JPS63173347A - Package for integrated circuit part - Google Patents

Abstract

PURPOSE:To use the title package for each application of a plurality of connection of the same specification and a large number of LSI connection, and to reduce the turbulence of a waveform by connecting a wire pad, a lead, a terminal resistor and a power supply by a pattern so that at least three kinds of circuits are constituted by cut ting one part of the pattern. CONSTITUTION:A terminal resistor 3 with a power supply 19 is mounted into a package body 11. These power supply and terminal resistor, a pad 14 and a lead 16 are connected by patterns 17, 18, 20, 21, and one parts of the patterns are shaped onto the surface of a package. When there is the terminal resistor proper to operation at high speed, the pattern 21 is cut. The connection of parts is used properly by pattern-cutting into the presence or absence of the terminal resistor on a plurality of connection of the same specification. An LSI at the final terminal of a signal wiring is pattern-cut in the presence of the terminal resistor. The section 18a of the pattern 18 is cut in midway LSI of the signal wiring. When a large number of LSIs are connected, one part 18a of the pattern 18 and one part 17a of the pattern 17 are cut.

Description

[Detailed Description of the Invention] [Summary] In the case of an integrated circuit component package, the package body is provided with a terminating resistor, a power supply or a ground pattern, and the connection pattern is provided so that it can be cut. Three ways of use are possible: when there is no terminal resistor and when the terminating resistor is used as a damping resistor.

[Industrial application field]

The present invention relates to a package for an integrated circuit component such as an LSI that operates at high speed (for example, an LSI having an ECL circuit), and specifically relates to a mounting structure for a termination resistor.

When high-speed LSIs are mounted on a board and signals are transmitted between the LSIs, it is common to provide a terminating resistor to eliminate reflections of transmitted waveforms.

[Conventional technology]

Therefore, there are various ideas regarding conventional LSIs and terminating resistors, and these will be described below.

First, the one in FIG. 4 is a case where a terminating resistor is provided inside the LSI, and the LSI packages 10a and 10b are mounted on the substrate l.
, 10c are implemented. LSI package 10b
, IOCs have the same specifications, and each has built-in termination resistors 3b and 3C, which are connected to the package 10a through signal wiring 2.

In the case shown in FIG. 5, a termination resistor is provided outside the LSI, and an LSI package 10a and LSI packages 10b and 10c having the same specifications are mounted on a substrate 1, and these are connected by a signal wiring 2.

Then, the terminating resistors 3 are mounted separately, and the package 1
It is connected to 0b and 10c.

Here, as shown in FIGS. 4 and 5, a method of connecting a plurality of LSI packages 10b, 10c with the same specifications to the same signal wiring 2 is one of the commonly used methods of using LSI. Please note that

FIG. 6 is a detailed diagram of the case where the terminating resistors are provided separately outside the LSI, and shows the LSI package 10 (100 in FIG. 5).
), a chip 12 is housed inside a package body 11, and this chip 12 is connected to a pad 14 by a wire 13.
The pad 14 is connected to the lead 16 by the in-package wiring 15. And lead 1
6 is soldered to the signal wiring 2 of the substrate 1, and the wiring 2 is connected to the package 10 and each termination resistor 3 (corresponding to 3 in FIG. 5) via the wiring 4.

The diagram in FIG. 7 is related to the above-mentioned diagram in FIG. 6, and is a case where the leads of the LSI and the wiring part of the package are made into microstrip lines, and the characteristic impedance thereof is made equal to that of the signal wiring of the board. Therefore, in the package 10, from the pad 14 to the microstrip line wiring 15a.
1 lead 16a to the signal wiring 2, and the other wiring 15b
, and are connected to the terminating resistor 3 via the lead 16b.

[Problem that the invention seeks to solve]

Here, in FIG. 4, each LSI package 10b,
Since the terminal resistors 3b and 3c are built into the signal line 10c, two or more resistors 3b and 3c are connected to one signal line 2, and the transmission waveforms of A and B are disturbed.

The one in Figure 5 is generally used when the signal is not very high speed, and is an LSI package 10b with the same specifications.
, 10C, there is one terminating resistor 3, so the waveforms of A and B are not disturbed. In addition, it is generally difficult to accurately create a resistor on an LSI chip that is the same as the characteristic impedance (usually 50 to 150Ω) of the signal wiring 2 on the board 1, and this resistor requires a relatively large space, which hinders high density. Therefore, it is advantageous in this respect as well. However, as described in FIG. 6, there is a problem that it is not suitable for increasing speed.

FIG. 6 is a detailed explanatory diagram of a case where the signal speed increases in FIG. 5 in which the termination resistor 3 is provided outside. As the circuit operates faster and the signal rise and fall times become smaller,
This may disrupt the transmission waveform and cause malfunction. this is,
Pattern 15 of package 10, lead 16, C
This is because C of the circuits of the chips 1 and 12 becomes a branch load, and the higher the signal speed, the more it affects the transmission waveform. In this respect, it is preferable to use a built-in termination resistor type that can reduce the influence of the adhesive and C on the package 10.

The one in Figure 7 is suitable for high speeds and has little disturbance in the transmission waveform, but it requires two leads 16a and L6b for one signal, which limits the number of LSI input/output signals and makes it difficult to increase density. It becomes a hindrance.

