JPS63170963U - - Google Patents
Info
- Publication number
- JPS63170963U JPS63170963U JP6389987U JP6389987U JPS63170963U JP S63170963 U JPS63170963 U JP S63170963U JP 6389987 U JP6389987 U JP 6389987U JP 6389987 U JP6389987 U JP 6389987U JP S63170963 U JPS63170963 U JP S63170963U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- tip
- semiconductor device
- pair
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 239000008188 pellet Substances 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6389987U JPS63170963U (en, 2012) | 1987-04-27 | 1987-04-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6389987U JPS63170963U (en, 2012) | 1987-04-27 | 1987-04-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63170963U true JPS63170963U (en, 2012) | 1988-11-07 |
Family
ID=30899556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6389987U Pending JPS63170963U (en, 2012) | 1987-04-27 | 1987-04-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63170963U (en, 2012) |
-
1987
- 1987-04-27 JP JP6389987U patent/JPS63170963U/ja active Pending