JPS6317958A - Mold-releasing composition - Google Patents
Mold-releasing compositionInfo
- Publication number
- JPS6317958A JPS6317958A JP16119586A JP16119586A JPS6317958A JP S6317958 A JPS6317958 A JP S6317958A JP 16119586 A JP16119586 A JP 16119586A JP 16119586 A JP16119586 A JP 16119586A JP S6317958 A JPS6317958 A JP S6317958A
- Authority
- JP
- Japan
- Prior art keywords
- units
- polyorganosiloxane
- unit
- formula
- mold release
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 40
- 230000003578 releasing effect Effects 0.000 title abstract 4
- 239000000843 powder Substances 0.000 claims abstract description 14
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 claims abstract description 13
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 7
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000007864 aqueous solution Substances 0.000 claims abstract description 6
- 239000002245 particle Substances 0.000 claims abstract description 6
- 230000003301 hydrolyzing effect Effects 0.000 claims abstract description 4
- 229910021529 ammonia Inorganic materials 0.000 claims abstract description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 125000000962 organic group Chemical group 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 229920002050 silicone resin Polymers 0.000 abstract description 6
- 238000013329 compounding Methods 0.000 abstract 1
- 125000001183 hydrocarbyl group Chemical group 0.000 abstract 1
- -1 Generally Substances 0.000 description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 16
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- 230000000694 effects Effects 0.000 description 13
- 239000000243 solution Substances 0.000 description 11
- 229920001296 polysiloxane Polymers 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 238000000465 moulding Methods 0.000 description 8
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 229920002545 silicone oil Polymers 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 description 4
- 239000006082 mold release agent Substances 0.000 description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 4
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000008096 xylene Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000005923 long-lasting effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 125000005375 organosiloxane group Chemical group 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000013049 sediment Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- 229910002016 Aerosil® 200 Inorganic materials 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 241000779819 Syncarpia glomulifera Species 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000443 aerosol Substances 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000002199 base oil Substances 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000012456 homogeneous solution Substances 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000002560 nitrile group Chemical group 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 230000002688 persistence Effects 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000001739 pinus spp. Substances 0.000 description 1
- 229920001921 poly-methyl-phenyl-siloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 102220226043 rs1064794935 Human genes 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
- 238000007592 spray painting technique Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
- 150000005671 trienes Chemical class 0.000 description 1
- 229940036248 turpentine Drugs 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は離型用組成物に関し、さらに詳しくはウレタン
樹脂など合成樹脂成型において優れた離型性を持続する
離型用組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a mold release composition, and more particularly to a mold release composition that maintains excellent mold release properties in molding of synthetic resins such as urethane resins.
ゴム、プラスチックなどの工業製品の加圧成形、射出成
形などの成形加工の際に、これらの材料が金型などの母
型に膠着するのを防ぎ、成形品をとり外しやすくするた
めに、離型剤を塗布スることが行われている。ポリオル
ガノシロキサンは、本質的に有機高分子との親和性が小
さく、耐熱性に優れる、化学的に不活性である等の優れ
た特性から、離型剤として好適であり、ゴム、プラスチ
ック、精密鋳造、陶器、紙、繊維、食品等などいろいろ
な工業分野に用いられていることは周知である。During pressure molding, injection molding, and other molding processes for industrial products such as rubber and plastics, separating materials are used to prevent these materials from sticking to the mother mold such as a mold and to make it easier to remove the molded product. Applying a molding agent is practiced. Polyorganosiloxane is suitable as a mold release agent because of its inherently low affinity with organic polymers, excellent heat resistance, and chemical inertness. It is well known that it is used in various industrial fields such as casting, pottery, paper, textiles, food, etc.
このような離型用シリコーンとしては、ポリオルガノシ
ロキサンをそのまま離型剤として用いるほかに、トルエ
ン、キシレン、ミネラルターペンなどの有機溶剤に溶解
した溶液型、乳化剤を用いて乳化し水溶液化したエマル
ジョン型、微粉末シリカなど無機粉末を配合したオイル
コンパウンド型、さらにポリオルガノシロキサンまたは
オイルコンパウンド型組成物に1.1.1−トリクロロ
エタンなどの液体を加えたエアゾル型などが用いられる
こともよく知られている。In addition to using polyorganosiloxane as a mold release agent as is, there are solution type silicones dissolved in organic solvents such as toluene, xylene, and mineral turpentine, and emulsion type silicones that are emulsified using an emulsifier and made into an aqueous solution. It is also well known that oil compound type compositions containing inorganic powders such as finely powdered silica, and aerosol type compositions in which a liquid such as 1.1.1-trichloroethane is added to a polyorganosiloxane or oil compound type composition are also used. There is.
