JPS63182237A - Mold release agent composition - Google Patents
Mold release agent compositionInfo
- Publication number
- JPS63182237A JPS63182237A JP1367787A JP1367787A JPS63182237A JP S63182237 A JPS63182237 A JP S63182237A JP 1367787 A JP1367787 A JP 1367787A JP 1367787 A JP1367787 A JP 1367787A JP S63182237 A JPS63182237 A JP S63182237A
- Authority
- JP
- Japan
- Prior art keywords
- component
- mold release
- silicone resin
- weight
- release agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 29
- 239000006082 mold release agent Substances 0.000 title abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 27
- 239000011521 glass Substances 0.000 claims abstract description 23
- 229920002050 silicone resin Polymers 0.000 claims abstract description 23
- 239000000843 powder Substances 0.000 claims abstract description 21
- 229910052582 BN Inorganic materials 0.000 claims abstract description 16
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 16
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 8
- 239000010439 graphite Substances 0.000 claims abstract description 8
- 239000002245 particle Substances 0.000 claims abstract description 8
- 239000007788 liquid Substances 0.000 claims abstract description 7
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052982 molybdenum disulfide Inorganic materials 0.000 claims abstract description 7
- 239000000454 talc Substances 0.000 claims abstract description 6
- 229910052623 talc Inorganic materials 0.000 claims abstract description 6
- 239000003960 organic solvent Substances 0.000 claims abstract description 4
- 238000002844 melting Methods 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims description 9
- 239000006229 carbon black Substances 0.000 claims description 2
- 241000872198 Serjania polyphylla Species 0.000 claims 1
- 239000002904 solvent Substances 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 229910052799 carbon Inorganic materials 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 150000004767 nitrides Chemical class 0.000 abstract 1
- 238000000576 coating method Methods 0.000 description 8
- 230000007423 decrease Effects 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000005336 cracking Methods 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229910001018 Cast iron Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000006230 acetylene black Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000006232 furnace black Substances 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 235000003385 Diospyros ebenum Nutrition 0.000 description 1
- 241000792913 Ebenaceae Species 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000156 glass melt Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B40/00—Preventing adhesion between glass and glass or between glass and the means used to shape it, hold it or support it
- C03B40/02—Preventing adhesion between glass and glass or between glass and the means used to shape it, hold it or support it by lubrication; Use of materials as release or lubricating compositions
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ガラス成形体を製造する際に使用される型の
離型材組成物（以下、単にＩＩＩ型材組成物といつ）、
特に粒径１μｍ以下の特定微粉末と釉薬を含有してなる
シリコーン樹脂溶液からなっており、表面粗さの小さな
コーテイング膜を得ることができる離型材組成物に関す
る。Detailed Description of the Invention [Industrial Field of Application] The present invention relates to a mold release material composition (hereinafter simply referred to as III mold material composition) used in producing a glass molded body,
In particular, the present invention relates to a mold release material composition that is made of a silicone resin solution containing a specific fine powder with a particle size of 1 μm or less and a glaze, and is capable of obtaining a coating film with a small surface roughness.
離型材組成物は、窒化硼素、黒鉛、二硫化モリブデン、
タルク等の離型材を水、油、溶剤、樹脂溶液等に分散さ
せた溶液、あるいはさらにこれに結合剤を添加した溶液
であって、その−例としては、本発明者らが先に提案し
た窒化硼素、釉薬及び無機顔料をシリコーン樹脂溶液に
分散させてなる特公昭６０−５０７３１号公報がある。The mold release material composition includes boron nitride, graphite, molybdenum disulfide,
A solution in which a mold release agent such as talc is dispersed in water, oil, a solvent, a resin solution, etc., or a solution in which a binder is further added. Japanese Patent Publication No. 60-50731 discloses a silicone resin solution in which boron nitride, a glaze, and an inorganic pigment are dispersed.