Thus, there has been a problem in that the placement of the termination resistor inside and outside has its own advantages and disadvantages depending on how the LSI package is used.

The present invention was created in view of the above points, and an object of the present invention is to provide an integrated circuit component package that is suitable for high-speed operation and multiple connections of the same specifications, and is capable of increasing density.

[Means for solving problems]

In order to achieve the above object, the present invention mounts a terminating resistor 3 equipped with a power source 19 inside a package body 11, as shown in FIGS. 1 and 2 corresponding to embodiments.

Then, the pad 14 and the lead 16 are connected to the pattern 17, the power supply 19 and the terminating resistor 3 are connected to the pattern 17 by the patterns 18 and 20, and the patterns 18 and 17 are connected to the pattern 21, and a part of this pattern is provided on the package surface. It is configured so that it can be cut.

[Effect]

Based on the above configuration, three types of circuits are available: one with a terminating resistor suitable for high-speed operation due to pattern force/node, one without a terminating resistor in case of multiple connections with the same specifications, and one with a terminating resistor 3 in series to be used as a damping resistor. Become selective.

Thus, the present invention can be used for high-speed operation, multiple connections with the same specifications, and connections to a large number of LSIs, thereby reducing waveform disturbances.

〔Example〕

Embodiments of the present invention will be described below based on the drawings.

In FIG. 1, to describe the principle of the present invention, reference numeral 10 is an LSI package, 11 is a package body, and 12 is an LSI package.
13 is a chip, 13 is a wire, 14 is a band, and 16 is a lead. Therefore, inside the package body 11, the pad 14 and the lead 16 are connected by a pattern 17, and a power supply (or ground) 19 is connected to the built-in terminating resistor 3 via a pattern 18. Furthermore, in order to connect the terminating resistor 3 directly and in parallel to the pattern 17, one end of the resistor 3 is connected to the pattern 17 through the pattern 20, and the other end of the pattern 18 is connected to the pattern 17 through the pattern 21. Some of these patterns can be cut to suit various uses.

Referring to FIG. 2, regarding the state of wiring such as patterns, an electric fi 19 is provided on the surface of the main body 11. Also,
Part 18a of pattern 1B from power supply 19, pattern 21, part 17a of pattern 17 parallel to terminating resistor 3
is provided on the surface and can be cut with a laser beam or the like.

Next, the operation of the package configured in this way will be described.

First, in the case of a terminal resistor suitable for high-speed operation, the pattern 21 is cut, thereby cutting the package body 1.
A terminating resistor 3 equipped with a power source 19 is connected to a pattern 17 to a lead 16 within the terminal 1 .

Therefore, compared to the case shown in Figure 6, the glue inside the package is
The influence of C is reduced, and waveform disturbances during high-speed operation are reduced.

In the case of multiple connections with the same specifications, use one with or without a terminating resistor depending on the pattern cut. The LSI at the final end of the signal wiring (corresponding to 10c in FIG. 4) is cut into a pattern with the above-mentioned terminating resistor. LS in the middle of signal wiring
I (corresponding to 10b in FIG. 4) is part 18 of pattern 18
By cutting the terminal a, it is as if the terminating resistor 3 were not provided, and the internal wiring is made up of only the pattern 17.

Therefore, as in the case of FIG. 5, it is possible to reduce waveform disturbance by connecting a plurality of devices with the same specifications.

When connecting a larger number of LSIs, by cutting off a portion 18a of the pattern 18 and a portion 17a of the pattern 17, the pad 14 is connected in series to the node 16 via the terminating resistor 3, and this resistor 3 acts as a damping resistor. act. Therefore, when a large number of LSIs are connected on the same signal wiring, the waveform attenuates smoothly as shown in FIG. 3, and reflection noise from the LSIs can be reduced.

In general, it can be used for three different purposes depending on the state of the pattern cut.

〔Effect of the invention〕

As described above, according to the present invention, the termination resistor 3 is mounted within the package, making it suitable for high-speed operation.

Pattern cutting eliminates the need for a terminating resistor 3, making it suitable for connecting multiple LSIs with the same specifications.

By using the terminating resistor 3 as a damping resistor, it is suitable for connecting a large number of LSIs.

Since the number of reads does not increase, high density is not hindered.

[Brief explanation of the drawing]

Fig. 1 is a principle diagram of an embodiment of the package of the present invention, Fig. 2 is a cutaway perspective view of a specific embodiment, Fig. 3 is an equivalent circuit and waveform diagram using a damping resistor, and Figs. FIG. 7 is a diagram showing a mounting state, an equivalent circuit, and waveforms of a conventional example. In Figures 1 and 2, 3 is the termination resistor, 11 is the package body, 14 is the pad, 16 is the lead, 19 is the power supply, 17, 18, 20, and 21 are the patterns, and 18a, 17a, and 21 are the cutting parts. be. 5'・Representative MJ + Q Product 8, A figure showing a sequence of subordinates. A゛ ρ M tree U country 1

Claims (1)

[Claims] A power supply (or ground) (
A terminating resistor (3) with a wire pad (14), a lead (16), and a terminating resistor (3) is mounted.
) and power supply (19) in the pattern (17, 18, 20, 2
According to 1), an integrated circuit component package that is connected to form at least three types of circuits by cutting a part of the package.