また、その基油となるポリオルガノシロキサンとして、
一般にメチル系オイルと称するポリジメチルシロキサン
が多用されているが、用途に応じてケイ素原子に結合せ
る有機基としてメチル基のほかにフェニル基等の7リー
ル基を含有するポリシロキサン、β−フェニルエチル基
等のアラルキル基を含有するポリシロキサンなどが用い
られることも公知である。In addition, as the polyorganosiloxane that becomes the base oil,
Generally, polydimethylsiloxane called methyl-based oil is often used, but depending on the application, polysiloxane containing 7-aryl groups such as phenyl group in addition to methyl group as an organic group bonded to the silicon atom, β-phenylethyl It is also known to use polysiloxanes containing aralkyl groups such as groups.
これらのポリオルガノシロキサンでは離型性は優れてい
るが、塗布−回当たりの離型効果の持続性、耐久性が小
さい、ベタツキを有するなどの難点があるため、その改
良についているいろな方法が考えられている。例えば、
特開昭52−17323号公報、特開昭52−1732
4号公報には、硬化性シリコーン樹脂を用いる方法が示
されているが、硬化性であるために金型にカスが残りや
すいという問題や、硬化性触媒を用いる必要があるとい
う問題がある。Although these polyorganosiloxanes have excellent mold release properties, they have drawbacks such as the persistence of mold release effect per application, low durability, and stickiness, so various methods have been developed to improve them. It is considered. for example,
JP-A-52-17323, JP-A-52-1732
Publication No. 4 discloses a method using a curable silicone resin, but since it is curable, there are problems in that it tends to leave residue on the mold and that it is necessary to use a curable catalyst.
これに対して、特開昭60−12248号公報には、ポ
リオルガノシロキサンとしてオイル状のポリシロキサン
とワニス状のポリシロキサンを共用し、無機粉末として
シリカ粉、アルミナ粉を用いた溶液状にしてベタツキを
防止するとともに離型性の持続を計る方法が提唱されて
いる。しかしこの方法ではベタツキを防止する効果を与
える目的で、無機粉末を用いるために、それによりシリ
コーン本来の離型性とワニス状ポリシロキサンによる持
続性をいく仔細下させるという問題がある。On the other hand, JP-A-60-12248 discloses that oil-like polysiloxane and varnish-like polysiloxane are used together as polyorganosiloxane, and silica powder and alumina powder are used as inorganic powders in the form of a solution. Methods have been proposed to prevent stickiness and maintain mold releasability. However, in this method, inorganic powder is used for the purpose of preventing stickiness, so there is a problem in that the inherent mold release properties of silicone and the sustainability of varnish-like polysiloxane are deteriorated to some extent.
本発明の目的は、離型効果の持続性に優れ、かつべとつ
きにくく作業性に優れた離型用組成物を提供することに
ある。An object of the present invention is to provide a mold release composition that has an excellent long-lasting mold release effect, is resistant to stickiness, and has excellent workability.
[発明の構成〕
本発明者らは、これらの問題点を解決する離型用組成物
について検討した結果、粉末としてポリメチルシルセス
キオキサン粉末を用いることにより、離型効果の持続性
と作業性に優れた組成物が得られることを見出し、ここ
に発明を完成することに至った。[Structure of the Invention] As a result of studying a mold release composition that solves these problems, the present inventors have found that by using polymethylsilsesquioxane powder as the powder, the durability of the mold release effect and the workability can be improved. It was discovered that a composition with excellent properties could be obtained, and the invention was thus completed.
本発明はすなわち、
(A)ポリオルガノシロキサン 100重量部(B
)平均粒子径0.05〜100μ−のポリメチルシルセ
スキオキサン粉末 5〜200重量部から成ること
を特徴とする離型用組成物である。The present invention consists of the following: (A) 100 parts by weight of polyorganosiloxane (B)
) A mold release composition characterized by comprising 5 to 200 parts by weight of polymethylsilsesquioxane powder having an average particle size of 0.05 to 100 μ.