しかし、従来の離型材組成物を使用した場合、得られた
ガラス成形体の表面には微少な凹凸が認められ、透明な
ガラスの透明度が少なくなり商品価値が落ちるという問
題点があった。又同様に離型材組成物を基材へ塗布して
使用する場合、基材との密着性が悪く剥離やクラック、
ふくれ等が発生し、それによりガラス成形体の表面が荒
れ商品価値がなくなるといった問題があり、ガラス成形
体の表面仕上りがきれいになる離型材組成物が望まれて
いた。However, when conventional mold release agent compositions are used, there is a problem in that minute irregularities are observed on the surface of the obtained glass molded body, which reduces the transparency of the transparent glass and reduces its commercial value. Similarly, when a mold release material composition is applied to a base material, the adhesion to the base material is poor, resulting in peeling, cracking, etc.
There is a problem in that blistering occurs, which causes the surface of the glass molded product to become rough and loses its commercial value.Therefore, there has been a desire for a mold release material composition that can give a fine surface finish to the glass molded product.
本発明は、以上の問題点を解決することを目的とするも
ので、粒径１μｍ以下の窒化硼素、黒鉛、二硫化モリブ
デン、タルク及びカーボンブラックから選ばれた１釉以
上の微粉末（以下、窒化硼素等の微粉末という）と低融
点釉薬を含有してなるシリコーン樹脂溶液からなるもの
であって、ガラス成形体の表面仕上りがきれいＫなる離
型材組成物を提供するものである。The present invention aims to solve the above-mentioned problems, and consists of one or more fine powders (hereinafter referred to as The present invention provides a mold release material composition which is made of a silicone resin solution containing a fine powder of boron nitride, etc.) and a low melting point glaze, and which gives a fine surface finish to glass molded bodies.
すなわち、本発明は、（Ａ）成分２〜６０貞奮部、（Ｂ
ｌ成分９８〜７ＯｆｆＫ量部を含有してなるガラス成形
体製造用離型材組成物であって、その（Ａ）成分は窒化
硼素等の微粉末７０〜９５１！ｔ％と低融点釉薬６０〜
５ｍｍ−％とからなる粉末組成物であり、又（Ｂ）成分
は、シリコーン樹脂１０〜６０］［ｉ％、残部がシリコ
ーン樹脂可溶な有機溶剤である。That is, the present invention comprises (A) components 2 to 60 parts, (B
A mold release material composition for producing a glass molded body comprising 98 to 7 parts of OffK as the component (A), in which the component (A) is a fine powder of boron nitride or the like from 70 to 951 parts! t% and low melting point glaze 60~
Component (B) is a silicone resin of 10 to 60][i%, and the remainder is an organic solvent in which the silicone resin is soluble.
以下さらに本発明を祥しく説明する。The present invention will be further explained in detail below.
ます、本発明の離型材組成物の（Ａｔ成分について説明
する。First, the (At component) of the mold release material composition of the present invention will be explained.
窒化硼素等の微粉末ｔ（Ａ）成分中に７０〜９５１Ｌｆ
％存在させるが、その微粉末の粒径が１μｍを越えると
、離型材として塗布した際の塗膜面の凹凸が大きくなり
ガラス成形体の透明度が少なくなる。窒化硼素等の微粉
末の含有ｆか９５！ｔ％を越えると基材との密着力が低
下し剥離やクラック、ふくれ等が発生し、それによりガ
ラス成形体の表面が荒れ、商品価値が無くなる。また含
有蓋が７ｏｘｘ％未満の場合は相対的に低融点釉薬の童
が多くなり潤滑性や離型性が悪くなる。窒化硼素等の微
粉末としては、アセチレンブラックやファーネスブラッ
クなどのカーボンブラック、窒化硼素、黒鉛、二硫化モ
リブデン、タルクを用いることができる。中でも、アセ
チレンブラック、ファーネスブラックは高純度の微粉が
得られること又窒化硼素は高温まで安定であることから
有効である。70-951Lf in fine powder t(A) component such as boron nitride
%, but if the particle size of the fine powder exceeds 1 μm, the unevenness of the coating surface becomes large when applied as a mold release agent, and the transparency of the glass molded product decreases. Contains fine powder such as boron nitride f or 95! If the amount exceeds t%, the adhesion to the base material decreases and peeling, cracking, blistering, etc. occur, which roughens the surface of the glass molded product and reduces its commercial value. Furthermore, if the content of the lid is less than 7oxx%, the glaze content will be relatively high, resulting in poor lubricity and mold release properties. As the fine powder of boron nitride, carbon black such as acetylene black or furnace black, boron nitride, graphite, molybdenum disulfide, or talc can be used. Among these, acetylene black and furnace black are effective because they yield highly pure fine powder, and boron nitride is stable up to high temperatures.
