JPS63176576U - - Google Patents

Info

Publication number
JPS63176576U
JPS63176576U JP6804187U JP6804187U JPS63176576U JP S63176576 U JPS63176576 U JP S63176576U JP 6804187 U JP6804187 U JP 6804187U JP 6804187 U JP6804187 U JP 6804187U JP S63176576 U JPS63176576 U JP S63176576U
Authority
JP
Japan
Prior art keywords
high viscosity
groove
extrudes
viscosity substance
extrusion piston
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6804187U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0525736Y2 (OSRAM
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987068041U priority Critical patent/JPH0525736Y2/ja
Publication of JPS63176576U publication Critical patent/JPS63176576U/ja
Application granted granted Critical
Publication of JPH0525736Y2 publication Critical patent/JPH0525736Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
JP1987068041U 1987-05-07 1987-05-07 Expired - Lifetime JPH0525736Y2 (OSRAM)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987068041U JPH0525736Y2 (OSRAM) 1987-05-07 1987-05-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987068041U JPH0525736Y2 (OSRAM) 1987-05-07 1987-05-07

Publications (2)

Publication Number Publication Date
JPS63176576U true JPS63176576U (OSRAM) 1988-11-16
JPH0525736Y2 JPH0525736Y2 (OSRAM) 1993-06-29

Family

ID=30907497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987068041U Expired - Lifetime JPH0525736Y2 (OSRAM) 1987-05-07 1987-05-07

Country Status (1)

Country Link
JP (1) JPH0525736Y2 (OSRAM)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007253086A (ja) * 2006-03-24 2007-10-04 Kenwood Corp 温度調整式シリンジ
JP2009539607A (ja) * 2006-06-13 2009-11-19 ノードソン コーポレーション 液体吐出シリンジ
JP2017077556A (ja) * 2016-08-18 2017-04-27 加賀ワークス株式会社 粘性材料ディスペンサ用カートリッジ
JP2018047472A (ja) * 2018-01-10 2018-03-29 加賀ワークス株式会社 空圧ディスペンサ用カートリッジ
US10293361B2 (en) 2015-10-19 2019-05-21 Kaga Works Co., Ltd. Cartridge for viscous-material dispenser
JP2019171385A (ja) * 2019-07-06 2019-10-10 加賀ワークス株式会社 空圧ディスペンサ用カートリッジ
US10479587B2 (en) 2014-08-25 2019-11-19 Kaga Works Co., Ltd. Cartridge for viscous-material dispenser

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58165596U (ja) * 1982-04-28 1983-11-04 品川白煉瓦株式会社 亀裂補修装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58165596U (ja) * 1982-04-28 1983-11-04 品川白煉瓦株式会社 亀裂補修装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007253086A (ja) * 2006-03-24 2007-10-04 Kenwood Corp 温度調整式シリンジ
JP2009539607A (ja) * 2006-06-13 2009-11-19 ノードソン コーポレーション 液体吐出シリンジ
US10479587B2 (en) 2014-08-25 2019-11-19 Kaga Works Co., Ltd. Cartridge for viscous-material dispenser
US10293361B2 (en) 2015-10-19 2019-05-21 Kaga Works Co., Ltd. Cartridge for viscous-material dispenser
US10507487B2 (en) 2015-10-19 2019-12-17 Kaga Works Co., Ltd. Cartridge for viscous-material dispenser
JP2017077556A (ja) * 2016-08-18 2017-04-27 加賀ワークス株式会社 粘性材料ディスペンサ用カートリッジ
JP2018047472A (ja) * 2018-01-10 2018-03-29 加賀ワークス株式会社 空圧ディスペンサ用カートリッジ
JP2019171385A (ja) * 2019-07-06 2019-10-10 加賀ワークス株式会社 空圧ディスペンサ用カートリッジ

Also Published As

Publication number Publication date
JPH0525736Y2 (OSRAM) 1993-06-29

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