本発明における(A)成分のポリオルガノシロキサンは
、本発明においてベースポリマーとなるものである。こ
のようなポリオルガノシロキサンとしては、いわゆるシ
リコーンオイルと称する末端がHOR12SiO□単位
またはR’ 3SiO□単位から成り、末端以外のシロ
キサン単位が90〜100%のR2□SiO単位と残余
のR”、SiOヨ単位(ただし、aは0または1である
)から成る、直鎖状または分岐状の液状ポリオルガノシ
ロキサン(ただし、RIおよびR2はそれぞれ互いに同
一または相異なる1価の置換または非置換の炭化水素基
を示し、かつ、全ポリオルガノシロキサン中の50〜9
7重量%である) : )IOR’ gSiO□単位
またはR13SiO□単位、R”、SiO単位、R”5
i03単位およびSiO2単位から成り、(R”+R”
) /5i=1.0〜1.7である、いわゆるシリコー
ンレジンと称するもの; SiO□単位とR’、SiO
□単位で表わされる単位とから成り、R13SsO□単
位がSin、単位1モルに対し0.4〜1.0モル存在
し、ケイ素原子1個あたりに0.0004〜1個の水酸
基が結合したポリオルガノシロキサンなどがあげられる
。The polyorganosiloxane of component (A) in the present invention serves as a base polymer in the present invention. Such a polyorganosiloxane, so-called silicone oil, is composed of terminals consisting of HOR12SiO□ units or R'3SiO□ units, and siloxane units other than the terminals are 90 to 100% R2□SiO units and the remaining R'', SiO A linear or branched liquid polyorganosiloxane consisting of y units (where a is 0 or 1) (where RI and R2 are each the same or different monovalent substituted or unsubstituted hydrocarbon group, and 50 to 9 in the total polyorganosiloxane
7% by weight): )IOR' gSiO□ units or R13SiO□ units, R", SiO units, R"5
Consisting of i03 units and SiO2 units, (R"+R"
)/5i=1.0 to 1.7, so-called silicone resin; SiO□ unit and R', SiO
It consists of units represented by □ units, R13SsO□ units are present in 0.4 to 1.0 mol per 1 mol of Sin, and 0.0004 to 1 hydroxyl group is bonded to each silicon atom. Examples include organosiloxane.
ここで、このポリオルガノシロキサンに結合せる有機基
R1およびR2としては、メチル基、エチル基、プロピ
ル基、ブチル基、アミル基、ヘキシル基、オクチル基、
デシル基等のアルキル基;ビニル基等のアルケニル基;
フェニル基等のアリール基;β−フェニルエチル基、β
−フェニルプロピル基等のアラルキル基およびこれらの
水素原子の一部が塩素原子、フッ素原子、ニトリル基な
どで置換されたものが例示される。Here, the organic groups R1 and R2 to be bonded to this polyorganosiloxane include methyl group, ethyl group, propyl group, butyl group, amyl group, hexyl group, octyl group,
Alkyl groups such as decyl groups; alkenyl groups such as vinyl groups;
Aryl group such as phenyl group; β-phenylethyl group, β
Examples include aralkyl groups such as -phenylpropyl groups, and those in which some of their hydrogen atoms are substituted with chlorine atoms, fluorine atoms, nitrile groups, etc.
このうち容易に合成されることがらR1およびRZ中の
90モル%以上がメチル基であることが好ましり、R1
の全てがメチル基であることがさらに好ましい。Among these, it is preferable that 90 mol% or more of R1 and RZ is a methyl group because it can be easily synthesized, and R1
More preferably, all of the groups are methyl groups.
このようなポリオルガノシロキサンは、周知の方法で合
成することができる。たとえば、シリコーンレジンの場
合はトリオルガノクロロシラン、ジオルガノジクロロシ
ラン、オルガノトリクロロシランおよびテトラクロロシ
ランを、またR13SiO□単位とSiO□単位から成
るポリオルガノシロキサンの場合は対応するトリオルガ
ノクロロシランとテトラクロロシランを、安定する量で
配合し、その混合物を必要に応じてトルエン等の溶剤を
含む水溶液下でアルカリ触媒等の存在のもとに加水分解
・縮合することにより得られる。Such polyorganosiloxanes can be synthesized by well-known methods. For example, in the case of silicone resin, triorganochlorosilane, diorganodichlorosilane, organotrichlorosilane, and tetrachlorosilane, and in the case of polyorganosiloxane consisting of R13SiO□ units and SiO□ units, the corresponding triorganochlorosilane and tetrachlorosilane, It can be obtained by blending in a stable amount and hydrolyzing and condensing the mixture in an aqueous solution containing a solvent such as toluene as required in the presence of an alkali catalyst or the like.
また、これらのポリオルガノシロキサンとしては、シリ
コーンオイルと称するもののみを用いても、またシリコ
ーンオイルとシリコーンレジンおよび/またはR13S
iO□単位とSiO□単位とから成るポリオルガノシロ
キサンとの混合体のいずれを用いてもよいが、より離型
効果を持続させる目的からシリコーンレジンおよび/ま
たはR13SiOよ単位とSiO□単位から成るポリオ
ルガノシロキサンの合計量が(A)全重量の10〜70
%であることが好ましい。Moreover, as these polyorganosiloxanes, it is possible to use only what is called silicone oil, or to use silicone oil and silicone resin and/or R13S.
Any mixture of polyorganosiloxane consisting of iO□ units and SiO□ units may be used, but for the purpose of sustaining the mold release effect, silicone resin and/or a polyorganosiloxane consisting of R13SiO units and SiO□ units may be used. The total amount of organosiloxane is (A) 10 to 70 of the total weight
% is preferable.
