JPS63172141U - - Google Patents
Info
- Publication number
- JPS63172141U JPS63172141U JP6500787U JP6500787U JPS63172141U JP S63172141 U JPS63172141 U JP S63172141U JP 6500787 U JP6500787 U JP 6500787U JP 6500787 U JP6500787 U JP 6500787U JP S63172141 U JPS63172141 U JP S63172141U
- Authority
- JP
- Japan
- Prior art keywords
- electrode part
- heat dissipation
- package
- mounting plate
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 claims description 3
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6500787U JPS63172141U (uk) | 1987-04-28 | 1987-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6500787U JPS63172141U (uk) | 1987-04-28 | 1987-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63172141U true JPS63172141U (uk) | 1988-11-09 |
Family
ID=30901687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6500787U Pending JPS63172141U (uk) | 1987-04-28 | 1987-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63172141U (uk) |
-
1987
- 1987-04-28 JP JP6500787U patent/JPS63172141U/ja active Pending