次に低融点釉薬は（Ａ）成分中に３０〜５貞ｆ％存在さ
せる。低融点釉薬が６０電ｆ％を越えると潤滑性や離型
性が悪くなり、又５ｍｔ％未満では基材との密着力が低
下し塗膜剥離やクラックが発生したりするので好ましく
ない。低融点釉薬は、５ｉｎ２金主成分としてＢ２Ｏ３
、Ｐ２Ｏ５、Ｎａ２Ｏ、Ｋ２Ｏ等の成分を適宜の割合で
含有したものであり、鋼板用、鋳鉄用、ステンレス用等
の市販品を金型基材の種類に応じて使いわける。融点は
、６００〜７００８Ｃのものがよい。Next, the low melting point glaze is present in the component (A) in an amount of 30 to 5%. If the low melting point glaze exceeds 60 mt%, the lubricity and mold releasability will deteriorate, and if it is less than 5 mt%, the adhesion to the base material will decrease, causing coating peeling and cracking, which is not preferable. Low melting point glaze is 5in2 gold as main component B2O3
, P2O5, Na2O, K2O, etc. in appropriate proportions, and commercially available products for steel plates, cast iron, stainless steel, etc. are used depending on the type of mold base material. The melting point is preferably 600 to 7008C.
次ＫｆＢｌｆｆ分について説明する。The next KfBlff will be explained.
（Ｂｌ成分は、シリコーン樹脂とシリコーン樹脂可溶な
有機溶剤とからなるものである。(The Bl component consists of a silicone resin and an organic solvent that is soluble in the silicone resin.
シリコーン樹脂は（Ｂ）成分中に１０〜６０重量％存在
させるが、シリコーン樹脂が６０１量％を越えると、シ
リコーン樹脂が熱分解して生成する５１０２の量が多く
なり離型性が悪くなる。ＳｉＯ□はガラスとされやすい
物質であるためＥＩｉＯ□の童が多くなると離型性が悪
くなる。１０１１Ｌ−！ｉ％未満では、ＳｉＯ□の生成
蓋が少なくなり過ぎて基材との密着力が低下する。シリ
コーン樹脂としては一般市販のシリコーン樹脂を用いる
ことができる。又アルキド樹脂、アクリル樹脂、フェノ
ール樹脂、エボキ、、ｆｓ；−、？Ｘ用＠ｂ リコーン
樹脂と全混合した変性シリコーン樹脂をも用いることが
できる。シリコーン樹脂は次の役割りをする。The silicone resin is present in the component (B) in an amount of 10 to 60% by weight, but if the silicone resin exceeds 601% by weight, the amount of 5102 produced by thermal decomposition of the silicone resin increases, resulting in poor mold releasability. Since SiO□ is a substance that is easily treated as glass, when the number of EIiO□ particles increases, the mold releasability deteriorates. 1011L-! If it is less than i%, the amount of SiO□ produced will be too small and the adhesion to the base material will decrease. As the silicone resin, commercially available silicone resins can be used. Also, alkyd resin, acrylic resin, phenolic resin, ebony, fs;-,? For X @b A modified silicone resin completely mixed with a silicone resin can also be used. The silicone resin plays the following role.
（１）常温から３００℃までの温度での基材への密着性
全長くする。(1) Longer adhesion to the substrate at temperatures from room temperature to 300°C.
（２）粉末組成物に対し結合剤として作用する。(2) Acts as a binder for the powder composition.
（６）高温においては熱分解により生成される５ｉｎ２
が釉薬と反応して安定なものとなり基材と密着する。(6) At high temperatures, 5in2 is generated by thermal decomposition.
reacts with the glaze, becoming stable and adhering to the base material.
溶剤は（Ｂ）成分中に９０〜４０重量％含有させる。The solvent is contained in component (B) in an amount of 90 to 40% by weight.
９０重量％を越えると相対的にシリコーン樹脂の量が減
少し基材との密着力が弱くなる。又４０重量％未満では
粉末組成物との混合性が悪くなり均一に分散することが
難かしくなると共に塗布する際の作業性も悪くなる。溶
剤としては、トルエン、キシレンのようにシリコーン樹
脂と相溶性のあるものであれば何でもよい。これは頭成
分と（Ｂｌ成分とを混合する際の混合性及び基材に塗布
する際の作業性を良くするものである。When it exceeds 90% by weight, the amount of silicone resin decreases relatively and the adhesion to the base material becomes weak. Moreover, if it is less than 40% by weight, the miscibility with the powder composition becomes poor, making it difficult to uniformly disperse it, and the workability during application becomes poor. Any solvent may be used as long as it is compatible with the silicone resin, such as toluene and xylene. This improves the mixability when mixing the head component and the (Bl component) and the workability when coating the base material.
（Ａｌ成分の含有オは離型材組成物中に２〜３０重量部
を含有させる。（Ａ）成分が６０重量部を越えると相対
的に（Ｂｉ酸成分含有量が減少するので基材との密着力
が弱くなり、又（Ａｌ成分と（Ｂｌ成分の混合性も悪く
なる。又２重量部未満では、離型性や潤滑性が悪くなり
、又（Ａ）成分が増加する結果スラＩＪ−粘度が低下し
くＡ）成分の沈降が起こる。(The content of the Al component is 2 to 30 parts by weight in the mold release material composition. If the component (A) exceeds 60 parts by weight, the content of the Bi acid component decreases, so that the content of the Bi acid component decreases. The adhesion becomes weak, and the mixability of the (Al component and (Bl) component also deteriorates.If it is less than 2 parts by weight, the mold releasability and lubricity deteriorate, and as a result of the increase in the (A) component, the slug IJ- The viscosity decreases and component A) sediments.
なお、本発明の離型材組成物は、低温における潤滑・離
型性を高めるために、例えばフッ素樹脂等の添加材を含
有することもできる。The mold release material composition of the present invention may also contain additives such as fluororesin in order to improve lubrication and mold release properties at low temperatures.
以上のようにして製造した離型材組成物を使用するには
、これを鉄、アルミナ、黒鉛等の基材に適当な手段、例
えば刷毛塗り、スプレー等の塗布手段により塗布し、常
温で乾燥すればよく、特別の手段を必要としないので現
場等で容易に使用できる。To use the mold release material composition produced as described above, it is applied to a base material such as iron, alumina, or graphite by an appropriate coating method such as brush coating or spraying, and dried at room temperature. Since it does not require any special means, it can be easily used in the field.
以下本発明の実施例を示しさらに本発明を説明する。な
お、実施例中の％及び部はいずれも重倉基単で示した。Examples of the present invention will be shown below to further explain the present invention. In addition, all percentages and parts in the examples are expressed in terms of Motoichi Shigekura.
又シリコーン樹脂は乗遅シリコーン（ａ） ｍ ｒ Ｔ
ＳＲ−１４４Ｊ （不揮発分５０！ｆ％）、低融点釉薬
は市販のフリットガラス（粒径１μｍ以下、融点５００
’Ｃ）、窒化硼素等の微粉末は市販品を用いた。Also, the silicone resin is slow-acting silicone (a) m r T
SR-144J (nonvolatile content 50!f%), low melting point glaze is commercially available frit glass (particle size 1 μm or less, melting point 500
'C), a commercially available fine powder such as boron nitride was used.
実施例１〜４
第１表に示す割合で、粉末組成物と液状組成物と全配合
して振動ミルで均一に混合した。これを鋳鉄製金型に厚
み５０μｍＫなるようにスプレー塗りし、常温で乾燥後
５０口０Ｃの炉の中に挿入し６０分焼き付けた後、ただ
ちに室温まで冷却した。Examples 1 to 4 A powder composition and a liquid composition were all blended in the proportions shown in Table 1 and mixed uniformly using a vibrating mill. This was spray-coated onto a cast iron mold to a thickness of 50 μmK, dried at room temperature, inserted into a 50-neck 0C oven, baked for 60 minutes, and immediately cooled to room temperature.
次いで、焼き付は処理した金型にガラス融液を流し込み
ガラス成形体の表面状態を調べた。窒化硼素等の微粉末
の種類別による結果を第２表に示す。Next, the glass melt was poured into the baking-treated mold, and the surface condition of the glass molded body was examined. Table 2 shows the results by type of fine powder such as boron nitride.
実施例５〜８
窒化硼素等の微粉末として粒径が１μｍ以下の窒化硼素
、黒鉛、二硫化モリブデン、タルクを用いたこと以外は
実施例１と同様にして行った。その結果を第６表に示す
。Examples 5 to 8 The same procedure as in Example 1 was carried out except that boron nitride, graphite, molybdenum disulfide, and talc having a particle size of 1 μm or less were used as the fine powder of boron nitride. The results are shown in Table 6.
比較例１〜８
窒化硼素等の微粉末として粒径が５μｍ以下及び１０μ
ｍ以下の窒化ｆＭ索、黒鉛、二硫化モリブデン、タルク
を用いたこと以外は実施例１と同様にして行った。その
結果を第３表に示す。Comparative Examples 1 to 8 Fine powder such as boron nitride with a particle size of 5 μm or less and 10 μm
Example 1 was carried out in the same manner as in Example 1, except that nitrided fM rope having a diameter of less than m, graphite, molybdenum disulfide, and talc were used. The results are shown in Table 3.
実施例９〜１３
粉末組成物と液状組成物を第４表に示す割合で配合した
こと以外は実施例１と同様にして行った。Examples 9 to 13 Examples 9 to 13 were carried out in the same manner as in Example 1, except that the powder composition and liquid composition were blended in the proportions shown in Table 4.
その結果を第４表に示す。The results are shown in Table 4.
比較例９〜１２
粉末組成物と液状組成物を第４表に示す割合で配合した
こと以外は実施例１と同様にして行った。Comparative Examples 9 to 12 Comparative examples were carried out in the same manner as in Example 1, except that the powder composition and liquid composition were blended in the proportions shown in Table 4.
その結果を第４表に示す。The results are shown in Table 4.
第１表
第２〜４表に示したｅ／Ｊ性評価はいずれも目視により
行った。その評価差遣は次の通りである。All evaluations of e/J properties shown in Tables 2 to 4 of Table 1 were performed visually. The evaluation submission is as follows.
（１） ガラスの表面状態
◎・・・ガラス表面に凹凸が認められず透明度か優れて
いる。(1) Glass surface condition ◎: No irregularities were observed on the glass surface, and the transparency was excellent.
○・・・ガラス表面にわすかに凹凸が認められ透明度が
わすかに落ちる。○: Slight irregularities are observed on the glass surface, and the transparency is slightly reduced.
△・・・ガラス表面に凹凸が認められ透明度が落ちる。△...Irregularities are observed on the glass surface and the transparency is reduced.
×・・・ガラス表面に凹凸が顕著に認められ透明度が無
くなる。×...Irregularities are noticeable on the glass surface and transparency is lost.
（２）基材との密着性 Ｏ・・・塗膜に全く異常が認められない。(2) Adhesion to base material O: No abnormality is observed in the coating film.
×・・・塗膜に剥離、クラック、ふくれか生じた。×: Peeling, cracking, or blistering occurred in the coating film.