また、(A)成分の粘度は、(B)成分との配合により
とくに限定されないが、離型性などの効果から25℃に
おける粘度が20cSt以上であることが好ましい。Further, the viscosity of the component (A) is not particularly limited depending on the combination with the component (B), but it is preferable that the viscosity at 25° C. be 20 cSt or more in view of effects such as mold releasability.
本発明に用いられる(B)成分のポリメチルシルセスキ
オキサンは、組成物に離型性を付与するとともに、離型
効果の持続性を向上させ、かつベタツキを少なくする効
果を与えるための必須の成分である。この充填剤は粉砕
石英や珪藻土のような類似の平均粒子径をもつ他のシリ
カ系充填剤に比べて、コンパウンドにした場合の比重が
低く、そのため多量に充填しても系の比重は余り高(な
らず、しかも系は粘度上昇が少なく、流動性に冨む。本
発明の離型用組成物は、とくに溶液型として長期保存し
た場合において、その沈降は認められるものの凝集はな
く、軽く振盪するだけで極めて容易に再分散可能である
という特徴を有する。このことは、一般の粉体を同様の
用途に用いた場合、長期保存後において沈降凝集し再分
散が不可能となることと比較して大きな利点である。Polymethylsilsesquioxane, the component (B) used in the present invention, is essential for imparting mold release properties to the composition, improving the sustainability of the mold release effect, and reducing stickiness. It is a component of This filler has a lower specific gravity when made into a compound than other silica-based fillers with similar average particle sizes, such as crushed quartz and diatomaceous earth, so even if it is filled in a large amount, the specific gravity of the system will not be too high. (In addition, the system exhibits little increase in viscosity and is highly fluid.Especially when the mold release composition of the present invention is stored for a long period of time as a solution, although sedimentation is observed, there is no aggregation, and the composition is lightly shaken. It has the characteristic that it can be redispersed extremely easily by simply adding the powder.This is compared to the case where ordinary powders used for similar purposes tend to settle and agglomerate after long-term storage, making redispersion impossible. That's a big advantage.
ポリメチルシルセスキオキサンとしては、メチルトリア
ルコキシシランおよび/又はその加水分解縮合物をアン
モニア又はアミン類の水溶液中で加水分解縮合させ得ら
れたものが、塩素原子、アルカリ土類金属、アルカリ金
属などの不純物がほとんどなく、また球状で自由流動性
に優れており好ましい。ポリメチルシルセスキオキサン
の粒径は0.05〜100μ曙、好ましくは0.1〜2
0μ曽である。0.05μ鞘未満のものは製造しにくい
という欠点があり、100μlを越えると離型効果およ
び離型面の平滑性が損なわれ、本発明に必要な機能が得
られなくなる。Polymethylsilsesquioxane is obtained by hydrolyzing and condensing methyltrialkoxysilane and/or its hydrolyzed condensate in an aqueous solution of ammonia or amines. It is preferable because it has almost no impurities such as, is spherical, and has excellent free-flowing properties. The particle size of polymethylsilsesquioxane is 0.05 to 100μ, preferably 0.1 to 2
It is 0 μ so. If the sheath is less than 0.05 μl, it is difficult to manufacture, and if it exceeds 100 μl, the mold release effect and the smoothness of the mold release surface will be impaired, making it impossible to obtain the functions necessary for the present invention.
(B)の使用量は(A) 100重量部に対して5〜5
00重量部である。使用量が5重量部に満たないと離型
効果が少な(、かつベタツキが大きくなり、逆に使用量
が500重量部を越えると、組成物の作業性に乏しく、
また溶液型などにする場合も溶解しにくくなるからであ
る。The amount of (B) used is 5 to 5 per 100 parts by weight of (A).
00 parts by weight. If the amount used is less than 5 parts by weight, the mold release effect will be small (and stickiness will increase), and if the amount used exceeds 500 parts by weight, the composition will have poor workability.
This is also because when it is made into a solution type, it becomes difficult to dissolve.
本発明の組成物は、(A)成分と(B)成分のみでその
効果を発揮するが、さらに有機溶剤に溶解して溶液型に
してもよい。この場合の有機溶剤としては例えば、ガソ
リン、石油ベンジン、ミネラルスピリット、トルエン、
キシレン、トリクロロエチレン、四塩化炭素、塩化メチ
レン、アセトン等が挙げられる。Although the composition of the present invention exhibits its effects only with components (A) and (B), it may be further dissolved in an organic solvent to form a solution type. Examples of organic solvents in this case include gasoline, petroleum benzine, mineral spirits, toluene,
Examples include xylene, trichloroethylene, carbon tetrachloride, methylene chloride, and acetone.
