JPS63171714U - - Google Patents
Info
- Publication number
- JPS63171714U JPS63171714U JP6454587U JP6454587U JPS63171714U JP S63171714 U JPS63171714 U JP S63171714U JP 6454587 U JP6454587 U JP 6454587U JP 6454587 U JP6454587 U JP 6454587U JP S63171714 U JPS63171714 U JP S63171714U
- Authority
- JP
- Japan
- Prior art keywords
- diagonal line
- staples
- staple
- bundle
- stages
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Audible And Visible Signals (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6454587U JPS63171714U (enrdf_load_stackoverflow) | 1987-04-28 | 1987-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6454587U JPS63171714U (enrdf_load_stackoverflow) | 1987-04-28 | 1987-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63171714U true JPS63171714U (enrdf_load_stackoverflow) | 1988-11-08 |
Family
ID=30900798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6454587U Pending JPS63171714U (enrdf_load_stackoverflow) | 1987-04-28 | 1987-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63171714U (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7094618B2 (en) | 2000-08-25 | 2006-08-22 | Micron Technology, Inc. | Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape |
| US7169685B2 (en) | 2002-02-25 | 2007-01-30 | Micron Technology, Inc. | Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive |
| US7361862B2 (en) | 1998-12-21 | 2008-04-22 | Micron Technology, Inc. | Laser marking system for dice carried in trays and method of operation |
-
1987
- 1987-04-28 JP JP6454587U patent/JPS63171714U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7361862B2 (en) | 1998-12-21 | 2008-04-22 | Micron Technology, Inc. | Laser marking system for dice carried in trays and method of operation |
| US7094618B2 (en) | 2000-08-25 | 2006-08-22 | Micron Technology, Inc. | Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape |
| US7238543B2 (en) | 2000-08-25 | 2007-07-03 | Micron Technology, Inc. | Methods for marking a bare semiconductor die including applying a tape having energy-markable properties |
| US7169685B2 (en) | 2002-02-25 | 2007-01-30 | Micron Technology, Inc. | Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive |