JPS63187303U - - Google Patents
Info
- Publication number
- JPS63187303U JPS63187303U JP7778087U JP7778087U JPS63187303U JP S63187303 U JPS63187303 U JP S63187303U JP 7778087 U JP7778087 U JP 7778087U JP 7778087 U JP7778087 U JP 7778087U JP S63187303 U JPS63187303 U JP S63187303U
- Authority
- JP
- Japan
- Prior art keywords
- temperature sensor
- thin film
- chip
- weights
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 claims description 2
- 238000009966 trimming Methods 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Thermistors And Varistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7778087U JPS63187303U (fr) | 1987-05-22 | 1987-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7778087U JPS63187303U (fr) | 1987-05-22 | 1987-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63187303U true JPS63187303U (fr) | 1988-11-30 |
Family
ID=30926109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7778087U Pending JPS63187303U (fr) | 1987-05-22 | 1987-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63187303U (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004511763A (ja) * | 2000-10-07 | 2004-04-15 | ドクトル・ヨハネス・ハイデンハイン・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング | 機械部品の、熱に起因する長さ方向への膨張を検出するための装置 |
| WO2023013455A1 (fr) * | 2021-08-06 | 2023-02-09 | Ｓｅｍｉｔｅｃ株式会社 | Résistance, son procédé de fabrication et dispositif comprenant une résistance |
-
1987
- 1987-05-22 JP JP7778087U patent/JPS63187303U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004511763A (ja) * | 2000-10-07 | 2004-04-15 | ドクトル・ヨハネス・ハイデンハイン・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング | 機械部品の、熱に起因する長さ方向への膨張を検出するための装置 |
| WO2023013455A1 (fr) * | 2021-08-06 | 2023-02-09 | Ｓｅｍｉｔｅｃ株式会社 | Résistance, son procédé de fabrication et dispositif comprenant une résistance |