また本発明組成物は上記必須成分以外に場合によりアエ
ロジル等のチクソトロピック剤、消泡剤、パラフィンワ
ックスやポリスチレン等の熱可塑性ポリマー等を含有し
ても差支えない。In addition to the above-mentioned essential components, the composition of the present invention may optionally contain a thixotropic agent such as Aerosil, an antifoaming agent, a thermoplastic polymer such as paraffin wax or polystyrene, and the like.
本発明の組成物は、(A)成分に(B)成分、必要に応
じて添加剤を、サンドミル、三本ロール、ボールミルな
どの装置を用いて分散させ、均一に混合する。また、必
要に応じて組成物を溶液型にする場合は、組成物と溶剤
とをドラム等の適切な装置で攪拌により均一になるよう
に混合してやればよい。The composition of the present invention is prepared by dispersing component (A), component (B), and optionally additives using a device such as a sand mill, three-roll mill, or ball mill, and mixing them uniformly. Moreover, when the composition is made into a solution type as required, the composition and the solvent may be uniformly mixed by stirring in an appropriate device such as a drum.
本発明の組成物は、金型に刷毛塗り、スプレー塗りなど
の任意の方法で塗布し、材料を流し込んで、加圧成形、
圧縮成形など必要に応じた方法での成形を行う際の離型
剤として用いる。The composition of the present invention is applied to a mold by any method such as brush coating or spray coating, and the material is poured into the mold, followed by pressure molding.
Used as a mold release agent when molding by compression molding or other methods as required.
〔発明の効果〕
本発明の組成物によれば、離型効果が太き(、ベトッキ
が少なく、かつ離型の持続性に優れた離型剤を提供でき
る。また、レジンおよび/またはR13SiO□単位と
SiO2単位から成るポリオルガノシロキサンを併用す
ることにより、さらに成型対象樹脂に対するシリコーン
オイルの移行の可能性により悪影響も少なくなる。従っ
て本発明の組成物は、ゴム、ポリウレタン等のプラスチ
ックの離型剤として、きわめて広い用途に用いることが
できる。[Effects of the Invention] According to the composition of the present invention, it is possible to provide a mold release agent with a strong mold release effect (less stickiness) and excellent long-lasting mold release. By using a polyorganosiloxane consisting of SiO2 units and SiO2 units, the possibility of migration of silicone oil to the resin to be molded reduces adverse effects.Therefore, the composition of the present invention can be used to release molds of plastics such as rubber and polyurethane. It can be used as an agent in a wide range of applications.
以下、調製例および実施例により本発明を説明する。尚
、以下簡略のため次の略号を用いる。The present invention will be explained below with reference to Preparation Examples and Examples. The following abbreviations will be used below for brevity.
〔略号) Me:C)l。[Abbreviation] Me:C)l.
M : Me3SiO,単位
D : MezSiO単位
T : MeSiO+、 s単位
Q:SiO□ 単位
実施例中「部」は全て重量部を示す。また、D単位とQ
単位から成るポリオルガノシロキサンを以下の略号で表
わす。M: Me3SiO, unit D: MezSiO unit T: MeSiO+, s unit Q: SiO□ unit All "parts" in the examples indicate parts by weight. Also, D unit and Q
Polyorganosiloxanes consisting of units are represented by the following abbreviations.
S−1:Q単位とM単位からなり、Q単位1モルニ対ス
るM単位の割合が0.65モルであって、水酸基がケイ
素原子に結合し
ている樹脂状共重合体の50%トルエン溶液。S-1: 50% toluene of a resinous copolymer consisting of Q units and M units, the ratio of M units to 1 mole of Q units is 0.65 moles, and the hydroxyl group is bonded to the silicon atom. solution.
S−2:Q単位とM単位からなり、Q単位1モルに対す
るM単位の割合が0.55モルであって、水酸基及びエ
トキシ基がケイ
素原子に結合している樹脂状共重合体
の50%トリエン溶液。S-2: 50% of a resinous copolymer consisting of Q units and M units, the ratio of M units to 1 mol of Q units is 0.55 mol, and hydroxyl groups and ethoxy groups are bonded to silicon atoms. Triene solution.
S5−3=単位、D単位、T単位およびQ単位から成り
、M:I):T:Q単位のモル比が30: 5 :55
:10である樹脂状共重合体の50%トルエン溶液。S5-3 = unit, consisting of D unit, T unit and Q unit, molar ratio of M:I):T:Q unit is 30: 5: 55
A 50% toluene solution of a resinous copolymer having: 10.
