JPS63178345U - - Google Patents
Info
- Publication number
- JPS63178345U JPS63178345U JP7040487U JP7040487U JPS63178345U JP S63178345 U JPS63178345 U JP S63178345U JP 7040487 U JP7040487 U JP 7040487U JP 7040487 U JP7040487 U JP 7040487U JP S63178345 U JPS63178345 U JP S63178345U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- element support
- support lead
- lead
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
- 239000011810 insulating material Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7040487U JPS63178345U (US20110009641A1-20110113-C00185.png) | 1987-05-12 | 1987-05-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7040487U JPS63178345U (US20110009641A1-20110113-C00185.png) | 1987-05-12 | 1987-05-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63178345U true JPS63178345U (US20110009641A1-20110113-C00185.png) | 1988-11-18 |
Family
ID=30912008
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7040487U Pending JPS63178345U (US20110009641A1-20110113-C00185.png) | 1987-05-12 | 1987-05-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63178345U (US20110009641A1-20110113-C00185.png) |
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1987
- 1987-05-12 JP JP7040487U patent/JPS63178345U/ja active Pending