第1項乃至第2項記載の可撓性回
路基板。 (4) ポリエステルフイルムの厚さが50μm以
下である事を特徴とする実用新案登録請求の範囲
第1項、第2項若しくは第3項記載の可撓性回路
基板。
[Claims for Utility Model Registration] (1) A flexible circuit board characterized in that the base material layer is composed of at least two layers of a polyester film and a polyolefin film. (2) The flexible circuit board according to claim 1, wherein the entire layer thickness of the polyolefin film is 50 μm or more. (3) Polyolefin film is polyethylene,
The flexible circuit board according to claims 1 and 2, which is made of ethylene vinyl alcohol, polypropylene, or a combination thereof. (4) The flexible circuit board according to claim 1, 2, or 3 of the utility model registration claim, characterized in that the thickness of the polyester film is 50 μm or less.
JP1987078363U 1987-05-25 1987-05-25 Flexible circuit board Expired - Lifetime JPH0644123Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987078363U JPH0644123Y2 (en) 1987-05-25 1987-05-25 Flexible circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987078363U JPH0644123Y2 (en) 1987-05-25 1987-05-25 Flexible circuit board

Publications (2)

Publication Number Publication Date
JPS63187366U true JPS63187366U (en) 1988-11-30
JPH0644123Y2 JPH0644123Y2 (en) 1994-11-14

Family

ID=30927235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987078363U Expired - Lifetime JPH0644123Y2 (en) 1987-05-25 1987-05-25 Flexible circuit board

Country Status (1)

Country Link
JP (1) JPH0644123Y2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4725885U (en) * 1971-04-19 1972-11-22
JPS4941471A (en) * 1972-05-15 1974-04-18
JPS59106175A (en) * 1982-12-10 1984-06-19 東洋紙業株式会社 Method of producing circuit board for switch

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4725885U (en) * 1971-04-19 1972-11-22
JPS4941471A (en) * 1972-05-15 1974-04-18
JPS59106175A (en) * 1982-12-10 1984-06-19 東洋紙業株式会社 Method of producing circuit board for switch

Also Published As

Publication number Publication date
JPH0644123Y2 (en) 1994-11-14

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