JPS63185257U - - Google Patents

Info

Publication number
JPS63185257U
JPS63185257U JP7604687U JP7604687U JPS63185257U JP S63185257 U JPS63185257 U JP S63185257U JP 7604687 U JP7604687 U JP 7604687U JP 7604687 U JP7604687 U JP 7604687U JP S63185257 U JPS63185257 U JP S63185257U
Authority
JP
Japan
Prior art keywords
heat sink
led
lamp unit
display device
hood
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7604687U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7604687U priority Critical patent/JPS63185257U/ja
Publication of JPS63185257U publication Critical patent/JPS63185257U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図a,bはそれぞれ本考案に係るLED表
示装置の正面断面図及び平面図、第2図a,b並
に第3図a,bはそれぞれ従来の同種表示装置の
正面断面図及び平面図、第4図は本考案に係るL
ED表示装置の点灯回路の一例である。 第1図a,bにおいて、1……LEDランプユ
ニツト、2……LED基板、3……LEDチツプ
、4……フード、5……透光性樹脂、6……放熱
板、7……配線基板、8……ケース、9……透孔
、10……絶縁性樹脂。
Figures 1a and b are a front sectional view and a plan view of an LED display device according to the present invention, respectively, and Figures 2a and b and 3a and b are a front sectional view and a plan view of a conventional similar display device, respectively. Figure 4 shows the L according to the present invention.
This is an example of a lighting circuit of an ED display device. In Figures 1a and b, 1... LED lamp unit, 2... LED board, 3... LED chip, 4... hood, 5... translucent resin, 6... heat sink, 7... wiring Substrate, 8...Case, 9...Through hole, 10...Insulating resin.

Claims (1)

【実用新案登録請求の範囲】 (1) LED基板2上に複数のLEDチツプ3を
形成してなるLED集合体を放熱体を兼ねたフー
ド4の中に収めたうえ透光性樹脂5で固めてLE
Dのランプユニツト1を構成するとともに、該ラ
ンプユニツト1の適数個を金属製の放熱板6の上
に配置し、各ランプユニツトのフードを放熱板6
に固定しかつランプユニツトから導出したリード
線を放熱板6に設けた孔を通して該放熱板6の背
部に設けた配線基板に接続したうえ、前記放熱板
6を金属製のケース8に収めて該ケース8に直接
固定し、さらに、前記放熱板6に設けた適数の透
孔9を通してケース8内に絶縁性樹脂10を充填
したことを特徴とするLED表示装置。 (2) LEDのランプユニツト1を構成する、放
熱体を兼ねたフード4は任意の高さ及び厚みを有
する環状の金属体をもつて構成されており、その
内側面は外側に向つてテーパー状に形成されてお
りかつその表面は光線反射面となしたことを特徴
とする実用新案登録請求の範囲第1項記載のLE
D表示装置。 (3) 放熱板6を収納固定する金属製のケース8
は開口部が角形又は円形に形成されておりかつ底
部に向つて上記開口寸法より小さくなるようにテ
ーパーを付けてあることを特徴とする実用新案登
録請求の範囲第1項記載のLED表示装置。
[Claims for Utility Model Registration] (1) An LED assembly consisting of a plurality of LED chips 3 formed on an LED board 2 is housed in a hood 4 that also serves as a heat sink, and then hardened with a translucent resin 5. TeLE
A suitable number of the lamp units 1 are arranged on a metal heat sink 6, and the hood of each lamp unit is placed on the heat sink 6.
A lead wire led out from the lamp unit was connected to a wiring board provided on the back of the heat sink 6 through a hole provided in the heat sink 6, and then the heat sink 6 was placed in a metal case 8 and the lead wire led out from the lamp unit was connected to the wiring board provided on the back of the heat sink 6. An LED display device that is directly fixed to a case 8 and further has an insulating resin 10 filled inside the case 8 through an appropriate number of through holes 9 provided in the heat dissipation plate 6. (2) The hood 4, which also serves as a heat sink and constitutes the LED lamp unit 1, is composed of an annular metal body having an arbitrary height and thickness, and the inner surface thereof is tapered outward. The LE according to claim 1 of the utility model registration claim, characterized in that the LE is formed as a ray reflecting surface and its surface is a light reflecting surface.
D display device. (3) Metal case 8 that houses and fixes the heat sink 6
2. The LED display device according to claim 1, wherein the opening is formed in a rectangular or circular shape and is tapered toward the bottom so that the size of the opening becomes smaller than the size of the opening.
JP7604687U 1987-05-22 1987-05-22 Pending JPS63185257U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7604687U JPS63185257U (en) 1987-05-22 1987-05-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7604687U JPS63185257U (en) 1987-05-22 1987-05-22

Publications (1)

Publication Number Publication Date
JPS63185257U true JPS63185257U (en) 1988-11-29

Family

ID=30922763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7604687U Pending JPS63185257U (en) 1987-05-22 1987-05-22

Country Status (1)

Country Link
JP (1) JPS63185257U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008233924A (en) * 2005-07-21 2008-10-02 Neobulb Technologies Inc Luminous display panel
US9470372B2 (en) 2008-11-26 2016-10-18 Deloren E. Anderson High intensity replaceable light emitting diode module and array

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008233924A (en) * 2005-07-21 2008-10-02 Neobulb Technologies Inc Luminous display panel
US9470372B2 (en) 2008-11-26 2016-10-18 Deloren E. Anderson High intensity replaceable light emitting diode module and array
US10925139B2 (en) 2008-11-26 2021-02-16 Yjb Led, Inc. High intensity replaceable light emitting diode module and array
US11178744B2 (en) 2008-11-26 2021-11-16 Yjb Led, Inc. High intensity replaceable light emitting diode module and array
US11924943B2 (en) 2008-11-26 2024-03-05 Yjb Led, Inc. High intensity replaceable light emitting diode module and array

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