JPS63182530U - - Google Patents
Info
- Publication number
- JPS63182530U JPS63182530U JP1987074560U JP7456087U JPS63182530U JP S63182530 U JPS63182530 U JP S63182530U JP 1987074560 U JP1987074560 U JP 1987074560U JP 7456087 U JP7456087 U JP 7456087U JP S63182530 U JPS63182530 U JP S63182530U
- Authority
- JP
- Japan
- Prior art keywords
- curved
- board
- pedestal
- curved pedestal
- cradle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 3
- 230000001464 adherent effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78743—Suction holding means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987074560U JPH0632682Y2 (ja) | 1987-05-19 | 1987-05-19 | ボンディング装置の基板固定用受台 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987074560U JPH0632682Y2 (ja) | 1987-05-19 | 1987-05-19 | ボンディング装置の基板固定用受台 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63182530U true JPS63182530U (US07754267-20100713-C00017.png) | 1988-11-24 |
JPH0632682Y2 JPH0632682Y2 (ja) | 1994-08-24 |
Family
ID=30919880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987074560U Expired - Lifetime JPH0632682Y2 (ja) | 1987-05-19 | 1987-05-19 | ボンディング装置の基板固定用受台 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0632682Y2 (US07754267-20100713-C00017.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007030328A (ja) * | 2005-07-27 | 2007-02-08 | Hitachi High-Tech Instruments Co Ltd | スクリーン印刷機 |
-
1987
- 1987-05-19 JP JP1987074560U patent/JPH0632682Y2/ja not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007030328A (ja) * | 2005-07-27 | 2007-02-08 | Hitachi High-Tech Instruments Co Ltd | スクリーン印刷機 |
JP4712469B2 (ja) * | 2005-07-27 | 2011-06-29 | 株式会社日立ハイテクインスツルメンツ | スクリーン印刷機 |
Also Published As
Publication number | Publication date |
---|---|
JPH0632682Y2 (ja) | 1994-08-24 |