JPS63178681U - - Google Patents
Info
- Publication number
- JPS63178681U JPS63178681U JP6998487U JP6998487U JPS63178681U JP S63178681 U JPS63178681 U JP S63178681U JP 6998487 U JP6998487 U JP 6998487U JP 6998487 U JP6998487 U JP 6998487U JP S63178681 U JPS63178681 U JP S63178681U
- Authority
- JP
- Japan
- Prior art keywords
- flow path
- valve
- valve seat
- biasing
- thermovalve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012530 fluid Substances 0.000 claims 2
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Temperature-Responsive Valves (AREA)
Description
第１図は本考案バルブ操作の側断面図、第２図
は弁体の側面図、第３図はその下面図、第４図は
動作説明図であつてイは低温時ロは高温時の状態
を示す図、第５図は本考案バルブ装置の適用例を
示す図である。
２…流路、３…弁座、５…弁体、６…付勢体、
７…制御体。
Figure 1 is a side sectional view of the valve operation of the present invention, Figure 2 is a side view of the valve body, Figure 3 is its bottom view, and Figure 4 is an explanatory diagram of the operation, where A is at low temperature and B is at high temperature. FIG. 5 is a diagram showing an example of application of the valve device of the present invention. 2...Flow path, 3...Valve seat, 5...Valve body, 6...Biasing body,
7...Control body.
Claims (1)
路２を流れる流体の温度変化により、前記流路２
を開閉するようにしたサーモバルブ装置であつて
、前記弁体５を前記弁座３から離間する側に付勢
する付勢体６と、前記流路２を流れる流体の温度
で形状変化して前記弁体５を前記付勢体６に抗し
て前記弁座３に着座させる形状記憶合金製の制御
体７とを設けたことを特徴とするサーモバルブ装
置。 A valve body 5 and a valve seat 3 are provided in the flow path 2, and the temperature change of the fluid flowing through the flow path 2 causes the flow path 2 to
The thermovalve device is configured to open and close, and includes a biasing body 6 that biases the valve body 5 away from the valve seat 3, and a biasing body 6 that changes shape depending on the temperature of the fluid flowing through the flow path 2. A thermovalve device comprising a control body 7 made of a shape memory alloy for seating the valve body 5 on the valve seat 3 against the biasing body 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6998487U JPS63178681U (en) | 1987-05-11 | 1987-05-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6998487U JPS63178681U (en) | 1987-05-11 | 1987-05-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63178681U true JPS63178681U (en) | 1988-11-18 |
Family
ID=30911203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6998487U Pending JPS63178681U (en) | 1987-05-11 | 1987-05-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63178681U (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54140712A (en) * | 1978-04-21 | 1979-11-01 | Yukio Yanagimoto | Sprayable scald treating drug |
| JPS5824692U (en) * | 1981-08-11 | 1983-02-16 | シャープ株式会社 | refrigerator door |
| JPS58187671A (en) * | 1982-04-27 | 1983-11-01 | Fuji Koki Seisakusho:Kk | Valve for adjusting evaporation pressure using configuration memory alloy |
| JPS6130777B2 (en) * | 1979-07-24 | 1986-07-16 | Nippon Denki Kk | |
| JPS6252380B2 (en) * | 1979-12-26 | 1987-11-05 | Daiichi Electric |
-
1987
- 1987-05-11 JP JP6998487U patent/JPS63178681U/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54140712A (en) * | 1978-04-21 | 1979-11-01 | Yukio Yanagimoto | Sprayable scald treating drug |
| JPS6130777B2 (en) * | 1979-07-24 | 1986-07-16 | Nippon Denki Kk | |
| JPS6252380B2 (en) * | 1979-12-26 | 1987-11-05 | Daiichi Electric | |
| JPS5824692U (en) * | 1981-08-11 | 1983-02-16 | シャープ株式会社 | refrigerator door |
| JPS58187671A (en) * | 1982-04-27 | 1983-11-01 | Fuji Koki Seisakusho:Kk | Valve for adjusting evaporation pressure using configuration memory alloy |
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