調製例1 (ポリメチルシルセスキオキサンの生成)温
度針、還流器及び攪拌機の付いた4つロフラスコに、水
500部と28%の濃度のアンモニア水溶液50部とを
仕込み、このアンモニア水溶液中に、第1表に示すメチ
ルトリメトキシシラン200部を、攪拌しながら約40
分かけて徐々に滴下した。反応温度は10℃からスター
トし、滴下終了時には30℃に達した。次にマントルヒ
ーターで加熱して84℃で還流させ、この温度で約1時
間攪拌を続けた。冷却後フラスコ内に析出した生成物を
捕集し、水洗して乾燥後粉砕工程を経て、第1表に示す
自由流動性に優れた粉末状のポリメチルシルセスキオキ
サン(P−1,P−2)が得られた。Preparation Example 1 (Production of polymethylsilsesquioxane) 500 parts of water and 50 parts of an ammonia aqueous solution with a concentration of 28% were charged into a four-bottle flask equipped with a temperature needle, a reflux device, and a stirrer. , 200 parts of methyltrimethoxysilane shown in Table 1 was added to about 40 parts of methyltrimethoxysilane while stirring.
It was gradually added dropwise over several minutes. The reaction temperature started at 10°C and reached 30°C at the end of the dropwise addition. Next, the mixture was heated with a mantle heater to reflux at 84°C, and stirring was continued at this temperature for about 1 hour. After cooling, the product precipitated in the flask is collected, washed with water, dried, and then pulverized to produce powdered polymethylsilsesquioxane (P-1, P -2) was obtained.
第 1 表 また、シリコーンオイルとして次の5種類を用意した。Chapter 1 Table In addition, the following five types of silicone oil were prepared.
F−に両末端がトリメチルシリル基で閉塞され、残りが
ジメチルシロキサン単位で
ある25℃の粘度が100cStのポリジメチルシロキ
サン。A polydimethylsiloxane having a viscosity of 100 cSt at 25°C, in which both ends of F- are blocked with trimethylsilyl groups, and the remainder are dimethylsiloxane units.
F−2:両末端がトリメチルシリル基で閉塞され、残り
がジメチルシロキサン単位で
ある25℃の粘度が2.000cStのポリジメチルシ
ロキサン。F-2: Polydimethylsiloxane having a viscosity of 2.000 cSt at 25°C, with both ends blocked with trimethylsilyl groups and the remainder being dimethylsiloxane units.
F−3:両末端がトリメチルシリル基で閉塞され、残り
がジメチルシロキサン単位で
ある25℃の粘度が30.000cStのポリジメチル
シロキサン。F-3: Polydimethylsiloxane having a viscosity of 30.000 cSt at 25°C, with both ends blocked with trimethylsilyl groups and the remainder being dimethylsiloxane units.
F−4:両末端がトリメチルシリル基で閉塞され、残り
の70モル%がジメチルシロキサン単位、30モル%が
ジフェニルシロキサン単位である25℃の粘度が500
cStのポリメチルフェニルシロキサン。F-4: Both ends are blocked with trimethylsilyl groups, the remaining 70 mol% is dimethylsiloxane units, 30 mol% is diphenylsiloxane units, and the viscosity at 25°C is 500
cSt polymethylphenylsiloxane.
F−5:両末端がトリメチルシリル基で閉塞され、残り
の60モル%がジメチルシロキサンjN(L40モル%
がβ−フェニルエチルメチルシロキサン単位である25
℃の粘度が1.800cStのポリオルガノシロキサン
。F-5: Both ends are blocked with trimethylsilyl groups, and the remaining 60 mol% is dimethylsiloxane jN (L40 mol%
is a β-phenylethylmethylsiloxane unit 25
Polyorganosiloxane with a viscosity of 1.800 cSt at °C.
実施例1
シリコーンオイルF−1〜F−4、樹脂状ポリシロキサ
ンS−1およびS−2、ポリメチルシルセスキオキサン
P−1およびP−2、さらにキシレンを第2表に示す配
合で均一に混合し、本発明の組成物A−11〜A−18
および比較例組成物B−11〜B−14を得た。なお、
B−11,8−14はポリジメチルシルセスキオキサン
の代わりにアエロジル200(煙霧質シリカ、日本シリ
カニ業■製)を用いた比較例、B−12は粉砕石英を用
いた比較例、B−13は粉末を含まぬ比較例である。Example 1 Silicone oils F-1 to F-4, resinous polysiloxanes S-1 and S-2, polymethylsilsesquioxanes P-1 and P-2, and xylene were uniformly mixed in the proportions shown in Table 2. Compositions A-11 to A-18 of the present invention
And comparative example compositions B-11 to B-14 were obtained. In addition,
B-11, 8-14 is a comparative example using Aerosil 200 (fumed silica, manufactured by Nippon Silikani Co., Ltd.) instead of polydimethylsilsesquioxane, B-12 is a comparative example using crushed quartz, B- No. 13 is a comparative example containing no powder.
