JPS63182573U - - Google Patents
Info
- Publication number
- JPS63182573U JPS63182573U JP7295587U JP7295587U JPS63182573U JP S63182573 U JPS63182573 U JP S63182573U JP 7295587 U JP7295587 U JP 7295587U JP 7295587 U JP7295587 U JP 7295587U JP S63182573 U JPS63182573 U JP S63182573U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- jumper
- land
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7295587U JPS63182573U (it) | 1987-05-18 | 1987-05-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7295587U JPS63182573U (it) | 1987-05-18 | 1987-05-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63182573U true JPS63182573U (it) | 1988-11-24 |
Family
ID=30916861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7295587U Pending JPS63182573U (it) | 1987-05-18 | 1987-05-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63182573U (it) |
-
1987
- 1987-05-18 JP JP7295587U patent/JPS63182573U/ja active Pending