JPS63172144U - - Google Patents
Info
- Publication number
- JPS63172144U JPS63172144U JP1987064649U JP6464987U JPS63172144U JP S63172144 U JPS63172144 U JP S63172144U JP 1987064649 U JP1987064649 U JP 1987064649U JP 6464987 U JP6464987 U JP 6464987U JP S63172144 U JPS63172144 U JP S63172144U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit element
- nozzle
- cooling device
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 3
- 239000003507 refrigerant Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 210000003746 feather Anatomy 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987064649U JPS63172144U (US07413550-20080819-C00001.png) | 1987-04-28 | 1987-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987064649U JPS63172144U (US07413550-20080819-C00001.png) | 1987-04-28 | 1987-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63172144U true JPS63172144U (US07413550-20080819-C00001.png) | 1988-11-09 |
Family
ID=30900996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987064649U Pending JPS63172144U (US07413550-20080819-C00001.png) | 1987-04-28 | 1987-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63172144U (US07413550-20080819-C00001.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04320053A (ja) * | 1991-04-18 | 1992-11-10 | Nec Corp | 集積回路の冷却機構 |
| JPH0837261A (ja) * | 1994-07-25 | 1996-02-06 | Nec Corp | 半導体冷却装置 |
-
1987
- 1987-04-28 JP JP1987064649U patent/JPS63172144U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04320053A (ja) * | 1991-04-18 | 1992-11-10 | Nec Corp | 集積回路の冷却機構 |
| JPH0837261A (ja) * | 1994-07-25 | 1996-02-06 | Nec Corp | 半導体冷却装置 |