（６） 離型性 ○・・・ガラスと金型の付着が全く認められなかった。(6) Mold releasability ○: No adhesion between the glass and the mold was observed.
×・・・ガラスと金型の付着が認められた。×: Adhesion between the glass and the mold was observed.
本発明による離型材組成ｖＩＪは、基材との密着力が強
く、離型性に優れ、ガラス成形体の表面仕上りもきれい
になるため、ガラス族を時の離型材、例えば透明度が要
求される透明の食器類等をつくる際の離型材として最適
である。The mold release agent composition vIJ according to the present invention has strong adhesion with the base material, excellent mold release properties, and provides a fine surface finish for glass molded objects. It is ideal as a mold release material when making tableware, etc.
Claims (1)
７０重量部を含有してなるガラス成形体製造用離型材組
成物。 （Ａ）成分；粒径１μｍ以下の窒化硼素、黒鉛、二硫化
モリブデン、タルク及びカーボンブラックから選ばれた
１種以上の微粉末７０〜９５重量％と低融点釉薬３０〜
５重量％とからなる粉末組成物 （Ｂ）成分；シリコーン樹脂１０〜６０重量％、残部が
シリコーン樹脂可溶な有機溶剤である液状組成物[Claims] 1. 2 to 30 parts by weight of the following component (A), 98 to 98 parts of component (B)
A mold release material composition for producing a glass molded body, comprising 70 parts by weight. (A) Component: 70 to 95% by weight of one or more fine powders selected from boron nitride, graphite, molybdenum disulfide, talc, and carbon black with a particle size of 1 μm or less, and 30 to 95% by weight of a low melting point glaze.
Powder composition (B) component consisting of 5% by weight; liquid composition consisting of 10 to 60% by weight of silicone resin and the remainder being an organic solvent soluble in silicone resin;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1367787A JPS63182237A (en) | 1987-01-23 | 1987-01-23 | Mold release agent composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1367787A JPS63182237A (en) | 1987-01-23 | 1987-01-23 | Mold release agent composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63182237A true JPS63182237A (en) | 1988-07-27 |
Family
ID=11839817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1367787A Pending JPS63182237A (en) | 1987-01-23 | 1987-01-23 | Mold release agent composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63182237A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020061373A (en) * | 2001-01-16 | 2002-07-24 | 주식회사 휘닉스 디스플레이 전자 | A Process Method of Parting Powder and sprayer thereof |
| EP1621524A1 (en) | 2004-07-27 | 2006-02-01 | IPGR International Partners in Glass Research | Material for coating a glass mould, method for coating a glass mould and coated mould |
| NL1033912C2 (en) * | 2007-01-08 | 2010-01-28 | Tatung Co | Method for manufacturing spacer for field emitters and basic material used for the spacer. |
| JP2010208884A (en) * | 2009-03-10 | 2010-09-24 | Biotope:Kk | Glass molding method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4928608A (en) * | 1972-07-12 | 1974-03-14 | ||
| JPS6050731A (en) * | 1983-08-31 | 1985-03-20 | Nec Home Electronics Ltd | Actuator of optical pickup |
-
1987
- 1987-01-23 JP JP1367787A patent/JPS63182237A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4928608A (en) * | 1972-07-12 | 1974-03-14 | ||
| JPS6050731A (en) * | 1983-08-31 | 1985-03-20 | Nec Home Electronics Ltd | Actuator of optical pickup |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020061373A (en) * | 2001-01-16 | 2002-07-24 | 주식회사 휘닉스 디스플레이 전자 | A Process Method of Parting Powder and sprayer thereof |
| EP1621524A1 (en) | 2004-07-27 | 2006-02-01 | IPGR International Partners in Glass Research | Material for coating a glass mould, method for coating a glass mould and coated mould |
| NL1033912C2 (en) * | 2007-01-08 | 2010-01-28 | Tatung Co | Method for manufacturing spacer for field emitters and basic material used for the spacer. |
| JP2010208884A (en) * | 2009-03-10 | 2010-09-24 | Biotope:Kk | Glass molding method |
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