これらの組成物を、輻4cm四方、深さ6mmの凹型ス
テンレス製金型にスプレー塗装で均一になるように塗布
した。次いでTP−132(ポリエステル樹脂、大日本
インキ■製)100部とパーメックN(効果剤、日本油
脂■製)1部を均一になるように混合し、このポリエス
テル樹脂を処理した凹部に流し込んで、25℃にて2時
間放置して硬化させた後に成形品を脱型した。この流し
込み、成形作業を5回繰り返し、その離型性、金型表面
の処理物のベタツキおよび2か月間溶液を500 +*
1のビンに詰めて保管した際の安定性について調べた。These compositions were uniformly applied by spray painting to a concave stainless steel mold with a diameter of 4 cm square and a depth of 6 mm. Next, 100 parts of TP-132 (polyester resin, manufactured by Dainippon Ink ■) and 1 part of Permec N (effect agent, manufactured by NOF ■) were mixed uniformly, and the polyester resin was poured into the treated recess. The molded article was removed from the mold after being left to stand at 25° C. for 2 hours to harden. This pouring and molding operation was repeated 5 times, and the mold releasability, stickiness of the treated product on the surface of the mold, and the solution were removed at 500 + * for 2 months.
The stability of this product was investigated when it was packed and stored in a bottle.
その結果を第2表に示す。The results are shown in Table 2.
本1 初期離型性は最初の成形品を外したときの状態に
よる。Book 1: Initial mold releasability depends on the condition when the first molded product is removed.
*2 離型性評価は、成形品および金型に異常なきもの
を◎、順次○、△とし、×は金型についてしまうものを
示す。*2 In the mold releasability evaluation, molded products and molds with no abnormalities are rated ◎, ○, and △ in order, and × indicates those that stick to the mold.
*3 ベタツキは、指触によるベタツキのないものを◎
とし、順次○、△とし、×はベタツキの大きいものであ
る。*3 For stickiness, make sure there is no stickiness when you touch it.
○, △ in order, and × indicates large stickiness.
本4 溶液の安定性は、振らないでも均一状態のものを
◎、軽く攪拌すれば均一になるものを○とし、かなり沈
降物を攪拌してようやく均一になるものを×、沈降物が
均一にならないで残るものを××とした。Book 4 The stability of a solution is ◎ if it is uniform even without shaking, ○ if it becomes uniform with gentle stirring, × if it becomes uniform after stirring the sediment considerably, and × if the sediment becomes uniform evenly. Items that remain without being changed are marked as XX.
実施例2
F−5,S−2,S−3,P−1および塩化メチレンを
第3表のように配合し、本発明の組成物A−21〜A−
24および比較例組成物B−21゜B−22を得た。な
お、B−21,8−22はポリメチルシルセスキオキサ
ンを用いぬ゛比較例である。Example 2 F-5, S-2, S-3, P-1 and methylene chloride were blended as shown in Table 3 to form compositions A-21 to A- of the present invention.
24 and Comparative Example Composition B-21°B-22 were obtained. Incidentally, B-21 and 8-22 are comparative examples in which polymethylsilsesquioxane was not used.
この組成物を実施例1の金型に同じ方法で塗布した。次
いでl?t145(2成分型ポリウレタン樹脂、国際ケ
ミカル■製)を主剤/硬化剤= 100/65重量部に
て均一になるように混合し、このポリウレタン樹脂を処
理した凹部に流し込んで、25℃にて1時間放置後に脱
型した。この流し込み、成形作業を10回繰り返し、離
型性の持続性を測定した。また、本発明の組成物A−2
1〜A−24を実施例1と同様の方法にて安定性を調べ
たが、いずれも軽(攪拌することですぐ均一な溶液状に
なった。This composition was applied to the mold of Example 1 in the same manner. Then l? t145 (two-component polyurethane resin, manufactured by Kokusai Chemical ■) was mixed uniformly at a ratio of base resin/curing agent = 100/65 parts by weight, poured into the treated recess, and heated at 25°C for 1 hour. After leaving it for a while, it was removed from the mold. This pouring and molding operation was repeated 10 times, and the sustainability of the mold releasability was measured. Moreover, composition A-2 of the present invention
The stability of Samples 1 to A-24 was examined in the same manner as in Example 1, and all of them were light (they quickly became a homogeneous solution upon stirring).
第 3 表Table 3
Claims (1)
ルセスキオキサン粉末5〜200重量部 から成ることを特徴とする離型用組成物。 2 (A)のポリオルガノシロキサン中、 HOR^1_2SiO_1_/_2単位またはR^1_
3SiO_1_/_2単位、R^2_2SiO単位、R
^2SiO_3_/_2単位およびSiO_2単位から
成り、(R^1+R^2)/Si=1.0〜1.7なる
ポリオルガノシロキサン、および/またはR^1_3S
iO_1_/_2単位とSiO_2単位より成り、R^
1_3SiO_1_/_2単位がSiO_2単位1モル
に対して0.4〜1.0モルであるポリオルガノシロキ
サン(ここでR^1、R^2は互いに同一または相異な
る1価の置換または非置換の炭化水素基を示す)が10
〜70重量%である特許請求の範囲第1項記載の離型用
組成物。 3 (A)のケイ素原子に結合する有機基の90モル%
以上がメチル基である特許請求の範囲第1項記載の離型
用組成物。 4 (A)の25℃における粘度が20cSt以上であ
る特許請求の範囲第1項記載の離型用組成物。 5 (B)のポリメチルシルセスキオキサン粉末が、メ
チルトリアルコキシシランおよび/またはその加水分解
縮合物をアンモニアまたはアミン類の水溶液中で加水分
解して得られたものである特許請求の範囲第1項記載の
離型用組成物。 6 (B)の平均粒子径が0.1〜20μmである特許
請求の範囲第5項記載の離型用組成物。[Scope of Claims] 1. A mold release product characterized by comprising (A) 100 parts by weight of polyorganosiloxane (B) 5 to 200 parts by weight of polymethylsilsesquioxane powder with an average particle size of 0.05 to 100 μm. Composition. 2 In the polyorganosiloxane (A), HOR^1_2SiO_1_/_2 units or R^1_
3SiO_1_/_2 units, R^2_2SiO units, R
Polyorganosiloxane consisting of ^2SiO_3_/_2 units and SiO_2 units, and (R^1+R^2)/Si = 1.0 to 1.7, and/or R^1_3S
Consists of iO_1_/_2 units and SiO_2 units, R^
Polyorganosiloxane in which 1_3SiO_1_/_2 units are 0.4 to 1.0 mol per 1 mol of SiO_2 units (here, R^1 and R^2 are monovalent substituted or unsubstituted carbonized compounds that are the same or different from each other) (representing a hydrogen group) is 10
70% by weight of the mold release composition according to claim 1. 3 90 mol% of the organic group bonded to the silicon atom of (A)
The mold release composition according to claim 1, wherein the above group is a methyl group. 4. The mold release composition according to claim 1, wherein (A) has a viscosity of 20 cSt or more at 25°C. 5. The polymethylsilsesquioxane powder (B) is obtained by hydrolyzing methyltrialkoxysilane and/or its hydrolyzed condensate in an aqueous solution of ammonia or amines. The mold release composition according to item 1. 6. The mold release composition according to claim 5, wherein (B) has an average particle diameter of 0.1 to 20 μm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16119586A JPS6317958A (en) | 1986-07-09 | 1986-07-09 | Mold-releasing composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16119586A JPS6317958A (en) | 1986-07-09 | 1986-07-09 | Mold-releasing composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6317958A true JPS6317958A (en) | 1988-01-25 |
JPH0312106B2 JPH0312106B2 (en) | 1991-02-19 |
Family
ID=15730390
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16119586A Granted JPS6317958A (en) | 1986-07-09 | 1986-07-09 | Mold-releasing composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6317958A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0280690A (en) * | 1988-06-22 | 1990-03-20 | Kanzaki Paper Mfg Co Ltd | Production of paper |
JPH0397996A (en) * | 1989-09-05 | 1991-04-23 | Sanyo Kokusaku Pulp Co Ltd | Neutral paper making method |
US5034476A (en) * | 1988-04-19 | 1991-07-23 | Toshiba Silicone Co., Ltd. | Surface-treated polyorganosilsesquioxane fine powder |
JP2009519849A (en) * | 2005-12-19 | 2009-05-21 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | Composition for preventing adhesion by coating a substrate |
-
1986
- 1986-07-09 JP JP16119586A patent/JPS6317958A/en active Granted
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5034476A (en) * | 1988-04-19 | 1991-07-23 | Toshiba Silicone Co., Ltd. | Surface-treated polyorganosilsesquioxane fine powder |
JPH0280690A (en) * | 1988-06-22 | 1990-03-20 | Kanzaki Paper Mfg Co Ltd | Production of paper |
JPH0397996A (en) * | 1989-09-05 | 1991-04-23 | Sanyo Kokusaku Pulp Co Ltd | Neutral paper making method |
JPH048558B2 (en) * | 1989-09-05 | 1992-02-17 | ||
JP2009519849A (en) * | 2005-12-19 | 2009-05-21 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | Composition for preventing adhesion by coating a substrate |
Also Published As
Publication number | Publication date |
---|---|
JPH0312106B2 (en) | 1991-02-19 |
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