JPS63176575U - - Google Patents

Info

Publication number
JPS63176575U
JPS63176575U JP6804087U JP6804087U JPS63176575U JP S63176575 U JPS63176575 U JP S63176575U JP 6804087 U JP6804087 U JP 6804087U JP 6804087 U JP6804087 U JP 6804087U JP S63176575 U JPS63176575 U JP S63176575U
Authority
JP
Japan
Prior art keywords
filling container
highly viscous
viscous material
extrusion
inclination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6804087U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6804087U priority Critical patent/JPS63176575U/ja
Publication of JPS63176575U publication Critical patent/JPS63176575U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP6804087U 1987-05-07 1987-05-07 Pending JPS63176575U (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6804087U JPS63176575U (de) 1987-05-07 1987-05-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6804087U JPS63176575U (de) 1987-05-07 1987-05-07

Publications (1)

Publication Number Publication Date
JPS63176575U true JPS63176575U (de) 1988-11-16

Family

ID=30907495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6804087U Pending JPS63176575U (de) 1987-05-07 1987-05-07

Country Status (1)

Country Link
JP (1) JPS63176575U (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994008860A1 (en) * 1992-10-16 1994-04-28 Yoshino Kogyosho Co., Ltd. Refill container

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS605476B2 (ja) * 1975-07-14 1985-02-12 大日本印刷株式会社 立体模様の形成法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS605476B2 (ja) * 1975-07-14 1985-02-12 大日本印刷株式会社 立体模様の形成法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994008860A1 (en) * 1992-10-16 1994-04-28 Yoshino Kogyosho Co., Ltd. Refill container
US5609266A (en) * 1992-10-16 1997-03-11 Yoshino Kogyosho Co., Ltd. Refilling container having flexible shoulder portion movable between subsided and extended positions

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